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Plasma Analysis Software - List of Manufacturers, Suppliers, Companies and Products

Plasma Analysis Software Product List

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[Example] Mass analysis of the "Particle-PLUS" ion beam.

Introduction to Particle-PLUS Analysis Case: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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High-speed plasma analysis software 'Particle-PLUS/DL'

Generate machine learning data from CAE analysis models! Software that allows for easy execution of calculation results in plasma analysis.

"Particle-PLUS/DL" is a CAE surrogate model software that solves the challenges of conventional plasma simulations. It integrates deep learning, which is gaining attention as the "fourth science," with CAE. It enables parametric studies through high-speed calculations, making it promising for initial investigations in plasma analysis. Additionally, it generates training data for machine learning from CAE analysis models, allowing for analysis even without a large amount of experimental data. 【Features】 ■ Results can be confirmed in a few seconds ■ Simple and easy-to-understand GUI ■ Plasma analysis is possible even without a large amount of experimental data ■ Non-divergent ■ Compatible with Windows 10 machines *For more details, please refer to the PDF document or feel free to contact us.

  • Contract Analysis
  • Analysis Services
  • Other analyses

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[Example] "Particle-PLUS" RF Magnetron Sputtering

Introduction to Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis" Simulation Example

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate deposition rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Particle-PLUS: RF Magnetron for Dielectric Targets

Introduction of Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis of Dielectric Target" Simulation Case

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate deposition rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations in low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

  • Other analyses

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Semiconductor plasma analysis software 'Particle-PLUS'

"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in ICP and CCP analysis using particle methods.

"Particle-PLUS" is software suitable for research and development of devices using plasma, compatible with ICP and CCP. - Excels in simulations of low-pressure gases where fluid modeling is difficult - Calculation functions for inductive heating for ICP simulations - Advanced physical model analysis such as CCP and external circuit models - Capable of simultaneously simulating ICP and CCP - Supports 2D and 3D, efficiently analyzing complex models - As a strength of our in-house developed software, customization to fit customer devices is possible ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at sales@wavefront.co.jp.

  • Other analyses

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