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  1. Home
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  3. Suntex Co., Ltd.
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Suntex Co., Ltd.

EstablishmentSeptember 1985
number of employees6
addressShizuoka/Izunokuni-shi/151-1 Jike
phone055-944-6600
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last updated:Nov 12, 2025
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DFI Industrial Embedded PC DFI Industrial Embedded PC
Winsonic Industrial Camera Winsonic Industrial Camera
GIGAIPC Industrial Motherboard GIGAIPC Industrial Motherboard
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Signage display Signage display
CASwell Ethernet Card CASwell Ethernet Card
Arestech Panel PC Arestech Panel PC
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GIGAIPC Embedded PC GIGAIPC Embedded PC
Arestech Embedded PC Arestech Embedded PC
Poindus Panel PC Poindus Panel PC
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Faytech Industrial Display Faytech Industrial Display
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SECO Industrial CPU Board SECO Industrial CPU Board
Procurement services for semiconductors and electronic components. Procurement services for semiconductors and electronic components.
Faytech Industrial PC Faytech Industrial PC
KINGDY Embedded PC KINGDY Embedded PC
AVLINK Imaging Device AVLINK Imaging Device
KINGDY Panel PC KINGDY Panel PC
Image transmission device, video transmission device Image transmission device, video transmission device
Feelworld Small LCD Monitor Feelworld Small LCD Monitor
IEI LCD Monitor IEI LCD Monitor
KINGDY LCD Display KINGDY LCD Display
LITEMAX products LITEMAX products
NEWAY Small LCD Monitor NEWAY Small LCD Monitor
Secu6 Display Secu6 Display
SEETEC LCD Monitor SEETEC LCD Monitor
SEFORM Small LCD Monitor SEFORM Small LCD Monitor
WINSONIC LCD Display WINSONIC LCD Display
XENARC Small LCD Monitor XENARC Small LCD Monitor
Other LCD monitors Other LCD monitors
LCD module LCD module
AAEON Panel PC AAEON Panel PC
FLYTECH Panel PC FLYTECH Panel PC
IBASE panel PC IBASE panel PC
Other panel PCs Other panel PCs
AAEON Embedded PC AAEON Embedded PC
Maincon Industrial Products Maincon Industrial Products
IEI panel PC IEI panel PC
ADLINK Embedded PC ADLINK Embedded PC
ADLINK Industrial PC Products ADLINK Industrial PC Products
IBASE Embedded PC IBASE Embedded PC
IEI Embedded PC IEI Embedded PC
7STARLAKE Embedded PC 7STARLAKE Embedded PC
SINTRONES Embedded PC SINTRONES Embedded PC
Other embedded PCs Other embedded PCs
AAEON industrial CPU board AAEON industrial CPU board
ADLINK Measurement and Control Board ADLINK Measurement and Control Board
iBASE Industrial CPU Board iBASE Industrial CPU Board
IEI Industrial CPU Board IEI Industrial CPU Board
7STARLAKE Industrial CPU Board 7STARLAKE Industrial CPU Board
Portwell Industrial CPU Board Portwell Industrial CPU Board
Industrial SSD Industrial SSD
Beijer Electronics Industrial Network Equipment Beijer Electronics Industrial Network Equipment
PLANET network equipment PLANET network equipment
TELTONIKA Industrial Mobile Router TELTONIKA Industrial Mobile Router
Dahua / Huaray Industrial Camera Dahua / Huaray Industrial Camera
Rextron Imaging Equipment Rextron Imaging Equipment
Industrial GPS products Industrial GPS products
Industrial system products Industrial system products
Thermal camera (body temperature detection) Thermal camera (body temperature detection)
PC software PC software
Inventory items Inventory items
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SECO COM-HPC CPU Module ORION

12th Core i series, 2xDDR5-4800 maximum 64GB memory, size 120x95mm

Features ■ Supports 12th generation Intel Core processors (Codename: Alder Lake – H series) ■ 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2 ■ Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays ■ Supports 2xDDR5-4800 memory up to 64GB ■ Operating temperature 0–60℃ (Optional: -40–85℃) ■ Dimensions: 120x95mm ■ OS Win Server2022/VxWorks7.0/Ubuntu/Linux/Yocto/Android

  • Embedded Board Computers
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SECO COM-HPC CPU Module CARINA

11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.

Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android

  • Embedded Board Computers
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  • Image Processing Board

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Procurement services for PC components, LCDs, ICs, and electronic parts, including hard-to-obtain items.

We will quickly procure and provide using our unique parts supply network.

The spread of the internet has made it easier to obtain information, but at the same time, customer risks have certainly increased. Our company has the know-how cultivated through years of trading with manufacturers in Taiwan and China. (The expertise in sourcing urgent items and discontinued products is something that has been developed precisely because we are a trading company.) Regarding quality assurance, our parts suppliers have a QA team, and quality assurance is conducted before shipment by requesting a third-party inspection agency, with the inspection report sent along with the parts. Additionally, there is a warranty period, and if any issues arise during that time, free replacements are possible. 【Major Manufacturers We Handle】 PC Components: Intel, AMD, Transcend, WD, Seagate, ACPI, UDinfo, RENICE LCD: AUO, CDtech, JWS, SAEF IC: TI, NXP, ADI/Linear Tech, Microchip, ST Micro, Maxiam, Altera, XILINX Electronic Components: Vishay, Murata, TE, Molex *For stock status, please download the inventory table below and check.

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SECO Qseven CPU Module ASTERION

Celeron J1900/N2x00/Atom E3800 series, onboard DDR3L-1333 with a maximum of 8GB memory.

Features ■ Supports Intel Atom E3800 and Celeron family ("Bay Trail") ■ 6x USB 2.0; 1x USB 3.0; 3x PCI-e x1 ■ Integrated Intel HD Graphics 4000 Series controller ■ Onboard DDR3L-1333 with a maximum of 8GB memory ■ Operating temperature 0–60℃ (optional: -40–85℃) ■ Dimensions: 70x70 mm (2.76” x 2.76”) ■ OS Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
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SECO Qseven CPU Module KUMA

Intel Atom E3800 and Celeron family, equipped with onboard DDR3L-1333 memory up to 4GB.

Features ■ Compatible with Intel Atom E3800 and Celeron families ■ 4x USB 2.0; 1x USB 3.0; 3x PCI-e x1; supports LPC Bus ■ Integrated Intel HD Graphics 4000 Series controller ■ Onboard DDR3L-1333 memory, up to 4GB ■ Operating temperature 0 to 60°C ■ Dimensions: 40 x 70 mm (1.57 x 2.76) ■ OS Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
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SECO Qseven CPU Module NAOS

Equipped with Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900, DDR3L-1866 memory.

Features ■ Compatible with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series ■ Supports 2x USB 3.0; 4x PCI-e; 6x USB 2.0 ■ Integrated Gen9-LP Graphics controller ■ Onboard DDR3L-1866 with a maximum of 8GB memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS: Win10 IoT/Linux/Yocto

  • Embedded Board Computers
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SECO Qseven CPU Module ATLAS

Pentium J/N6000/Atom x6000E series, equipped with onboard LPDDR4-3200 with a maximum of 16GB.

Features ■ Equipped with Intel Atom x6000E series and Intel Pentium and Celeron N and J series processors ■ 1x GbE with precision time protocol IEEE 1588, 6x USB 2.0, 2x SuperSpeed USB 10Gbps, supports up to 4x PCI-e ■ Integrated Intel Gen 11 UHD graphics controller with up to 32 EU ■ Onboard LPDDR4-3200 memory with a maximum of 16GB ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Win10 IoT/Yocto

  • Embedded Board Computers
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SECO Myon Micro CPU Module Myon II

NXP i.MX 8M Mini Family, ARM Cortex-A53, size 48x32mm

Features ■ Equipped with NXPi.MX 8M Mini and i.MX8MNano application processors ■ Supports 1x Gigabit Ethernet, USB 2.0, and LVDS ■ GC320 2D accelerator + GCNanoUltra 3D accelerator ■ Onboard LPDDR4-3200 with up to 8GB of memory ■ Operating temperature: 0 to 70°C (Optional: -40 to 85°C) ■ Size: 48.0 x 32.0 x 4.2 mm ■ OS support: Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
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SECO Myon Micro CPU Module Myon I

