山下マテリアル Product Lineup

The "Normal Type" is a flexible flat cable that replaces FFC with excellent bending and bending resistance. It can be made to your specified length, number of cores, and pitch. It complies with UL certification specifications, and standard products do not require initial costs. 【Features】 ■ Can be made to your specified length, number of cores, and pitch ■ Can comply with UL certification specifications ■ Standard products do not require initial costs *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "LDVS Type with Ear and Notch" features a locking mechanism with protrusions and recesses on the terminal part, tailored to the specifications of the connector. It is particularly suitable for environments with high vibrations, use in equipment under tension, or situations where twisting is applied to the drive part, as it helps prevent connector disconnection. The total length of the cable can be made to your specified length (up to 340mm), number of cores, and pitch. 【Features】 ■ Compatible with the protrusions and recesses of the specified connector terminal ■ Can be made to your specified length, number of cores, and pitch ■ Compliant with UL certification specifications ■ Standard products do not require initial costs *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "LDVS Type Microstrip Line (RFM)" is a high-performance version of the popular YFC series. It uses liquid crystal polymer (LCP), a low dielectric constant material, as the base film to reduce transmission loss. There are types ranging from RFM1 to RFM4, so please check the catalog for details. We offer two types for insulation: one using liquid crystal polymer film and the other using polyimide film. The type using liquid crystal polymer film for insulation aims for further reduction in transmission loss. Please choose according to the scene in which you will be using it. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ The type using polyimide for the coverlay can accommodate hand soldering ■ Improved bending performance due to the adoption of mesh GND *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

The "LVDS Type Strip Line (RFS)" uses liquid crystal polymer, a low dielectric material, as the base film, aiming to reduce transmission loss. Additionally, it is suitable for EMC measures due to the use of a shielding film. The adoption of a mesh ground improves flexibility. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Implements EMC measures with a shielding film ■ Improves bending performance through the adoption of a mesh ground *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "L Shielded Type (SFC)" is equipped with a shield film applied to our YFC. An essential item in scenes where EMC measures are required. The shield film uses a thin membrane, ensuring that flexibility is not compromised. 【Features】 ■ YFC cable using shield film ■ Utilizes thin film shielding ■ Excellent flexibility *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "LVDS Type Coplanar (RFC)" is a high-performance type of the YFC series. It uses liquid crystal polymer, which is a low dielectric constant material, for the base film to reduce transmission loss. There are two types available: one that uses polyimide film for insulation (RFC1) and another that uses liquid crystal polymer film (RFC2). Additionally, due to its coplanar structure with single-sided wiring, it offers the greatest flexibility among our LVDS-compatible flat cables. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Offers the greatest flexibility among LVDS types due to single-sided wiring *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

• Board to FPC connector

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• High frequency/microwave parts
• Wiring materials

Solder resist ink based on silicone resin. 【Features】 ■ Utilizes the properties of silicone resin for "high heat resistance" and "UV resistance" ■ "High heat resistance" = Almost no discoloration or reduction in reflectivity after reflow ■ "UV resistance" = Strong against ultraviolet light, with almost no degradation even under UV-C exposure ■ Although it is silicone resin, it has minimal outgassing, making it safe for use *For more details, please download the PDF or contact us.

• LED Module
• Printed Circuit Board

【Features】 1. High heat resistance: Almost no discoloration of the ink even after heating at "150 degrees for 1000 hours." 2. Cold and heat cycle resistance: No cracks occur even after "3000 cycles from -65 degrees to 150 degrees." 3. Color: Standard green. "Matte black" with reduced reflection. 【Applications】 ■ Solder resist ink for printed circuit boards requiring heat resistance. 【Track Record】 ■ Printed circuit board applications for reliability evaluation tests, e.g., burn-in boards, performance boards, etc. ■ Printed circuit board applications for automotive-related uses. ■ Printed circuit board applications used in harsh environments. *For more details, please download the PDF or contact us.

• Printed Circuit Board

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

We provide high heat-resistant printed circuit boards using Okitsumo's high heat-resistant solder resist ink "TAINEX Series" and FR-4 high heat-resistant grade materials. These boards have excellent heat resistance and can be used in high-temperature environments where standard printed circuit boards are difficult to employ. They are made from halogen-free materials and comply with various environmental regulations. Please feel free to contact us when you need assistance. 【Features】 ■ Continuous heating: 150℃ / 1000h - No swelling or peeling ■ Continuous heating: 175℃ / 1000h - No swelling or peeling ■ Temperature cycle (-65℃ ⇔ 150℃) × 3000 cycles achieved - No swelling or peeling ■ Made from halogen-free materials and compliant with various environmental regulations *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

"ACF connection" allows for the simultaneous connection of multiple electrodes on a substrate through heating and pressurization. It enables reliable connection at fine pitch with low cost. Additionally, compared to connection methods such as soldering or connectors, it offers lightweight, thin design, and low-temperature mounting around 180°C. 【Features】 ■ Simultaneous connection of multiple electrodes on a substrate through heating and pressurization ■ Reliable connection at fine pitch achieved at low cost ■ Lightweight, thin design, and low-temperature mounting around 180°C *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

We would like to introduce the flexible substrates handled by Yamashita Material Co., Ltd. We offer a wide range of products, including the "YFC Normal Type," which can be created in specified lengths, core counts, and pitches, as well as the "High-Temperature Durable and Oil-Resistant FPC," which uses liquid crystal polymer (LCP) for the base and cover materials and has long-term heat resistance of 240°C. Detailed product features, examples of product configurations, and standard specifications are available in our catalog, so please download it for more information. 【Product Lineup (Partial)】 ■ YFC Normal Type ■ YFC Shielded Type ■ YFC Ear Type / Notched Type ■ YFC LVDS Type ■ High-Temperature Durable and Oil-Resistant FPC ■ Long-Term High-Temperature Durable FPC ■ High-Speed Transmission Connector Compatible FPC ■ High-Speed Transmission Multi-Layer FPC ■ High-Density High-Multi-Layer FPC ■ High-Heat-Resistant Heat Dissipation FPC ■ Multi-Layer Coil FPC ■ High-Current FPC with Signal Lines *For more details, please refer to the PDF document or feel free to contact us.

• Board to FPC connector