Cutting processing of resin (plastic) for electronic devices
We support the design and manufacturing of electronic device enclosures.
In the electronics industry, the miniaturization, lightweighting, and high functionality of products are advancing, and high precision and compatibility with various materials are required for enclosures. It is important to provide optimal solutions from the design stage of the enclosure to material selection and processing methods. Resin (plastic) cutting processing is an effective means to meet these needs. Our company offers various processing technologies and materials to achieve the quality and cost performance that our customers require. 【Usage Scenarios】 - Electronic device enclosures - Various covers - Internal components 【Benefits of Implementation】 - Increased design flexibility - Improved product performance through lightweighting - Enhanced assembly due to high dimensional accuracy
- Company:第一商工
- Price:Other