Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.
1～9 item / All 9 items
Major renovations can also shorten the time required.
The unitization of the framework allows for significant modifications such as equipment configuration to be completed in a shorter time.
It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneously, edge scrubbing and cleaning are also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Wafer types to be cleaned: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transportation, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
