Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc., 2 to 6 inches)
A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Supports transparent wafers as well *For more details, please contact us or download the catalog to view.
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【Purpose】 Various wafer cleaning
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At Technical Fit Co., Ltd., we propose various cleaning devices, particle and spacer dispersion devices, static electricity removal devices, and inspection devices tailored to our customers' needs and budgets. Please feel free to consult us regardless of the industry, including LCD, semiconductors, automotive, food, and medical fields.