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Polishing Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Polishing Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アイエムティー Wakayama//Testing, Analysis and Measurement
  2. null/null
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 スリーエフ技研 Osaka//Manufacturing and processing contract
  5. 5 ハルツォク・ジャパン Tokyo//Testing, Analysis and Measurement
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Polishing Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Sample Grinding Tool - Tsukamerukun アイエムティー
  2. Octo Plate with Gel for Adhesion of Abrasive Paper アイエムティー
  3. Alumina grinding paper アイエムティー
  4. Colloidal silica polishing material for silicon wafers 'GLANZOX' フジミインコーポレーテッド
  5. 4 "Alumina Grinding Paper" for sample polishing 'Waterproof Grinding Paper' ☆ Free samples available ☆ ハルツォク・ジャパン

Polishing Product List

106～120 item / All 249 items

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Si (silicon) wafer polishing process

Si (silicon) wafer polishing process

Polishing processes are available in various sizes and thicknesses.

Regarding SOI wafers, the transition to larger diameters (12"φ) is steadily progressing, and currently, the latest technologies that cannot be achieved with smaller diameters are being developed with these materials. However, the subsequent processes (device processes) are limited to smaller diameters (8"φ or less), which means that the latest technologies available in large-diameter materials cannot be utilized. Japan Exceed is constantly striving to improve technology to meet these needs and has established a production system based on mass production. Additionally, size reduction of SOI wafers is also possible. 【Processing Details】 ■ Material Names: Various diameter Si wafers, SOI wafers, single crystal and polycrystalline silicon component materials (electrodes for dry etching equipment, focus rings, etc.) ■ Compatible Sizes - Φ12.5mm to Φ200mm - 3mm×3mm to 156mm×156mm - Rectangular shapes are also supported - Finished Thickness: 25μm and above - Flatness: TTV 1μm or less - Particles: 20 or fewer at 0.2μm - Surface Roughness: 0.3nm or less - Film Thickness Control: Possible *For more details, please download the materials or contact us.

  • Wafer
  • diode
  • Contract manufacturing

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Processed Material: Metal Material

Processed Material: Metal Material

Technology applied with optical polishing techniques! It is used in various fields such as gas-related equipment.

Nihon Exceed conducts precision grinding and cleaning of metal materials and more. We perform prototype processing using optical grinding technology, which is utilized in various fields such as vacuum devices and gas-related equipment. Additionally, we challenge ourselves to grind all types of materials, including magnetic materials, superconducting materials, and new materials. 【Features】 ■ Technology applying optical grinding techniques ■ Engaged in prototype processing ■ Used in various fields such as vacuum devices *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Technical materials being presented! Introduction to wafer polishing process and processing materials & technologies.

Technical materials being presented! Introduction to wafer polishing process and processing materials & technologies.

Introducing technology that handles the polishing of over hundreds of types of semiconductor materials! We are showcasing the polishing processes, cleaning, and processing techniques for various wafers with photos and analysis examples!

This document introduces the polishing processes, cleaning, and processing technologies for various wafers from Japan Exceed, using photographs and analysis examples. Through years of experience in polishing processing and repeated unique research and development, we have achieved high-level technical capabilities in handling various materials known as single crystals, and we have now become a provider of polishing for over several hundred types of semiconductor materials. We include the polishing process of the polishing processing, special Si processing using thinning technology, and processing materials. Our company responds to the polishing needs of various processing materials. 【List of Processing Materials】 ■ Oxide materials: LiTaO3 (LT), LiNbO3 (LN), ZnO, quartz, sapphire, regenerated sapphire, etc. ■ Compound materials: GaN, SiC, GaP, GaAs, GaSb, ZnS, ZnTe, etc. ■ Metal materials: SUS, Au, Ag, Cu, W, Ti, Al, etc. ■ Others: Ge, C, MnZn ferrite, TeO2, resin materials, etc. 【Contents Included (Excerpt)】 ■ Polishing processing process (representative examples) ■ Introduction to the polishing process ■ Introduction to the cleaning process ■ Special Si processing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Wafer
  • Other metal materials

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[Solution Case] Development of Tungsten Lures and Materials

[Solution Case] Development of Tungsten Lures and Materials

Development and manufacturing of tungsten and tungsten heavy alloy lures and weights!

