31～43 item / All 43 items
Semiconductor device
This is a semiconductor device made from A5052P (aluminum material) with a thickness of 1.0mm and 1.5mm. The product in the photo is assembled from nine individually manufactured aluminum parts. The parts undergo processes of cutting, pre-processing, and bending, followed by anodizing treatment.
Semiconductor device case
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is complete, trivalent chromate plating is performed, followed by final inspection. This product is used as a case for semiconductor equipment. The production time, including painting, is approximately 3 days for a lot of 100 units.
Semiconductor device stage
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is completed, trivalent chromate plating is performed, followed by final inspection. This product is used as a bracket for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.
Semiconductor device wiring board
This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes are punching, pre-processing, bending, and anodizing in that order. This product is used as a wiring board for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.
Semiconductor device panel
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, and bending in that order. After forming, trivalent chromate plating and silk printing are performed, followed by final inspection. This product is used as a panel for semiconductor equipment. The production time, including plating treatment and silk printing, is approximately 3 to 4 days for a batch of 100 units.
Semiconductor device base
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, chromate plating is performed, studs are attached, and final inspection takes place. This product is used as a base for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.
Semiconductor device partition plate
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.6mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, trivalent chromate plating is performed, studs are inserted, and final inspection takes place. This product is used as a partition plate for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.
Semiconductor device base
This is a precision sheet metal processing product made from SUS430 (hairline material) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, stud welding, bending, and silk screening in that order. This product is used as a base for semiconductor equipment. The production time, including silk screening, is approximately 2 to 3 days for a lot of 100 units.
Semiconductor device middle plate
This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes are punching, pre-processing, bending, and anodizing in that order. This product is used as a middle plate in semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.
Wind pressure device wire mesh
This is a precision sheet metal processing product made from SGC with a thickness of 0.8mm. This product is used as a wire mesh for a wind pressure device. The production time is approximately 1 to 2 days based on a standard lot of 100.
Semiconductor device side panel
This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes include punching, pre-processing, bending, anodizing, and stud welding in that order. This product is used as a side panel for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.
Semiconductor device stage
This is a precision sheet metal processing product made from SPCC (cold-rolled steel sheet) with a thickness of 1.2mm. The main processing involves punching, followed by pre-processing, bending, and then trivalent chromate plating. This product is used as a bracket for semiconductor equipment. The production time, including painting, is approximately 2 to 3 days for a lot of 100 units.
Semiconductor device cover
This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes include punching, pre-processing, bending, anodizing, and stud welding in that order. This product is used as a cover for semiconductor equipment. The production time is approximately 3 days for a lot of 100, including anodizing.
