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  3. コペル電子
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コペル電子

EstablishmentNovember 11, 1968
capital4900Ten thousand
number of employees50
addressKanagawa/Atsugi-shi/Boatman 43
phone046-247-7366
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last updated:Jun 10, 2020
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コペル電子 Product Lineup

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Power cycle test equipment

This is a power cycle testing device essential for the reliability testing of power semiconductors.

This device consumes a specified amount of power from the sample (IGBT, IPM, SiC, GaN, Diode, etc.), performs intermittent power supply within a designated time, and conducts reliability testing of the sample. It also allows for thermal resistance measurement, and the data is transferred to the HOST PC.

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Thermal resistance tester

The transient thermal resistance tester is a device that measures the transient thermal resistance of IGBT, MOS-FET, diode, BJT, etc.

The BJT transient thermal resistance measurement device applies a specified power between the collector and emitter, raises the chip temperature, and measures the difference in base-emitter voltage (ΔVBE) using the small currents (Im) before and after. This allows for the estimation of the thermal resistance of the sample. The IGBT transient thermal resistance measurement device, similar to the BJT transient thermal resistance measurement device, measures the voltage difference between the gate and emitter (ΔVGE). The P-MOS FET transient thermal resistance measurement device, like the BJT transient thermal resistance measurement device, measures the voltage difference between the gate and source (ΔVGS). The BJT transient thermal resistance measurement device can measure the ΔVF of the diode between the base and emitter.

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Chip standalone static characteristic testing device

It is a static characteristic testing device for measuring power devices in a chip-only configuration. There are also many proven testing devices for wafer state.

It is a test device for the static characteristics of the chip (DC characteristics). It supports from microcurrents to high power.

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Module Static Characteristic Inspection Device

It is a static characteristic testing device for measuring power devices packaged as modules.

It is a static characteristic (DC characteristic) measuring instrument for various power modules. It supports measurements from microcurrents to high power.

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Wafer chip standalone dynamic characteristic testing device

This is a dynamic characteristic testing device for measuring power devices in chip form. There are also many proven inspection devices for testing in wafer form.

This is a dynamic characteristic measurement device (AC characteristic measurement device) aimed at individual wafer chips of various semiconductors (IGBT, P-MOS FET, SiC, GaN, Diodes, etc.). It enables dynamic characteristic testing during shipping inspections and acceptance inspections of individual chips, as well as during the process before package sealing.

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Power module dynamic characteristic testing device

This is a dynamic characteristic testing device for measuring power devices packaged as modules.

Achieves switching time, VCE (SUS), and load short-circuit measurement with a single unit. Ideal for measuring dynamic characteristics (AC characteristics) in high and low temperature environments. Low Ls measurement is possible thanks to Copel Electronics' unique know-how. Chamber for heating/cooling is also available.

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0℃ Reference Temperature Device Zero Con

It is essential for precise continuous temperature measurement and testing.

1. Precisely control 0°C with high accuracy. 2. Due to the electronic cooling system, simply turning on the switch eliminates the need for complicated operations or maintenance. 3. Can be used continuously for long periods. 4. Various types of thermocouples can be built-in upon request.

  • Temperature and Humidity Control

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