Qualcomm Snapdragon 410E ARM Cortex-A53, size 48x32mm

Features ■ Equipped with Qualcomm Snapdragon 410E low-power processor ■ Onboard WLAN 802.11 b/g/n 2.4 GHz, Bluetooth 4.1, USB 2.0, supports LVDS, MIPI Display, and Camera ■ Supports OpenGL ES 3.0, OpenCL/DirectX 12 graphic acceleration for Windows 10 IoT Core ■ Onboard LPDDR4-2400 memory up to 4GB ■ Operating temperature -25 to 85℃ ■ Size: 48 x 32 x 4.2mm (without antenna) ■ Compatible with OS Win10 IoT/Linux/Android

  • Embedded Board Computers
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SECO SMARC CPU Module SWAN (SM-D16)

NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm

Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android

  • Embedded Board Computers
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SECO SMARC CPU Module LEXELL

SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm

Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android

  • Embedded Board Computers
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SECO SMARC CPU Module LEVY (SM-D18)

NXP i.MX 8M Plus Family, ARM Cortex-A53, size 50x82mm

Features ■ Equipped with NXP i.MX8MPlus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting three independent displays ■ Onboard LPDDR4-4000 with up to 6GB memory ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with Linux OS

  • Embedded Board Computers
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Fully waterproof and dustproof high-brightness display IM-36240W-35FH1A

24-inch, fully dustproof and waterproof IP66, VGA, HDMI compatible, stainless steel casing

Features ■ 24-inch 1920x1080 TFT LCD ■ IP66 dustproof and waterproof on all six sides ■ Supports high brightness of 1000cd/m2 (optional) ■ Compatible with projected capacitive/resistive touch screens (optional) ■ VESA standard compliant ■ Operating temperature: 0 to 60°C (can be changed to -20 to 70°C with options) ■ Supports VGA and HDMI

  • LCD display

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Open Frame High Brightness Touch Display IM-31101W

10.1-inch open frame monitor, 5-wire resistive touch/projection capacitive touch,

Features - 10.1 inches, 1280x800 - Supports VGA and HDMI inputs - Compatible with resistive and capacitive touch (optional) - Brightness can be changed to 1000cd/m2, 1500cd/m2, 2000cd/m2, 2500cd/m2 (optional) - VESA standard compliant

  • LCD display

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Front waterproof IP65 panel mount display IM-32101W

10.1 inches, front waterproof IP65, resistive membrane type/capacitive surface type touch, panel mount compatible, high brightness support available (optional)

Features ■10.1" 1280 x 800 LCD ■Optical bonding adopted to reduce reflection and prevent condensation (optional) ■Capacitive/resistive touch support (can be changed optionally) ■High brightness options of 1000nits, 1500nits, and 2000nits (optional) ■Front waterproof and dustproof IP65 ■VESA 75 x 75mm, panel mountable ■Display port (VGA + HDMI) *Additional inputs can be added optionally ■Operating voltage wide DC input 9-36V

  • LCD display

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Industrial Front Waterproof Fanless Panel PC LPC-P215W-1X

21.5 inches, 7th/6th generation Kaby Lake-U/Skylake-U Core i7/i5/i3 processors, projected capacitive touch

Features ■ 7th/6th Generation Kaby Lake-U/Skylake-U Core i7/i5/i3 processors ■ 15.6-inch projected capacitive touch ■ Resolution 1920*1080 ■ Fanless operation ■ Wide DC input power 12-24V ■ IP65/66 front waterproof/dustproof bezel ■ Operating temperature -20~60 °C ■ VESA 75/100mm/panel mount support

  • Sales Management
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Industrial Front Waterproof Fanless Panel PC LPC-P156W-1Tx

15.6-inch, Intel TigerLake-U Core i5/i7 processor, projected capacitive touch panel, fanless operation

