We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Precision Polishing.
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Precision Polishing Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ブル精密 (株)ブル精密 本社 Tochigi//Glass and clay products
  2. ティ・ディ・シー Miyagi//Other manufacturing
  3. 新興製作所 Osaka//Manufacturing and processing contract
  4. 4 薮田精密 Gifu//Ceramics
  5. 4 石川県産業創出支援機構 Ishikawa//Public interest/special/independent administrative agency

Precision Polishing Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Glass precision processing (grinding and polishing) Oscar polishing and precision polishing ブル精密 (株)ブル精密 本社
  2. Surface roughness Ra1nm [Precision grinding / Mirror finish] [Wrapping] ティ・ディ・シー
  3. Introduction to the polishing technique! Both double-sided and single-sided polishing are possible. *Processing examples available. 新興製作所
  4. Yabuta Precision Co., Ltd. Business Introduction 薮田精密
  5. 4 [Glass Processing Example] Full Mirror Product Special Device Total Reflection Plate Inner Diameter Polishing ブル精密 (株)ブル精密 本社

Precision Polishing Product List

16~20 item / All 20 items

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Examples of precision grinding: Precision grinding of sliding components such as bearings and shafts.

Reduce friction resistance and achieve smooth operation! For the inner diameter of large bearings and the friction parts of sliding FA equipment! Ishida Polishing's polishing technology.

At Ishida Kenma, we accept polishing processing for all products and parts. By applying precision polishing to areas where friction occurs in drive components, such as the sliding parts of FA equipment and bearings, lubrication performance is improved. We respond to customer inquiries with keywords such as sliding, friction, and durability. *Please view the PDF of our case studies available for download.

  • Processing Contract
  • Hand polishing and filing
  • Wafer processing/polishing equipment

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Film thickness control processing

It is possible to control the thickness of the formed film in units of several tens of nanometers.

- Thickness control of films such as SiO2 and SiN - Thickness variation after processing: less than 50 nm

  • Circuit board design and manufacturing
  • others

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Introduction to the Polishing and Cleaning Processes of Japan Exceed Co., Ltd.

Achieving a super-smooth surface without haze! Introducing the polishing process.

We would like to introduce the polishing and cleaning processes of Japan Exceed, which performs precision polishing and cleaning of semiconductor materials and metal materials. In the polishing process, we achieve an ultra-smooth surface without haze by dividing the polishing into three stages: primary polishing, secondary polishing, and tertiary polishing. In the cleaning process, we maintain cleanliness by performing cleaning without human intervention, removing contaminants such as particles. 【Polishing Process】 ■ Incoming Inspection ■ Adhesive Application Process ■ Primary Polishing Process ■ Secondary and Tertiary Polishing Processes ■ Cleaning Process ■ Measurement Process ■ Inspection Process *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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[Technology Introduction] Smoothing Technology

Surface roughness at the semiconductor level! Precision polishing using smoothing technology.

Nihon Exceed conducts precision polishing processing using smoothing technology. In addition, we possess microstructure measurement techniques using laser microscopes, such as fine structure measurement with laser confocal functionality. Our company meets the polishing needs of various processing materials. 【Features】 ■ Precision polishing processing using smoothing technology ■ Surface roughness at the semiconductor level ■ Cu: Ra 0.16nm ■ Al: Ra 0.20nm ■ Nb: Ra 0.74nm *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract

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Morimoto Seiki Co., Ltd.

Polishing processing for small to medium items that cater to a variety of needs.

Morimoto Seiki Co., Ltd. specializes in precision grinding processing of small to medium-sized parts, such as automotive line components and machine tool parts. We excel in complex grinding processes using cylindrical, internal, flat (rotary), and centerless methods, as well as precision grinding of inner and outer diameters, catering to a wide range of customer needs.

  • others

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