Aluminum-Ceramics Substrate Automatic Ultrasonic Testing Device
Rapid inspection of bonding defects and voids in aluminum ceramic substrates for power device components!
The "Aluminum-Ceramics Substrate Automatic Ultrasonic Testing Device" is a device designed to quickly inspect for bonding defects and voids in aluminum-ceramics substrates, which are components of power devices. The workpieces set in the cassette are transferred to a water tank for testing both interfaces. Once the testing is complete, defective areas are marked, and the pieces are sorted into OK/NG categories before being discharged into the output cassette. 【Specifications】 ■ Line Specification: Offline Automatic ■ Detection Performance: Voids of 0.2 mm or larger ■ Processing Capacity: Approximately 30 seconds per piece *For more details, please refer to the PDF document or feel free to contact us.
- 企業:ダイヤ電子応用
- 価格:Other