Features ■ Intel Tigerlake-U Core i5/i7 processor ■ 15.6-inch projected capacitive touch ■ Resolution 1920*1080 ■ Fanless operation ■ Wide DC input power 9-55V ■ IP65/66 front waterproof/dustproof bezel ■ Operating temperature -20~60 °C ■ VESA 75/100mm/panel mounting support

  • Sales Management
  • Process Control System
  • Industrial PCs

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SECO Industrial CPU Module Trizeps VII SX

Trizeps SODIMM-200 CPU module, NXP i.MX 6SoloX, ARM Cortex-A9

Features ■ Equipped with NXP i.MX 6SoloX, single-core Cortex-A9@1GHz + Cortex-M4 core@227MHz processor ■ Supports 2x Fast Ethernet, WiFi/Bluetooth, USB 2.0, PCIe ■ Vivante GC400T, 2D and 3D hardware accelerator ■ Onboard LPDDR3-533 with up to 2GB memory ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ Compatible with Win Embedded Compact 2013/7/Linux

  • Embedded Board Computers
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SECO Industrial CPU Module Trizeps VII

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX M6 family

Features ■ Equipped with NXP i.MX6 application processor (from Solo to QuadCore) ■ Supports 1x 100/1000 Megabit Ethernet, WiFi/Bluetooth, USB 2.0, PCIe, HDMI ■ Vivante GC3500 2D accelerator + Vivante GC2000 3D accelerator ■ Onboard LPDDR3-1066 memory up to 2GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ Compatible with OS Win10 IoT/Ubuntu/Android

  • Embedded Board Computers
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SECO CPU Module Trizeps VIII Mini

Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family

Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
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SECO Industrial CPU Module Trizeps VIII

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M family

Features ■ Equipped with NXPi.MX8M application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, 2x USB 3.0 ■ Integrated GPU that supports multi-display ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
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SECO CPU Module Trizeps VIII Plus

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus

Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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Fanless Embedded PC Kingdy BB005SW

BB Series, for gateway systems, equipped with Celeron J1900, short delivery time product.

Features ■ Width 286 × Height 212 × Depth 55 mm, 3.33 liters ■ Fanless, book-sized chassis ■ Atom E3940 CPU ■ Celeron J1900 CPU ■ 4 USB 2.0, 6 RS232, 1 GLAN, 1 VGA ■ 1 Mini PCI-E slot ■ Wall mountable ■ For IIoT gateway applications

  • Industrial PCs

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Fanless Embedded PC EB004SW with Expansion Slot Support

Kingdy J1900 Book PC Expansion Slot, fanless and sturdy design, supports expansion slots.

Features ■ Fanless and robust design ■ Intel Bay Trail J1900 2.0GHz Quad Core processor ■ 2 x GLAN, 4 x USB, 5 x RS232, 1 x VGA ■ Expansion slots: 1 x Mini PCI-E slot, 1 x PCI e x 1 slot ■ Supports wall mounting

  • Industrial PCs
  • server
  • Other information systems

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Fanless Industrial Embedded PC Kingdy FB030SW

FB Series, designed for gateway systems, equipped with Celeron J1900, fully dustproof and waterproof IP65.

Features ■ Width 286 × Height 210 × Depth 50 mm, 3 liters ■ Fanless, IP65 fully waterproof 304 stainless steel casing ■ Celeron J1900 CPU ■ 1 USB 2.0, 2 RS232, 1 GLAN, 1 VGA ■ 2 Mini PCI-E slots ■ M12 connector (with cable) ■ Wall mount compatible ■ IIoT gateway application

  • Industrial PCs

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Fanless Industrial Embedded PC Kingdy CB081WD

CB Series Gateway System, equipped with Atom E3940, compact size with a thickness of 50mm.

Features ■ Width 167 × Height 112 × Depth 50 mm, 0.94 liters ■ Fanless, sturdy compact chassis ■ Operating temperature -40 to 70°C ■ Atom E3940 CPU ■ 4 USB 2.0, 2 RS232, 2 GLAN, 1 HDMI, 1 DP ■ 2 Mini PCI-E slots ■ DIN rail compatible ■ IIoT gateway applications

  • Industrial PCs

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Fanless Embedded Box PC Kingdy CB075SD

CB Series Gateway System, equipped with Core i3-7100U, compact size with a thickness of 55mm.

