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Flexible Printed Circuit Board(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
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Flexible Printed Circuit Board Product List

31～45 item / All 45 items

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Flexible printed circuit board (FPC). Bendable!

Flexible printed circuit board (FPC). Bendable!

Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.

The product is a flexible printed circuit board that can be bent. It is compact, thin, and lightweight, allowing for a reduction in connections with connectors that can be integrated into small spaces. It can be used in digital cameras, laptops, smartphones, printers, and other small devices. We provide a detailed introduction to the manufacturing process in the PDF document, so please download and take a look. 【Features】 ■ Flexible and bendable ■ Reduces connections with connectors that can be integrated into small spaces ■ Compact, thin, and lightweight *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Flexible Printed Circuit Board

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Flexible Printed Circuit Board

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[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -

[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -

Announcement of the "Kii Space HUB" feature and participation in "Ecosystem Link #44".

~ Taiyo TechnoRex Accelerates Its Efforts in the Space Industry ~ An interview article introducing our company's challenges in the space sector has been published on the official website of "Kii Space HUB," a space industry support project promoted by Wakayama Prefecture. ▼ https://kii-space-hub.jp/reports/action-workshop-vol1.html The article summarizes our efforts to apply the FPC technology we have cultivated over many years to the space business, as well as our learnings from entering the field and future prospects. Additionally, on February 24, 2026, our employee Akihiro Moriwaki will present on the potential of FPC for satellites at the event "Ecosystem Link #44 presented by It’s Sta." ▼ https://u-fino.com/event/list/detail/000503.html This event will be held as a gathering place for diverse players in the space industry. Our company will continue to promote the application of technology and business expansion in the space industry.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • cable
  • Flexible Printed Circuit Board

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Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Ground slit MSL structure flexible printed circuit board

Ground slit MSL structure flexible printed circuit board

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • High frequency/microwave parts
  • Wiring materials
  • Flexible Printed Circuit Board

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Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts
  • Flexible Printed Circuit Board

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High Current Flexible Circuit Board [*FPC Technology Catalog Available]

High Current Flexible Circuit Board [*FPC Technology Catalog Available]

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Printed Circuit Board
  • Flexible Printed Circuit Board

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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Are you facing any issues with flexible substrates? We have extensive experience in various fields, including medical devices and automotive control systems.

This is an introduction to our "Flexible Circuit Board Manufacturing." "Flexible Printed Circuit Boards" are used in applications such as communication devices and measurement instruments, and we handle various types including "Single-Sided FPC," "Double-Sided FPC," and "Rigid-Flex." Materials used include polyimide and polyester. For "Multilayer Flex" and "Rigid-Flex," we collaborate with partner companies for production. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi 【Product Achievements (Excerpt)】 ■ Flexible for ultrasound diagnostic probes ■ Flexible for motor field winding (for high electromagnetic field generation) ・Source: Gunma University ■ Flexible for superconducting devices operating at -269℃ (for superconducting circuit evaluation) ・Main Source: Yokohama National University *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • Flexible Printed Circuit Board

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Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025

【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025

Wakayama's manufacturing opens up the future of space!

【Dates】November 5 (Wed) - 7 (Fri), 2025, 10:00 AM - 5:00 PM 【Venue】Port Messe Nagoya, Hall 1 (Nagoya Port, Kinjo Pier) Special Exhibition: Space Approach EXPO We will be exhibiting at the Wakayama Prefecture booth, No. 40. With our long-standing experience, we strongly support the space industry modules with our FPC small-lot production technology.

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  • Printed Circuit Board
  • High frequency/microwave parts
  • Flexible Printed Circuit Board

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It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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[Research Material] World Market for Single-Sided FPC Coverlays

[Research Material] World Market for Single-Sided FPC Coverlays

Global Market for Single-Sided FPC Coverlays: Yellow Coverlays, Black Coverlays, Consumer Mobile Devices, Medical, Industrial, Avionics...

This research report (Global Single Sided FPC Coverlay Market) investigates and analyzes the current state and outlook for the global single-sided FPC coverlay market over the next five years. It includes information on the overview of the global single-sided FPC coverlay market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided FPC coverlay market include yellow coverlay, black coverlay, and others, while the segments by application cover consumer mobile devices, medical, industrial, avionics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of single-sided FPC coverlay. It also includes the market share of major companies in the single-sided FPC coverlay market, product and business overviews, and sales performance.

  • Other services
  • Other services
  • Flexible Printed Circuit Board

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[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

How flexible printed circuit boards save space in harsh automotive and industrial environments.

We are currently offering a webinar titled "Flexible Printed Circuits (#FPC) with Japanese Subtitles." In today's continuously evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into limited spaces. As the emergence of new communication protocols increases complexity, power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges. [Learning Content] ■ Space-saving techniques ■ Addressing protocol complexity ■ Strengthening design metrics ■ Promoting efficient reuse *For more details, please feel free to contact us.

  • Printed Circuit Board
  • Flexible Printed Circuit Board

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