テクニカルフィット Product Lineup

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for areas with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can all be done in one place ■ Target wafers: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneously, edge scrubbing and cleaning are also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Wafer types to be cleaned: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transportation, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Supports transparent wafers as well *For more details, please contact us or download the catalog to view.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, followed by chemical spray, megasonic spot shower, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edge as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameter: φ2” to φ4”, thickness negotiable ■ Supports transparent wafers *For more details, please contact us or download the catalog for more information.

• Other cleaning machines
• Ultrasonic Cleaner
• Other semiconductor manufacturing equipment

A single-wafer device that performs processes from various wafer surfactants, pure water scrub cleaning, chemical spraying, megasonic spot showering, to spin drying all in one chamber. ◇ Space-saving type that completes processes in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexibly accommodates changes in cleaning items and equipment configuration *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer dispersion process in liquid crystal panel manufacturing, capable of handling nanoparticles as well. The control of the scattering amount is achieved through feedback control based on the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle dispersion in all directions without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. It accommodates applications from research and development with sizes around 100 to 200 mm square to mass production equipment such as G6 size. (We can also propose and manufacture inline devices that combine cluster cleaners, inspection devices, etc.) It is also capable of scattering larger particle spacers of 20 to 30 μm, as well as processes for dimming glass and smart glass. Please feel free to consult us regarding particle procurement and other inquiries. *For more details, please contact us.*

• LCD display
• Touch Panel
• Powder Supply Device

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. The control of the scattering amount is performed based on feedback control using the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle scattering in all directions by simply switching the air without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This is a tabletop scattering machine designed for research and development and prototyping, compatible with workpiece sizes ranging from approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production equipment for inline use, accommodating large glass sizes such as 1500mm×1500mm.) *For more details, please contact us.*

• LCD display
• Touch Panel
• Powder Supply Device

This is a dispersion and spraying device for particles that has developed a dry spraying technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. The control of the spraying amount is performed through feedback control based on the amount of charge during spraying. A fixed multiplexer nozzle is used, allowing for uniform particle dispersion in all directions by simply switching the air without moving the nozzle. Additionally, by applying a high voltage to the wall surface, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This is a tabletop spraying machine suitable for workpiece sizes ranging from approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production equipment for inline applications, accommodating larger glass sizes such as 1500mm×1500mm.) *For more details, please contact us.

• LCD display
• Touch Panel
• Powder Supply Device

A cleaning nozzle unit that requires less water and is less likely to form a water film, which can be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination of control units. Conventional continuous spraying applies pressure over a self-created water film, which tends to increase cleaning power = increase pressure = increase flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which means that even at the same pressure (impact), the flow rate is lower, making it less likely to form a water film, and the sprayed water directly impacts the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects for removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects (such as narrow grooves and complex shapes) like cassettes. The pump unit achieves stable water pressure control with minimal waste water during pressure adjustment by performing feedback control that matches flow rate changes due to nozzle opening and closing. *Please consult us regarding spraying a fixed amount of liquid and measurement + spray application. *Nozzles and pumps require regular maintenance.

• Other cleaning machines
• Food Cleaning Equipment
• High pressure cleaner

A cleaning nozzle unit that requires less water and is less likely to form a water film, which can also be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination of control units. Conventional continuous spraying applies pressure over a self-created water film, which tends to increase cleaning power = increase pressure = increase flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which means that even at the same pressure (impact), the flow rate is lower, making it less likely to form a water film, and the sprayed water directly impacts the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects for removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and complex shapes). The pump unit achieves stable water pressure control with minimal waste water during pressure adjustments by performing feedback control that matches flow rate changes due to nozzle opening and closing. *Please consult us regarding spraying a constant amount of liquid and measurement + spray application. *Nozzles and pumps require regular maintenance.

• Other cleaning machines
• Food Cleaning Equipment
• High pressure cleaner

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a cleaning device that performs cleaning of various FOSBs using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download the catalog to view it.*

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning adapted to complex shapes such as hoops ■ Automation of the cleaning process ensures stable cleaning effectiveness *For more details, please contact us or download the catalog to view.

• Other semiconductor manufacturing equipment
• Other cleaning machines
• Ultrasonic Cleaner