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Netron sputtering equipment Product List and Ranking from 16 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Netron sputtering equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 真空デバイス 本社 Ibaraki//Pharmaceuticals and Biotechnology
  2. 日立ハイテク Tokyo//Industrial Machinery
  3. コメット Ibaraki//Other manufacturing
  4. 4 北野精機 Tokyo//Manufacturing and processing contract
  5. 5 ユニオン Gunma//Industrial Electrical Equipment
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Netron sputtering equipment Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Multi-film deposition device for development: "PVD for R&D" 日立ハイテク
  2. Magnetron Sputtering Device MSP-1S 真空デバイス 本社
  3. Combinatorial Magnetron Sputtering System CMS-3200 コメット
  4. 4 Magnetron sputtering device for high-precision optical filter film deposition ティー・ケイ・エス
  5. 4 Magnetron sputtering ユニオン

Netron sputtering equipment Product List

16～30 item / All 32 items

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Hybrid hard film coating device (DLC-CVD + PVD device)

Hybrid hard film coating device (DLC-CVD + PVD device)

Composite coating device for CVD-DLC and hard film PVD. Smooth surface PVD film + high-rate DLC. Hardness + tribological thin film.

A high-density sputter cathode ADM system (arc discharge type magnetron sputtering cathode) has been added to the well-established PIG-type DLC coating equipment for automotive DLC films. A hard alloy film is laminated onto the DLC film, which has excellent tribological properties, achieving a new hard coating with a smooth surface. The conventional DLC film has also been enhanced with the new cathode's functions, improving performance. Adhesion and resistance to surface pressure can be easily improved. Of course, the conventional PIG-type DLC coating equipment can be upgraded with additional functions. The latest model of the new functional hard film coating equipment can fully demonstrate the performance of CVD/PVD alone.

  • Plasma surface treatment equipment
  • Other processing machines
  • Other machine tools

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Semi-automatic grinding device for steel samples SAB-2-200

Semi-automatic grinding device for steel samples SAB-2-200

Semi-automatic belt grinding device for steel sample optical emission spectroscopy (OES) pre-treatment SAB-2-200

This is a semi-automatic belt grinding machine designed for various steel samples. By simply placing the sample in the designated position and pressing the start button, it performs a complete cycle of automatic operation. It is a safe device that does not require the operator to touch the machine while it is in operation. The sample moves back and forth in a direction perpendicular to the belt rotation for grinding, and by utilizing not only the center of the belt but also both ends, it contributes to reducing running costs. Since the sample holding pressure and the number of sample reciprocations can be set arbitrarily, it is possible to change the conditions based on the material of the sample and the state of the belt.

  • Other machine tools
  • Spectroscopic Analysis Equipment
  • X-ray fluorescence analyzer

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Magnetron Sputtering Device 'scia Magna 200'

Magnetron Sputtering Device 'scia Magna 200'

Maximum 200mm diameter substrate! Double ring magnetron (Fraunhofer FEP)

The "scia Magna 200" is a magnetron sputtering device with a rotating single magnetron. Applications include temperature compensation films (SiO2) for TC-SAW, piezoelectric films such as AlN, high and low refractive index films for optics, and insulating films (Si3N4, SiO2, Al2O3). Additionally, the process is magnetron sputtering. Please feel free to consult us when needed. 【Features】 ■ Maximum substrate diameter of 200mm ■ Rotating single magnetron (maximum diameter of 300mm) ■ Confocal 4 magnetron ■ Double ring magnetron (Fraunhofer FEP) *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Sample transport device

Sample transport device

Sample transport device

This product, the Sample Carrying System (KSC-1000), is a transport device that also serves as a sample introduction chamber. It allows for the transportation of samples while maintaining ultra-high vacuum conditions between multiple vacuum systems, making future expansion or addition of vacuum systems easy. Additionally, it comes standard with a six-slot sample transport carrier, making it ideal as a sample stocker, and the included heating mechanism enables cleaning of the sample surface.

  • Analytical Equipment and Devices
  • Other laboratory equipment and containers

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Sputter Source "Ultra High Vacuum Compatible Magnetron RF Sputter Source"

Sputter Source "Ultra High Vacuum Compatible Magnetron RF Sputter Source"

It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.

The "Ultra High Vacuum Compatible Magnetron RF Sputter Source" is a general-purpose compact magnetron sputter source compatible with ultra high vacuum. Since the entire body is bakeable, it enables film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra high vacuum - Baking up to 300°C is possible by removing the magnet - Target fixation is done with a retainer, allowing for quick target replacement - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.

  • others

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Sputter Source "Ultra High Vacuum Compatible Magnetron Sputter Source"

Sputter Source "Ultra High Vacuum Compatible Magnetron Sputter Source"

By removing the magnet, baking up to 300°C is possible.

This sputter source is a general-purpose compact magnetron sputter source compatible with ultra-high vacuum. Since the entire body is bakeable, it allows for film deposition with minimal impurities even with highly reactive targets. 【Features】 - Ultra-high vacuum type without O-rings - The magnet can be removed while maintaining the sputter source in ultra-high vacuum - Baking up to 300°C is possible by removing the magnet - The target is fixed with a retainer, allowing for quick replacement of the target - The gas inlet is integrated with the mounting flange, so a separate flange for gas introduction is unnecessary For more details, please contact us or download the catalog.

  • Vacuum Equipment

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【nanoPVD-S10A】Magnetron Sputtering Device

【nanoPVD-S10A】Magnetron Sputtering Device

High-performance, cost-effective RF/DC magnetron sputtering system for research and development.

