コーヨーテクノス Product Lineup

We provide high-current probes capable of carrying over 1,000 amperes for power device testing for electric vehicles and hybrid vehicles. By setting numerous vertical probes on the test pad, we solve the issues associated with traditional spring probes all at once. 【Features】 ■ Capable of carrying over 1,000 amperes ■ Small pin diameter and load per pin, eliminating concerns about contact damage ■ Achieves stable connections through multi-pin settings ■ Improved reliability *For more details, please download the PDF or feel free to contact us.

• probe

A "probe card" is a tool used in the semiconductor testing process for electrical testing of LSI (large-scale integrated circuit) chips formed on silicon wafers during the wafer test process of LSI manufacturing. By using wire probes, it is possible to position the probes vertically, allowing for more flexible probe arrangements. Additionally, by making vertical contact with the test object, significant improvements in inspection marks (dents) compared to conventional cantilever-type probes can be expected. 【Features】 ■ Vertical contact ■ Pin pitch ■ Multi-pin configuration, multi-surface simultaneous measurement *For more details, please download the PDF or feel free to contact us.

• Inspection fixture

The W-side probe has replaced the conventional separate type probe, achieving a reduction in the cost of PCB inspection fixtures.

• Semiconductor inspection/test equipment

From easy-to-handle mini press specifications to space-saving designs, we meet our customers' needs.

• Semiconductor inspection/test equipment

The vertical probe VBP-C method enables high-speed multi-testing.

• Semiconductor inspection/test equipment

The chip socket using the VBPC (Vertical Bending Probe Card) supports a wide range of standard pitches such as BGA and CSP, as well as fine pitches for direct contact with FPC drivers and IC chips. Additionally, we can produce from one set for prototypes and special designs.

• Semiconductor inspection/test equipment

Packages with a high number of matrix spin settings are our VBP's area of expertise.

• Semiconductor inspection/test equipment

Our company's probe has received high acclaim both domestically and internationally.

• Semiconductor inspection/test equipment

By changing the probes and electrodes from the conventional spring probe to the VBPC method, we have achieved high cost performance and compatibility with narrow pitches.

• Semiconductor inspection/test equipment

Utilizing the deflection caused by the vertical stroke of the wire as contact load, this is a fixture for substrate inspection. The "VBPC" is a probe made from ultra-fine wires such as tungsten, which have been specially plated and coated with Teflon, and it uses the deflection from the vertical stroke of the wire for contact load in substrate inspection. 【Features】 ◆ Tip plate material: Engineering plastic / Ceramic ◆ Pin position accuracy: ±5 ◆ Pin height variation: ±10 ◆ Pin tip shape: Round / Needle / Flat ■□■□■□■□■□■□■□■□■□■□■□■□ ＝＝＝＝＝ Please contact us for more details＝＝＝＝＝

• Other semiconductor manufacturing equipment