![[Substrate-less double-sided tape] OCA punching processing](https://image.mono.ipros.com/public/product/image/3cd/2000303675/IPROS8000974288528316759.PNG?w=280&h=280)
[Substrate-less double-sided tape] OCA punching processing
Press punching and bubble-free processing of substrate-free double-sided tape, such as OCA, which is difficult to process and highly transparent.
The adhesive used for the display portion of mobile phones and smartphones directly affects the display's performance, and therefore it is required to be: - Optically uniform and transparent - Free from adhesive failures such as peeling or bubbling - Dimensionally stable under various usage environments Materials that meet these requirements include sheet-like substrate-free adhesive tape (OCA) and liquid UV-curable resin (OCR). OCA has advantages such as excellent processability and uniform film thickness, ensuring a consistent thickness and no overflow from the application area. However, if the punching process is poor, it can lead to issues such as OCA overflowing from the edges or the separator peeling at the ends, resulting in poor adhesion. Additionally, during the punching process with a press machine, issues like wrinkling of the OCA or linear bubbles may occur. However, based on our extensive experience in processing various functional materials, we can minimize such defects and achieve precise shape processing. Our company has numerous achievements in shape processing materials that could not be handled by conventional press manufacturers, thanks to our unique blade condition setting and analysis technology. If you are having trouble with the processing of films or resins, please feel free to contact us.
- Company：オーティス
- Price：Other
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