Tungsten materials are overwhelmingly used in industrial fields such as lamps and medical applications. However, they are also attractive materials for general consumers in hobbies and amusement. Our company manufactures products for our original brand, Heavy Source, as well as OEM production for other manufacturers. Whether for our own products or for those of other companies, we pride ourselves on being able to provide a one-stop service from design to mass production. *For more details, please refer to the external link page or feel free to contact us.

  • Other machine elements

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Non-woven fabric pad "Suba(TM)"

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Other abrasives
  • Wafer processing/polishing equipment
  • Hand polishing and filing

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Grinding process (slimming) "Light Etching"

Grinding process (slimming) "Light Etching"

Processing is possible at the micron level! You can trust us even for products with constraints on glass thickness.

"Light etching" is a process that involves chemically polishing the surface of glass by a few microns to several tens of microns in order to enhance its strength. When glass is machined, it often develops tiny, invisible scratches known as "microcracks" on its surface, which can lead to a decrease in strength and cause breakage. This technology allows for the removal of microcracks by slightly chemically polishing the glass, thereby improving its strength. [Features] - Increased glass strength - Can be combined with machining - Can enhance strength when performed after mechanical polishing - Makes the glass less prone to breakage when done before strengthening treatment - Compatible with both batch and sheet processing (mass production equipment available) *For more details, please refer to the PDF document or feel free to contact us.

  • Company：NSC
  • Price：Other
  • Surface treatment contract service
  • Processing Contract

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Hygiene inspection kit

Hygiene inspection kit

Quick and easy! A hygiene test kit that anyone can use!

We offer hygiene testing kits that can be used for ATP testing, general rapid microbial testing, and tests for E. coli and coliforms. The "General Rapid Microbial Testing Kit" allows for screening results in just 7 hours, compared to the usual 48 hours required for cultivation. Additionally, we have a lineup of other testing reagents available. Please feel free to contact us if you have any requests. 【Features】 ■ For cleanliness testing in food manufacturing sites and equipment ■ ATP testing kits used among the top class worldwide ■ Can be judged by "anyone" and "easily" ■ HACCP/AOAC certified products *For more details, please download the PDF or feel free to contact us.

  • Other safety and hygiene products

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Technical Introduction: "Polishing and Re-polishing"

Technical Introduction: "Polishing and Re-polishing"

Regrinding of various industries is possible at our own factory!

At Fuji Saw Manufacturing Co., Ltd., we can also sharpen special blades such as break saws, finger blades, molded replacement blades, centrifugal replacement blades, and diamond blades, in addition to standard cutting tools. We will pick up within our service area. For areas outside of this, we can accommodate via shipping or drop-off. Please feel free to contact us with your requests. 【Sharpening Equipment】 ■ Formar CHC ■ Tokai Heat Treatment TN-7 ■ Toyo Blades KVG45 ■ Tokai Heat Treatment TN-30 ■ Surface Grinding, etc. *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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Product Processing: Polishing

Product Processing: Polishing

It is possible to accommodate beautiful glossy hairline polishing up to a width of 300mm!

Aiko Steel Co., Ltd. responds to our customers' manufacturing and processing issues and improvements by providing suitable materials for each manufacturing process, as well as proposing processing methods that help reduce costs and streamline processes. Our company can accommodate hairline polishing processing up to 300mm in width. For polishing processing of products, please leave it to us. 【Features】 ■ Hairline polishing processing ■ Accommodates up to 300mm in width *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Processing Contract

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[Information] Product Description Materials for the Grinding Processing Department

[Information] Product Description Materials for the Grinding Processing Department

We use our own polishing machine to meet our customers' needs!

In the polishing processing department of Tokyo Special Glass, we are working to expand productivity and respond to market needs by using small to large double-sided and single-sided polishing machines, striving for quantity assurance and quality stabilization. This document includes the request details and product specifications from the polishing processing department for your reference. Please feel free to download and utilize it. [Contents] ■ Introduction image of the polishing processing department ■ Request details and product specifications ■ Features and points of innovation ■ Synthetic quartz substrate (aerial view) *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Processing Contract

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Case study of cost reduction in metal processing through surface finish relaxation.

Case study of cost reduction in metal processing through surface finish relaxation.

