It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneously, edge scrubbing and cleaning are also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.
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【Purpose】 Various wafer cleaning
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At Technical Fit Co., Ltd., we propose various cleaning devices, particle and spacer dispersion devices, static electricity removal devices, and inspection devices tailored to our customers' needs and budgets. Please feel free to consult us regardless of the industry, including LCD, semiconductors, automotive, food, and medical fields.