A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a combination of cleaning methods.
A single-wafer device that performs processes from various wafer surfactants, pure water scrub cleaning, chemical spraying, megasonic spot showering, to spin drying all in one chamber. ◇ Space-saving type that completes processes in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexibly accommodates changes in cleaning items and equipment configuration *For more details, please contact us or download the catalog to view.
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basic information
< Cleaning Process > - Surfactant and pure scrub cleaning - Chemical solution spray - Megasonic spot shower - Spin drying < Cleaning Targets > Various wafers - Si (Silicon) - Quartz - Oxides - Compounds, etc. < Compatible Wafer Diameters > - φ2” to φ4” - φ6” to φ8” < Others > We can accommodate single-function scrub cleaning devices, use of chemical solutions, types with dry/wet loaders and unloaders, and multiple chamber types according to your budget and requirements. Please feel free to consult us regarding cleaning methods.
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【Purpose】 ■Various wafer cleaning
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Company information
At Technical Fit Co., Ltd., we propose various cleaning devices, particle and spacer dispersion devices, static electricity removal devices, and inspection devices tailored to our customers' needs and budgets. Please feel free to consult us regardless of the industry, including LCD, semiconductors, automotive, food, and medical fields.