Features ■ Width 173 × Height 106 × Depth 55 mm, 1.01 liters ■ Fanless, durable compact chassis ■ Core i3-7100U CPU ■ 4 USB 2.0, 2 RS232, 2 GLAN, 1 HDMI, 1 DP ■ 2 Mini PCI-E slots ■ DIN rail compatible ■ IIoT gateway application

  • Industrial PCs

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Fanless Embedded Box PC Kingdy CB030SD

CB Series, designed for gateway systems, equipped with Celeron J1900, compact size with a thickness of 50mm.

Features ■ Width 167 × Height 112 × Depth 50 mm, 0.94 liters ■ Fanless, durable compact case ■ Celeron J1900 2.0GHz CPU, fanless ■ 4 USB 2.0, 2 RS232, 2 GLAN, 1 HDMI, 1 VGA ■ 2 Mini PCI-E slots ■ DIN rail compatible ■ IIoT gateway application

  • Industrial PCs
  • server
  • Other information systems

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28-inch high-brightness stretch LCD module S28015

Display screen LCD module, high brightness 1000cd/m2, ultra-wide screen (16:3), short delivery time product, VGA+DVI+HDMI.

Features ■ 28-inch bar screen LCD module ■ 1920x358 high-resolution LCD module ■ Supports high brightness of 1000cd/m2 ■ Ultra-wide screen (16:3) ■ Display size 698.4(H) x 130.2(V) ■ Operating temperature 0 to 45℃ ■ Includes AD board (VGA + DVI + HDMI input)

  • LCD display

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SECO μQseven CPU Module ELECTRA

μQ7-C72, μQseven NXP i.MX 8M Mini/Nano, ARM Cortex-A53

Features ■ Supports NXP i.MX 8M Mini Family / i.MX 8M Nano Family ■ Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2 x UART; optional CAN; 5 x USB 2.0; supports 1 PCI-e x1 ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard DDR4-2400 with a maximum of 4GB memory ■ Operating temperature 0 to 60℃ (optional: -30℃ to 85℃) ■ Dimensions: 40 x 70 mm (μQseven, 1.57” x 2.76”) ■ OS Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO μQseven CPU Module NEMBUS

μQ7-A75-J, μQseven NXP i.MX 6 Family, ARM Cortex-A9, equipped with onboard DDR3L

Features ■ Equipped with single and dual-core Lite (ARM Cortex A9 core) ■ Supports Fast Ethernet; GPI/O ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard with up to 1GB DDR3L memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO μQseven CPU Module LIBERTAS

μQ7-962, μQseven NXP i.MX 6 family, ARM Cortex-A9, equipped with onboard DDR3L.

Features ■ Equipped with single-core, dual-core, and quad-core (ARM Cortex-A9 core) ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard DDR3L with a maximum of 2GB memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO NXP Qseven CPU Module Q7-C25

NXP i.MX 8M family, equipped with ARM Cortex-A53 and onboard LPDDR4-2400.

Features ■ Equipped with NXP i.MX 8M application processor ■ Supports 1x USB 3.0; 4x USB 2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-2400 memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO NXP Qseven CPU Module MAIA

NXP i.MX 8X family, ARM Cortex-A72, equipped with up to 8GB of onboard LPDDR4-3200.

Features ■ Equipped with NXP i.MX 8 application processor ■ 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; supports boot select signal ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-3200 memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module AMOS

COMe-A98-CT6, Type 6 AMD Embedded Third Generation R/G Series, 2xDDR4-2133 ECC Maximum 64GB

Features ■ AMD built-in 3rd generation R series SOC or G series SOC-I ■ 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ AMD Radeon 3rd -Generation Graphics Core Next (GCN) ■ Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

  • Embedded Board Computers
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SECO COM Express CPU Module METIS

COMe-C89-CT6, Type 6 Compact AMD Ryzen Embedded R1000 Series Processor

Features ■ Adopts COM Express Compact Type 6 module ■ 4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3 ■ Equipped with AMD Radeon Vega GPU with three computing units ■ Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory

  • Embedded Board Computers
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  • Image Processing Board

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SECO COM Express CPU Module CHARON

Type6 Compact AMD Ryzen Embedded V1000, AMD Ryzen Embedded V1000 Processor

Features ■ Adopts COM Express Compact Type 6 module ■ 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Supports AMD Radeon Vega GPU DirectX 12 with up to 11 computing units ■ Supports up to two DDR4 SO-DIMM slots for DDR4-3200 ECC memory

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module OPHELIA

Type6 Compact AMD Ryzen Embedded V2000, 2xDDR4-3200 ECC up to 64GB

Features ■ Embedded Ryzen V Series V2000FP6 platform equipped with "Zen2" CPU and Radeon GPU core ■ 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen3 ■ Integrated AMD Radeon GPU with up to 7 computing units ■ Two DDR4 SO-DIMM slots supporting up to 64GB of DDR4-3200 ECC and non-ECC memory ■ Adopts COM Express Compact Type 6 module

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module THEBE

COMe-C42-BT7, Type 7 AMD EPYC Embedded 3000, 4xDDR4-2666 ECC maximum 128GB

Features ■ COM Express R3.0 Type 7 Basic equipped with AMD EPYC Embedded 3000 ■ 4x USB 3.1; 24x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Supports up to 128GB of ECC DDR4-2666 memory with 4 DDR4 SO-DIMM slots

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module CHANDRA

COMe-A41-CT6, Type 6 Celeron J/N/Atom E3800 series, 2xDDR3L-1333 maximum 8G

Features ■ Compatible with COM Express Compact Type 6 ■ Intel Atom E3800 and Celeron family (formerly Bay Trail) ■ 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Intel Integrated HD Graphics 4000 series controller ■ 2x DDR3L SO-DIMM slots (up to 8G)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module MIRANDA

COMe-C24-CT6, Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900

Features ■ COM Express 3.0 Basic Size Type 6 ■ Intel Atom X, Intel Celeron J/N, Intel Pentium N series processors ■ 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Intel HD Graphics 500 series controller with up to 18 execution units ■ 2x DDR3L SO-DIMM slots (supports DDR3L-1866 non-ECC memory)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module ECHO

COMe-953-BT6, Type 6 4th Gen Core i7/i5/i3/Celeron E Series

Features ■ COM Express Basic Size Type 6 ■ Intel Haswell family CPU ■ 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Integrated Intel HD Graphics 4600 ■ 2x DDR3L-1600 maximum 16GB

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module TARVOS

COMe-B09-BT6, Type6 7th/6th Gen Core i7/i5/i3/Xeon

Features ■ COM Express Basic Size Type 6 ■ Intel 6th and 7th Generation Core/Xeon CPU ■ 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel HD Graphics 530/P530/630/P630 ■ 2x DDR4 So-DIMM slots

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module LARISSA

COMe-C55-CT6, Type 6 Compact 8th Gen Core i7/i5/i3/Celeron U Series

Features ■ 8th generation Intel Core and Celeron 4000 series processors (formerly Whiskey Lake) with 15W TDP ■ 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Intel UHD Graphics 620 / 610 ■ 2×DDR4 SO-DIMM slots (supports up to 64GB of DDR4-2400 memory)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module OBERON

COMe-C08-BT6, Type6 9th/8th Gen Core i7/i5/i3/Xeon

Features ■ 8th Gen Core/Xeon (Coffee Lake) & 9th Gen Core/Xeon/Celeron CPUs (Coffee Lake Refresh) ■ Gigabit Ethernet, 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel UHD Graphics 630/P630 architecture, up to 48 Execution Units ■ Two DDR4 SO-DIMM Slots supporting DDR4-2666 ECC Memory, up to 64GB

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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  • 10個まで5日で出荷 ロータリーエンコーダ 9,500円~16,600円(税別) Φ30、Φ40mm 100~4000P/R 磁気式インクリメンタル形
  • RS 年度末セール 年に1度のスペシャル企画! 期間限定 最大60%OFF 期間:2026 1/5(月)~3/27(金)18:00まで
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