We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Polyimide Resin.
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Polyimide Resin Product List and Ranking from 13 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Polyimide Resin Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 三菱ガス化学株式会社　グリーン・エネルギー＆ケミカル事業部門 Tokyo//Chemical
  2. 石原ケミカル 高機能材料 Tokyo//Resin/Plastic
  3. ナラサキ産業 メカトロソリューション部　機能材料課 Tokyo//Manufacturing and processing contract
  4. 4 Ｉ.Ｓ.Ｔ Shiga//Resin/Plastic
  5. 4 名古屋化学工業所 Aichi//Other manufacturing
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Polyimide Resin Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Thermoplastic polyimide resin "Saprime" 三菱ガス化学株式会社　グリーン・エネルギー＆ケミカル事業部門
  2. Thermoplastic polyimide resin "Saprime Powder" 三菱ガス化学株式会社　グリーン・エネルギー＆ケミカル事業部門
  3. DuPont's all-aromatic polyimide resin "Bespel" heat resistance temperature 288°C 石原ケミカル 高機能材料
  4. 4 Recycled polyimide resin "Polyimide Powder" マルワ 本社
  5. 4 Introduction to 【High Heat Resistance】 PI Resin SCM8000 ナラサキ産業 メカトロソリューション部　機能材料課

Polyimide Resin Product List

16～30 item / All 42 items

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Besper(R)

Besper(R)

Besper(R)

Bespel® is a high-heat-resistant plastic (fully aromatic polyimide resin) developed by DuPont. It has the best heat resistance and wear resistance among engineering plastics and is used in a wide range of applications, including mechanical and electrical components. 【Features】 1. Excellent heat resistance. It can be used continuously at 288°C and intermittently at 480°C. 2. Excellent wear resistance. The limit PV value is more than 10 times that of general plastics. 3. Excellent creep resistance. Creep at 260°C and 18.2MPa is only 0.6% after 1000 hours. 4. Excellent electrical properties. Insulation strength is 22KV/mm. 5. Additionally, it excels in plasma resistance, radiation resistance, gas release resistance (under vacuum), and chemical resistance.

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DuPont™ Bespoke® SP-1 for solving vacuum process problems.

DuPont™ Bespoke® SP-1 for solving vacuum process problems.

100% polyimide. It has excellent strength, heat resistance, and electrical properties.

If the materials for processing are in stock, same-day shipping is possible. The size chart is available on our website. Please take a look.

  • Engineering Plastics

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Thermoplastic polyimide resin "Saprime Powder"

Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Surprim Sliding Grade TS Series"

Thermoplastic polyimide resin "Surprim Sliding Grade TS Series"

The Suprem Sliding Grade "TS2400W" achieves higher strength, elasticity, lower wear, and a lower dynamic friction coefficient than the PEEK sliding grade!

The Suprem TS series is a sliding grade for injection molding that uses Suprem as the base resin. The carbon fiber and whisker reinforced grades "TS2400W" and "TS2401W" have higher strength and elasticity than PEEK. 【Features】 ■ Low wear and low friction coefficient - In particular, "TS2400W" has lower wear and a lower dynamic friction coefficient than PEEK sliding grades. ■ Good stability of dynamic friction coefficient - Stable dynamic friction coefficient at 23°C and 120°C. ■ Good sliding properties even at high temperatures - "TS2400W" and "TS2401W" exhibit excellent sliding properties even at high temperatures (120°C). ■ Good flowability during molding - Easy to mold thin-walled and small molded products. *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide Therplim

Thermoplastic polyimide Therplim

Polyimide resin that has both moldability and heat resistance.

"Therplim" shows a well-balanced glass transition point (Tg185 ℃) and melting point (Tm323 ℃) compared to super engineering plastics such as PEEK. A crystalline TPI that maintains a high Tg while lowering its melting point. We can provide powder and pellets. 【Features】 ・Crystalline resin ・high strength ・high heat resistance ・high solvent resistance ・low dielectric constant ・easy molding processing ・Insoluble in solvent ※For details, please see the PDF document or feel free to contact us.

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Thermoplastic Polyimide Resin "Therplim"

Thermoplastic Polyimide Resin "Therplim"

Thermoplastic polyimide resin with unprecedented moldability and heat resistance.

Compared to super engineering plastics like PEEK and PEKK, "Therplim" has a well-balanced glass transition temperature (Tg185℃) and melting point (Tm323℃), featuring high strength, high heat resistance, high solvent resistance, and low dielectric constant. It is a thermoplastic polyimide resin that possesses characteristics of (10GHz 2.66) and is easy to mold. It is a crystalline TPI that maintains a high glass transition temperature while lowering its melting point, with a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications that utilize its properties. [Features] ■ Crystalline thermoplastic polyimide (granules, powders) ■ High heat resistance and high strength ■ Easy moldability ■ Reflow resistance ■ Low dielectric properties and high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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Polyimide Therplim Low Friction Grade

Polyimide Therplim Low Friction Grade

Suitable for complex-shaped components and high-performance molded parts! High fluidity allows for high fiber filling.

