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ルスダイシングレーザー加工機 Product List

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Stealth Dicing Laser Processing Machine for MEMS

Perfect for microfabrication! From dicing to laser. Free sample processing currently available!

In the MEMS industry, the miniaturization and high-density integration of devices are advancing, requiring precise processing technologies. In particular, high precision and yield are challenges in the fine processing of hard materials such as sapphire and SiC, as well as special materials like quartz and LiNbO₃. The stealth dicing laser processing machine addresses these challenges by achieving high-speed and high-quality processing. 【Application Scenarios】 - Dicing of MEMS devices - Processing of smartphone components - Manufacturing of LED-related parts 【Benefits of Implementation】 - Improved yield by reducing fine cracks and chipping - Shortened production takt time through high-speed processing - Compatibility with a wide variety of materials

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Display-oriented stealth dicing laser processing machine

From dicing to laser! For cutting processing of thin-film displays.

In the display industry, as the trend towards thinner products continues, there is a demand for precise cutting of transparent materials such as glass substrates. The conventional blade method tends to cause fine cracks and chipping, which can lead to reduced yield and unstable quality. The stealth dicing laser processing machine, equipped with Hamamatsu Photonics' patented Stealth Dicing Engine, addresses these challenges. 【Application Scenarios】 - Manufacturing of thin displays - Precision processing of transparent materials - Yield improvement 【Benefits of Implementation】 - Improved yield through high-precision dicing - Increased productivity through high-speed processing - Compatibility with a wide range of materials

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Stealth Dicing Laser Processing Machine for IoT Devices

Contributing to the miniaturization and high performance of IoT devices with high-speed, high-precision cutting of transparent materials!

In the IoT device industry, miniaturization and energy efficiency are important challenges. As devices become more high-performance, precise processing of circuit boards and components is required. In particular, components made from transparent materials necessitate high-precision cutting through laser processing, which is essential for improving yield and enhancing device reliability. Stealth dicing laser processing machines enable fine processing of transparent materials, contributing to the miniaturization, high performance, and energy efficiency of IoT devices. 【Application Scenarios】 - Smartphone components - LED-related components - Wearable devices 【Effects of Implementation】 - Improved yield - Reduced production takt time - Support for small chip sizes - Stable supply of high-quality products

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Stealth Dicing Laser Processing Machine for Solar Cells

Accelerating the efficiency of solar cell manufacturing! Improving yield with high-quality, high-precision laser processing.

In the solar cell industry, there is a demand for both high performance and cost reduction. In particular, improving the yield of materials and reducing processing time are critical challenges in the manufacturing of solar cell cells. Conventional blade cutting methods are prone to fine cracks and chipping, which can lead to decreased yield. The stealth dicing laser processing machine is equipped with Hamamatsu Photonics' patented stealth dicing engine, enabling high-precision dicing of transparent materials. This contributes to improved yield and stabilized quality. Additionally, high-speed processing through laser irradiation allows for a reduction in production takt time. 【Application Scenarios】 - Cutting processing of solar cell cells - Yield improvement through high-precision dicing - Processing of hard materials such as SiC and sapphire 【Effects of Implementation】 - Improved yield - Increased productivity - Stable supply of high-quality products

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