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"BeLight " is an ultra-low dielectric film that reduces transmission loss in the high-frequency range. It maintains a dielectric loss tangent of 0.0003 (28GHz), achieving a level higher than the mainstream fluoropolymer. Additionally, this film is easy to process with lasers and has strong adhesion to copper foil and low water absorption. [Features] ■ Reduces transmission loss in the high-frequency range ■ Dielectric loss tangent of 0.0003 (28GHz) ■ Achieves a level higher than the mainstream fluoropolymer ■ Easy to process with lasers *For more details, please refer to the related links or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that achieves both ultra-low dielectric properties and high adhesion to copper foil. With a dielectric constant of 2.2 and a dielectric loss tangent of 0.0004@28GHz (SNL type), it features low transmission loss equivalent to that of fluoropolymer materials. It uses lower-cost materials compared to current low-dielectric materials, such as LCP or PTFE. It can be used both as an adhesive for FFC and as a substrate, allowing for the reduction of dielectric properties in the insulating part (adhesive + substrate) when using this product. 【Features】 ■ Dielectric constant of 2.2, dielectric loss tangent of 0.0004@28GHz (SNL type) ■ Low transmission loss comparable to or better than fluoropolymer materials ■ Low water absorption (<0.1%) *For more details, please download the PDF or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that combines ultra-low dielectric properties with high adhesion to copper foil. It features high adhesion to low-roughness copper foil (up to 40N/cm), as well as lamination and flexibility due to the thermoplastic resin. It is well-suited for applications in Flexible Flat Shield Cable (FFSC) SDL type, with good adhesion to copper foil and UV laser processability. 【Features】 ■ High adhesion to low-roughness copper foil (up to 40N/cm) ■ Ultra-low dielectric ■ Processability ■ Multifunctional *For more details, please download the PDF or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that achieves both ultra-low dielectric properties and high adhesion to copper foil. In addition to low water absorption (less than 0.1%), we can also provide additional functionalities, including heat resistance (max. 260°C), flame retardancy (VTM-0, halogen-free), and laser machinability. It can be used in applications such as Flexible Flat Cables (FFC), Flexible Flat Shield Cables, and transparent antennas. 【Features】 ■ Low water absorption (less than 0.1%) ■ Ultra-low dielectric ■ Processability ■ Multifunctional *For more details, please download the PDF or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that combines ultra-low dielectric properties with high adhesion to copper foil. It has a transmission loss that is equal to or better than that of fluoropolymer resins and uses lower-cost materials compared to current low-dielectric materials. It is suitable for applications such as Flexible Flat Cables (FFC), Flexible Flat Shield Cables, and transparent antennas. 【Features】 ■ Low transmission loss equal to or better than fluoropolymer resins ■ Ultra-low dielectric ■ Processability ■ Multifunctional *For more details, please download the PDF or feel free to contact us.

Introducing the applications of the thermoplastic ultra-low transmission loss film "BeLight" used in the insulation material of flat cables. With the trend towards thinner devices, flat cables have become mainstream. However, there are challenges with PI and PET not being suitable for high frequencies, and LCP being expensive and difficult to process. This product can be used both as an adhesive for FFC and as a substrate. By using this product, the insulation part (adhesive + substrate) can be made low-dielectric. 【Expected Benefits (FFC Applications)】 ■ Reduction of transmission loss - By lowering the dielectric constant and dielectric loss tangent, it contributes to the suppression of signal attenuation, especially in high-frequency bands. ■ Thinning and flexibility of cables - With a low dielectric constant, it contributes to the thinning of the insulation layer required for the specified characteristic impedance and enhances cable flexibility. *For more details, please download the PDF or feel free to contact us.

We will introduce the applications of the transparent antenna's thermoplastic ultra-low transmission loss film "BeLight." The features of CCL (Copper Clad Laminate) formation and conductor formation through sputtering and plating allow for the development of transparent antennas while maintaining the film's transparency due to low transmission loss and fine circuit formation. Additionally, it exhibits suppression of curl/warping and good adhesion, enabling applications in FPC (Flexible Printed Circuit) in combination with low-temperature mounting. [Features of conductor formation through sputtering and copper plating] - Thin film conductors with smooth interfaces - High-energy process without high temperatures *For more details, please download the PDF or feel free to contact us.

In the telecommunications equipment industry, especially in data transmission, high-speed and stable signal transmission is required. Flat cables contribute to the miniaturization of devices, but conventional PI and PET cannot adequately handle high frequencies, and LCP is expensive and has processing challenges. In response to these issues, our thermoplastic ultra-low transmission loss film 'BeLight' can be used as an adhesive and substrate for flat cables, reducing the dielectric constant of the insulating parts and suppressing signal attenuation in high-frequency bands. This contributes to the reduction of transmission loss and the thinning and flexibility of cables. 【Application Scenarios】 - Flat cables requiring high-frequency signal transmission - Telecommunications equipment requiring thin and lightweight designs - Data transmission lines where maintaining signal quality is crucial 【Benefits of Implementation】 - Reduction of transmission loss in high-frequency bands - Improvement in cable thinness and flexibility - Stabilization of characteristic impedance

In the server industry, particularly in data transmission, high-speed and stable signal transmission is required. Flat cables contribute to the miniaturization of devices, but conventional PI and PET cannot adequately handle high frequencies, and LCP is expensive and has processing challenges. In response to these issues, our thermoplastic ultra-low transmission loss film 'BeLight' can be used as an adhesive or substrate for flat cables, reducing the dielectric constant of the insulating part and suppressing signal attenuation in high-frequency bands. This contributes to reducing transmission loss and achieving thinner and more flexible cables. We are also open to consultations regarding sample provision for cables, so please feel free to contact us. 【Application Scenarios】 - Flat cables requiring high-frequency signal transmission - Reducing the use of expensive low-dielectric substrates by replacing circuit board wiring with FFC - Communication devices that require thinness and lightweight design - Data transmission lines where maintaining signal quality is crucial 【Benefits of Implementation】 - Reduction of transmission loss in high-frequency bands - Thinning and increased flexibility of cables - Stabilization of characteristic impedance

The thermoplastic ultra-low transmission loss film "BeLight" is a product that balances low dielectric properties with high adhesion to conductors. By utilizing these features as adhesives or substrates for flat cables, it reduces the dielectric constant of the insulating parts and suppresses signal attenuation in high-frequency bands. This contributes to the realization of high-speed transmission FFCs. In this instance, we will introduce the replacement of substrate wiring with high-speed transmission FFCs and jumper connections as a case study of BeLight's application. The challenges of implementing high-speed communication using substrate wiring and the benefits of introducing jumper connections using FFCs are as follows: We are also open to discussions regarding sample provision with cables, so please feel free to contact us. 【Challenges of High-Speed Communication with Substrate Wiring】 - High cost of low dielectric substrate materials - Cases where a material change for the entire substrate is necessary - Increased design and manufacturing constraints 【Benefits of Introducing Jumper Connections】 - Reduction in the amount of expensive low dielectric substrate materials used - Increased flexibility in materials, such as utilizing general-purpose substrates (e.g., FR-4) - Reduced layout constraints of substrates due to changes in cable length - Simplification of assembly processes by adopting FFCs