Introducing our crystalline thermoplastic polyimide "Therplim Low Friction Grade." It is suitable for applications requiring a high Tg (185°C) and serves as an alternative to super engineering plastics like PEEK. * For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).

Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.

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SKYBOND <Heat-resistant FRP Polyimide Varnish>

SKYBOND <Heat-resistant FRP Polyimide Varnish>

Heat-resistant composite materials / heat-resistant adhesive "Skybond"

Skybond is a varnish based on the most thermally stable aromatic polyimide. It was developed by Monsanto in the United States, and I.S.T acquired the manufacturing and sales rights in April 1996, producing it at the Monsanto Indian Orchard plant in Massachusetts. However, in 2014, the plant was relocated, and it is now produced at the I.S.T New Jersey plant. Skybond can form extremely excellent polyimide prepregs and honeycombs with high thermal resistance and flexibility by combining with high-strength heat-resistant fibers such as glass fibers, carbon fibers, and aramid fibers. It can also be used as a heat-resistant adhesive and sealant. Its applications are mainly in the aerospace field, used in aircraft structural materials, jet engine covers, and wing components. Additionally, taking advantage of its excellent heat resistance, it is used as insulation covers for structures and engines that operate at high temperatures. Heat-resistant bearings and bushes utilizing powder molding properties are also used in a wide range of fields, including office automation equipment. The resin's exceptionally high thermal stability, mechanical and electrical properties, and high reliability are backed by years of proven performance, and its applications continue to expand into aircraft and industrial equipment.

  • Engineering Plastics

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EXTEM XH series for optical products related to 5G.

EXTEM XH series for optical products related to 5G.

Attention is also drawn to the ability to handle complex lens shapes and high productivity.

The EXTEM XH series developed by SABIC has been increasingly used in optical communication transceiver lenses and optical sensor receiving lenses, which are gaining attention in recent years for applications such as 5G. For the same applications, the company's ULTEM RESIN products (such as ULTEM 1010 and ULTEM DT1810EV) have been widely adopted by many customers and components around the world, but they were not compatible with lead-free soldering processes. This material, which is compatible with that process, is attracting attention for its ability to accommodate complex lens shapes and its high productivity compared to glass and thermosetting resin lenses. Additionally, it has gained recognition as a high-heat-resistant optical thermoplastic resin that was first registered in the Zemax OpticsStudio material database in March 2019, providing designers of optical sensors and lenses with a new groundbreaking material option beyond glass and epoxy resins. [Application Examples] Adopted for infrared sensor lenses used in proximity sensors and gesture recognition in electronic products such as smartphones and gaming consoles. For inquiries and material requests, please visit this site: https://sjpn1971.plabase.com/

  • Engineering Plastics

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SABIC ULTEM and EXTEM

SABIC ULTEM and EXTEM

Value in die-cast parts and stock shape materials

Did you know that Highheat ULTEM and EXTEM powders can be used as additives for optimizing the manufacturing processes of thermoplastic polyimide (TPI) stock shape products (rods, sheets) as well as die-cast components such as connectors, seal rings, screws, and bearings? Our powders help optimize viscosity, reduce curing time, and minimize product defects such as bubbles. They are also inherently compatible with TPI. Go to our dianhydrides and imides webpage: https://lnkd.in/gtGGF8X For inquiries and requests for materials, please visit this site: https://sjpn1971.plabase.com/

  • Engineering Plastics

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SCM6R00 PI (Polyimide) Resin Introduction Molding Body Parts Processing

SCM6R00 PI (Polyimide) Resin Introduction Molding Body Parts Processing

Purely made in Japan PI (polyimide) resin. We propose a stable supply of PI components!

Polyimide (PI) natural grade material compressed and molded using the PBI method for machining applications. It possesses excellent heat resistance, mechanical strength, electrical insulation, and chemical resistance, making it ideal for use in harsh environments. It is utilized in a wide range of fields, including aerospace, automotive, and electronic components.

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Fundamentals and Applications of Micronization of Polyimide Resin with Heat Resistance and Weather Resistance

Fundamentals and Applications of Micronization of Polyimide Resin with Heat Resistance and Weather Resistance

Is there a technology that can micronize high heat-resistant polyimide? I will teach you a method to mass-produce uniform polyimide microparticles with consistent particle size.

Speaker Dr. Takayuki Ishizaka, Researcher, Compact Chemical Systems Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Target Audience: Engineers, researchers, and beginners interested in polymer microparticles and polyimide technology Venue: Tekno Kawasaki, 4th Floor Exhibition Hall [Kanagawa, Kawasaki City] 5-minute walk from Tokyu Mizonokuchi Station East Exit or JR Musashi-Mizonokuchi Station Date and Time: October 26, 2011 (Wednesday) 13:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 participants from one company *Limited to Tech-Zone members who apply by October 12. Membership registration is free. *After October 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company. ◆If 3 participants from the same organization apply, the fee will be 69,300 yen.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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