吉田ＳＫＴ Product Lineup

In the cleaning process of semiconductor manufacturing, the use of various chemical solutions poses serious challenges such as corrosion of equipment parts and the leaching of metal ions. By applying fluororesin coating to moving parts, chemical resistance is provided, preventing corrosion. The application in cleaning tanks helps suppress the leaching of metal ions, maintaining a high-purity cleaning process. Furthermore, the application to the wafer stage can also address the prevention of wafer scratches. Yoshida SKT, as a pioneer in Teflon(TM) coating, has extensive experience in the semiconductor field and excels in customizing solutions according to customer equipment specifications and chemical conditions. For detailed technical information and case studies, please download the materials for review.

In semiconductor manufacturing, the leaching of metal ions is a significant issue that directly affects product quality. Fluororesin coatings form a very stable film and can suppress the leaching of metal ions to an extremely low level. Because the coating film itself is less likely to undergo chemical reactions, it maintains its performance even after long-term use, providing highly reliable protection. Yoshida SKT, as a pioneer in Teflon(TM) coatings, has extensive experience in the semiconductor manufacturing field, where high purity is required. We can select the optimal grade and provide customization according to our customers' process conditions. For detailed technical information, please download the materials for confirmation.

Static electricity causes many problems in semiconductor manufacturing processes, such as particle adhesion, ESD damage, and powder attachment. Yoshida SKT's unique electrostatic prevention fluororesin coating "Safron(R)" achieves both static electricity prevention and non-stick properties through the addition of conductive materials. It supports a wide range of surface resistivity from 10^5 to 10^11 ohms/sq, and custom settings can be tailored to meet process needs. Yoshida SKT is one of the few authorized processors of Teflon(TM) coatings, with over 2,000 achievements and hundreds of surface treatment technologies as specialists. Please share your desired level of static electricity prevention and usage environment. Detailed specifications, case studies, and selection guides can be found in the materials. We encourage you to download the materials and make use of them.

■Three Main Mechanisms of Powder Clogging (1) Adhesion to Walls Powder particles adhere to the inner walls of hoppers and pipes, narrowing the flow path and worsening the flow. The causes vary, including adhesion due to static electricity, moisture, and the physical adhesion of sticky powders. (2) Agglomeration of Particles Due to humidity and temperature influences, particles may stick together and form clumps. Agglomerated powders significantly reduce flowability and can block pipes and valves. (3) Bridging This phenomenon occurs when powder forms an arch-like structure (bridge) near the outlet of a hopper, becoming stable under its own weight. The particle size distribution, shape, and friction with the wall all affect this. ■Approach to Solutions To prevent powder clogging, one effective method is to reduce the friction of the wall surfaces that the powder contacts, thereby lowering adhesion forces. Particularly when static electricity is a cause of adhesion, surface treatments with anti-static functions are effective. The causes of powder clogging can vary with even slight differences in the environment. At Yoshida SKT, we propose optimal surface treatments based on the conditions provided by our customers. If you encounter issues with powder transport, please feel free to consult us.