By alleviating the surface finishing, the man-hours for polishing processes have been reduced, achieving cost reduction!

Convex-shaped machine parts often have instructions for grinder finishing on many surfaces. Since grinding is generally done manually, having many grinding instructions can lead to increased processing time for polishing, which is a factor in cost escalation. It is important to limit grinder finishing to necessary areas for practical use. If there are no issues with usage, by limiting the surfaces that require grinder finishing, the labor hours for polishing can be reduced, leading to cost savings. [Case Study] ■ Content: Cost reduction in metal processing through relaxation of surface finishing ■ Challenge: Excessive polishing processing time leads to increased costs ■ Proposal: Limit the surfaces that require grinder finishing ■ Applications: Cost reduction, cutting processing, machining, lathe work, precision processing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Grinding process

Grinding process

Buff polishing of the inner surface of pipes is also possible! With our unique polishing machine and years of experience, we can appropriately respond to niche needs.

Our company primarily handles three types of physical polishing: buff polishing, barrel polishing, and hairline processing. With our in-house solvent degreasing system, we can quickly and completely remove buff residue. We basically adopt a manual polishing method, accommodating everything from small items to large ones, as well as polishing somewhat complex shapes. If you have any concerns such as "I want to remove the marks left after milling" or "I need to differentiate the buff polishing," please do not hesitate to consult with us. 【Features】 ■ Equipped with solvent degreasing for a clean finish ■ Buff polishing of pipe interiors is also possible ■ Capable of handling both small and large items, with short delivery times available ■ Our unique polishing machines and years of experience allow us to appropriately meet niche needs ■ Hairline processing using semi-automatic machines ■ Skilled artisans shining through from tool selection to execution *For more details, please refer to the PDF document or feel free to contact us.

  • Surface treatment contract service
  • Other surface treatment equipment
  • Wafer processing/polishing equipment

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Abrasives for oxide-based substrates "CHEMISTER CL Series"

Abrasives for oxide-based substrates "CHEMISTER CL Series"

We provide custom-made polishing agents suitable for our customers!

Our "CHEMISTER CL Series" is a polishing agent developed for oxide-based substrates, achieving high polishing rates and surface quality. It targets materials such as lithium tantalate (LiTaO3), which is used for substrates in SAW devices, as well as lithium niobate (LiNbO3), sapphire, zinc oxide, and garnet. 【Features】 - A polishing agent with colloidal silica as the abrasive for mirror polishing. - Achieves high polishing rates and surface quality for difficult-to-process materials such as lithium tantalate (LiTaO3) and sapphire. - Provides customized polishing agents to meet customer needs and requests. *Please feel free to contact us for more details.

  • Other abrasives

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Introduction to a reliable inspection system that guarantees high quality.

Introduction to a reliable inspection system that guarantees high quality.

We conduct strict inspections for each process to ensure the quality of the shipped panels!

At You-I Engine, we have established a thorough system for ensuring the quality of our shipping panels. We conduct strict inspections at each stage of the process to ensure the quality of the shipping panels. The measuring instruments, tools, and jigs used in inspections are always maintained for accuracy. In particular, we regularly take measuring instruments to designated inspection agencies such as the National Institute of Advanced Industrial Science and Technology, the National Metrology Institute of Japan, and the Japan Electric Measuring Instruments Inspection Institute for inspections to ensure measurement accuracy. *For more details, please download the catalog or contact us.*

  • Other process controls

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Non-ferrous metal materials

Non-ferrous metal materials

We offer a wide variety of non-ferrous metals that hold infinite possibilities.

Our company handles non-ferrous metals, which serve as a driving force to dramatically enhance the performance and functionality of products across various fields. With "interest & idea" as our keywords, we are not a traditional trading company that simply buys and sells; instead, we develop consulting sales from the perspective of total management of metal materials. As a future-oriented comprehensive technology trading company, we respond to our customers' needs with infinite curiosity and provide solutions by adding original ideas to non-ferrous metals, engaging in "business that transcends the boundaries of trading companies." 【Products We Handle】 ■ Tin ■ Lead ■ Zinc ■ Copper ■ Aluminum, etc. *For more details, please download the PDF or feel free to contact us.

  • Non-ferrous metals

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