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Sheet metal processing products×東開製作所 - List of Manufacturers, Suppliers, Companies and Products

Sheet metal processing products Product List

31~45 item / All 47 items

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Precision sheet metal processing products

Semiconductor device components

This is a precision sheet metal processing product made from aluminum material (A5052P) with a thickness of 1.5mm. The main process starts with punching, followed by pre-processing and bending. After forming is completed, anodizing treatment is performed, followed by stud installation, silk screening, and final inspection. This product is used as a back plate for semiconductor equipment and requires high processing precision and tolerance dimensions. The production time, including anodizing treatment and silk screening, is estimated to be 2 to 3 days.

  • Other semiconductors

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Precision sheet metal processing products

Commercial operation box

This is a precision sheet metal processing product made from SPCC with a thickness of 1.2mm and 0.8mm. The main process starts with punching, followed by pre-processing, bending, and welding. After forming is completed, the product undergoes painting, silk screening, and final inspection in that order. As this product is a precision sheet metal product, it requires high processing accuracy and tolerance dimensions. The production time, including painting and silk screening, is approximately 4 days.

  • Touch Panel

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Precision sheet metal processing products

Semiconductor device case

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, bending, and welding. Four types of parts are bent individually using a bender and then joined by welding. After shaping is completed, painting is carried out, followed by final inspection. As this product is a precision sheet metal product, it requires high processing accuracy and tolerance dimensions. The production time, including painting, is approximately 2 to 4 days.

  • Other semiconductors

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Sheet metal processing products

Commercial cover

This is a sheet metal processing product made from SPCC with thicknesses of 1.0mm and 2.0mm. The main process starts with punching, followed by pre-processing, bending, and welding. The base 1.0mm sheet is bent, and four components are welded to the back side. A 2.0mm component is welded to the surface, followed by degreasing and painting in black. The production time, including painting, is approximately 3 to 5 days based on a lot size of 1 to 50.

  • furniture

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Precision sheet metal processing products

Semiconductor device

This is a semiconductor device made from A5052P (aluminum material) with a thickness of 1.0mm and 1.5mm. The product in the photo is assembled from nine individually manufactured aluminum parts. The parts undergo processes of cutting, pre-processing, and bending, followed by anodizing treatment.

  • Other semiconductor manufacturing equipment

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Precision sheet metal processing products

Semiconductor device case

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is complete, trivalent chromate plating is performed, followed by final inspection. This product is used as a case for semiconductor equipment. The production time, including painting, is approximately 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Semiconductor device stage

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is completed, trivalent chromate plating is performed, followed by final inspection. This product is used as a bracket for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Semiconductor device wiring board

This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes are punching, pre-processing, bending, and anodizing in that order. This product is used as a wiring board for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.

  • Other semiconductor manufacturing equipment

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Precision sheet metal processing products

Semiconductor device panel

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, and bending in that order. After forming, trivalent chromate plating and silk printing are performed, followed by final inspection. This product is used as a panel for semiconductor equipment. The production time, including plating treatment and silk printing, is approximately 3 to 4 days for a batch of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Semiconductor device base

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, chromate plating is performed, studs are attached, and final inspection takes place. This product is used as a base for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Semiconductor device partition plate

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.6mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, trivalent chromate plating is performed, studs are inserted, and final inspection takes place. This product is used as a partition plate for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Semiconductor device base

This is a precision sheet metal processing product made from SUS430 (hairline material) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, stud welding, bending, and silk screening in that order. This product is used as a base for semiconductor equipment. The production time, including silk screening, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Semiconductor device middle plate

This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes are punching, pre-processing, bending, and anodizing in that order. This product is used as a middle plate in semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Wind pressure device wire mesh

This is a precision sheet metal processing product made from SGC with a thickness of 0.8mm. This product is used as a wire mesh for a wind pressure device. The production time is approximately 1 to 2 days based on a standard lot of 100.

  • Wind Speed/Volume Meter

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Precision sheet metal processing products

Semiconductor device side panel

This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes include punching, pre-processing, bending, anodizing, and stud welding in that order. This product is used as a side panel for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.

  • Other semiconductor manufacturing equipment

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