Bonding substrate
Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!
Our company is capable of providing custom-designed printed circuit boards (PCBs) that meet your specific requirements, thanks to our special three-layer substrates and the bonding structures of materials and copper foils. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or other materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and individual product implementations. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or other materials *For more details, please refer to the PDF document or feel free to contact us.
- Company:三和電子サーキット
- Price:Other