High-Performance RF/DC Magnetron Sputtering Equipment ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in the fastest 30 minutes!) ● Sputter cathodes x 3: Automatic continuous multilayer film, simultaneous deposition from 2 sources ● Film uniformity ±3% ● Various options: Substrate rotation and elevation, substrate heating (Max 500℃), cathodes for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: Up to Φ4 inch ◉ 2" cathodes x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ APC automatic pressure control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + N2, O2 expandable up to 3 systems ◉ USB port for connection to Windows PC, allowing the creation and storage of recipes for up to 1000 layers and 50 films. Data logging on PC ◉ Other various options available

  • Sputtering Equipment
  • Evaporation Equipment
  • Other semiconductor manufacturing equipment

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Magnetron Sputtering Device MSP-20MT

Magnetron Sputtering Device MSP-20MT

The target is a 4-inch size that can coat large samples as they are.

The Magnetron Sputtering Device MSP-20MT is a coating device for applying conductive treatment to electron microscope samples. It uses a magnetron target to minimize sample damage. It is designed for a 4-inch target size and can process large samples or multiple samples at once. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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Magnetron sputtering device MSP-8 inch

Magnetron sputtering device MSP-8 inch

Equipped with a large-area sample stage compatible with 8-inch wafers.

The Magnetron Sputtering Device MSP-8 Inch features a magnetron target electrode and is equipped with a large-area sample stage compatible with 8-inch wafers. The variation in coating thickness is within 10%, effectively utilizing the entire stage area. Coating is done at a voltage of 500V or lower to reduce damage from ion impact. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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HPC-20 Fully Automatic Osmium Coater

HPC-20 Fully Automatic Osmium Coater

High functionality and low price! Equipped with a touch panel full-auto coating feature, all performance has been powered up!

A new type of osmium coater for pre-treatment for electron microscope observation. We have fully automated parts that were previously difficult to operate manually. This represents a new dimension of osmium coating that allows for safer and easier operations. Equipped with a touch panel, it enables simple and clear operation. Anyone can easily create conductive films for electron microscopes. Additionally, we offer a variety of options to enhance safety and functionality. This device has been meticulously designed, yet we have achieved an astonishingly low price. If you are interested in osmium coating or have concerns about operation, please consider our osmium coater. We are also accepting requests for test coating and demonstrations at any time.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator

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Magnetron Sputtering Device MSP-40T

Magnetron Sputtering Device MSP-40T

Multipurpose, fully automatic film deposition device for experimental use. Magnetron sputtering device MSP-40T type.

The Magnetron Sputtering Device MSP-40T is a multipurpose, multi-metal, experimental ion sputtering deposition system. It features an electrode-separated sample stage to avoid sample damage, efficient deposition with high-speed exhaust and simple operation, and offers good cost performance at a low price. As a successor to the MSP-30T, it has been upgraded with full auto-coating, a touch panel, and recipe functions. For more details, please contact us or refer to the catalog.

  • Other FA equipment

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Automatic sample stage unit 'TP-TRM-1'

Automatic sample stage unit 'TP-TRM-1'

Continuous measurement is possible without opening the sample cover! Automatic sample stage unit.

The "TP-TRM-1" is an automatic sample stage unit that can be mounted on the terahertz spectrometer "TeraProspector." By attaching six samples to the sample mounting plate installed on the stage, continuous measurement of samples can be performed without opening the sample cover. This reduces the number of times the sample cover needs to be opened, improving measurement efficiency and minimizing the influx of water vapor. Additionally, we also offer the reflective automatic sample stage unit "TP-RFL-1." 【Features】 ■ Attach six samples to the plate (One location is used for reference measurement. The number of samples can be changed as an option.) ■ Continuous measurement of samples can be performed without opening the sample cover ■ Improves measurement efficiency and minimizes the influx of water vapor *For more details, please refer to the PDF document or feel free to contact us.

  • Spectroscopic Analysis Equipment
  • Testing Equipment and Devices

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Magnetron sputtering

Magnetron sputtering

It is a device for applying a conductive film treatment to samples for electron microscopy.

The "Magnetron Sputtering Device" utilizes the principle of using a powerful magnet behind the target to promote ionization at the cathode surface layer, and by applying an electric field, it causes ions to collide with the target, releasing metal molecules. This device, manufactured by Vacuum Device Co., Ltd., is characterized by extremely low damage to samples. Additionally, we offer a variety of sputtering target types, sample sizes, and prices to meet our customers' needs. Please feel free to contact us with your requests. 【Product Lineup】 ■MSP-mini ■MSP-1S ■MSP-20-UM ■MSP-20-MT ■MSP-20-TK, etc. *For more details, please download the PDF or feel free to contact us.

  • Other electric meters

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Combinatorial Magnetron Sputtering System CMS-3200

Combinatorial Magnetron Sputtering System CMS-3200

A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.

The "CMS-3200" is a three-component combinatorial magnetron sputtering device that supports binary and ternary combinatorial composition gradient film deposition. The effective area is an equilateral triangle with a side length of 25mm. It is designed to use 2-inch wafers as standard substrates, allowing for integration into post-processing steps such as patterning and etching, enabling high throughput not only for film deposition but also for analysis. 【Features】 ■ Supports binary and ternary combinatorial composition gradient film deposition ■ Effective film deposition area: equilateral triangle with a side length of 25mm ■ Equipped with three 2-inch magnetron sputter cathodes ■ Can accommodate up to six RF and DC power supplies in three sets ■ Recipe editing and fully automated combinatorial film deposition using LabView *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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