Stealth Dicing Laser Processing Machine for MEMS
Perfect for microfabrication! From dicing to laser. Free sample processing currently available!
In the MEMS industry, the miniaturization and high-density integration of devices are advancing, requiring precise processing technologies. In particular, high precision and yield are challenges in the fine processing of hard materials such as sapphire and SiC, as well as special materials like quartz and LiNbO₃. The stealth dicing laser processing machine addresses these challenges by achieving high-speed and high-quality processing. 【Application Scenarios】 - Dicing of MEMS devices - Processing of smartphone components - Manufacturing of LED-related parts 【Benefits of Implementation】 - Improved yield by reducing fine cracks and chipping - Shortened production takt time through high-speed processing - Compatibility with a wide variety of materials
- Company:西進商事
- Price:Other