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Netron sputtering equipment Product List and Ranking from 16 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

Netron sputtering equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

  1. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  2. 真空デバイス 本社 Ibaraki//Pharmaceuticals and Biotechnology
  3. ハルツォク・ジャパン Tokyo//Testing, Analysis and Measurement
  4. 4 ティー・ケイ・エス Tokyo//Industrial Machinery
  5. 5 神港精機 東京支店 Tokyo//Industrial Machinery
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Netron sputtering equipment Product ranking

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

  1. Sputtering device 'nanoPVD-S10A' テルモセラ・ジャパン 本社
  2. Magnetron Sputtering Device MSP-1S 真空デバイス 本社
  3. Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
  4. 4 Magnetron sputtering device for high-precision optical filter film deposition ティー・ケイ・エス
  5. 5 Heating Sample Stage Unit 'TP-HEA-1' 日邦プレシジョン

Netron sputtering equipment Product List

31～35 item / All 35 items

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Magnetron sputtering

Magnetron sputtering

It is a device for applying a conductive film treatment to samples for electron microscopy.

The "Magnetron Sputtering Device" utilizes the principle of using a powerful magnet behind the target to promote ionization at the cathode surface layer, and by applying an electric field, it causes ions to collide with the target, releasing metal molecules. This device, manufactured by Vacuum Device Co., Ltd., is characterized by extremely low damage to samples. Additionally, we offer a variety of sputtering target types, sample sizes, and prices to meet our customers' needs. Please feel free to contact us with your requests. 【Product Lineup】 ■MSP-mini ■MSP-1S ■MSP-20-UM ■MSP-20-MT ■MSP-20-TK, etc. *For more details, please download the PDF or feel free to contact us.

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Combinatorial Magnetron Sputtering System CMS-3200

Combinatorial Magnetron Sputtering System CMS-3200

A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.

The "CMS-3200" is a three-component combinatorial magnetron sputtering device that supports binary and ternary combinatorial composition gradient film deposition. The effective area is an equilateral triangle with a side length of 25mm. It is designed to use 2-inch wafers as standard substrates, allowing for integration into post-processing steps such as patterning and etching, enabling high throughput not only for film deposition but also for analysis. 【Features】 ■ Supports binary and ternary combinatorial composition gradient film deposition ■ Effective film deposition area: equilateral triangle with a side length of 25mm ■ Equipped with three 2-inch magnetron sputter cathodes ■ Can accommodate up to six RF and DC power supplies in three sets ■ Recipe editing and fully automated combinatorial film deposition using LabView *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Netron sputtering equipment

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Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Easy discharge operation! Compact design with automatic matching for RF power supply.

The "FRS-HG Series" is a multi-source simultaneous magnetron sputtering device equipped with dual-source/three-source simultaneous sputtering capabilities for research and development. Despite being a fixed type, it features a compact and stylish design. There are three film source introduction ports available, allowing for the installation of film sources that can synergize with sputtering, such as sputtering cathodes and arc plasma deposition sources. 【Features】 - Compact and stylish design despite being a fixed type - Auto-matching is employed for the RF power supply, making discharge operation easy - Simultaneous film deposition with two or three sources allows for fine-tuning of thin film functions and performance *For more details, please refer to the PDF materials or feel free to contact us.

  • Sputtering Equipment
  • Netron sputtering equipment

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Sputter Source "Ultra High Vacuum Compatible Magnetron DC Sputter Source"

Sputter Source "Ultra High Vacuum Compatible Magnetron DC Sputter Source"

It is possible to remove the magnet while maintaining the spatter source in ultra-high vacuum.

This sputter source is a general-purpose compact magnetron sputter source compatible with ultra-high vacuum. Since the entire body is bakeable, it allows for film formation with minimal impurities even with highly reactive targets. 【Features】 - Ultra-high vacuum type that does not use O-rings - The magnet can be removed while maintaining the sputter source in ultra-high vacuum - Baking up to 300°C is possible by removing the magnet - The target is fixed with a retainer, allowing for quick replacement of the target - The gas inlet is integrated with the mounting flange, eliminating the need for a separate flange for gas introduction For more details, please contact us or download the catalog.

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Sputtering device 'nanoPVD-S10A'

Sputtering device 'nanoPVD-S10A'

High-performance, cost-effective RF/DC magnetron sputtering device for research and development.

High-performance RF/DC magnetron sputtering system ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in as fast as 30 minutes!) ● Sputter sources x 3: Continuous multilayer film control, simultaneous film deposition ● Film uniformity ±3% ● Various options: Up/down rotation, heater, cathode for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, and more 【Main Features】 ◉ Compatible substrates: 2" (1 to 3 sources) or 4" (1 source) ◉ 2" cathode x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + up to 3 additional systems for N2, O2 ◉ Connect to a Windows PC via USB port to create and save recipes for up to 1000 layers and 50 films. Data logging on PC. ◉ Other various options available.

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