Semiconductor device panel
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, and bending in that order. After forming, trivalent chromate plating and silk printing are performed, followed by final inspection. This product is used as a panel for semiconductor equipment. The production time, including plating treatment and silk printing, is approximately 3 to 4 days for a batch of 100 units.
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basic information
Material: SPCC / t=1.2 Dimensions: 180 × 195 Process: Precision sheet metal processing, plating, silk printing Application: Semiconductor device panel
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Applications/Examples of results
This product is used as a panel for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation