It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Wafer types to be cleaned: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
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For more details, please contact us or download and view the catalog.
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Various wafer cleaning
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At Technical Fit Co., Ltd., we propose various cleaning devices, particle and spacer dispersion devices, static electricity removal devices, and inspection devices tailored to our customers' needs and budgets. Please feel free to consult us regardless of the industry, including LCD, semiconductors, automotive, food, and medical fields.
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