山下マテリアル Product Lineup

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

The "Ultra-small diameter through hole" is a flexible substrate designed to have holes filled by 15μm through-hole plating. It is possible to form through holes with a diameter of 25μm or less on double-sided flexible substrates. Additionally, we also offer "4-layer filled blind vias," which allow for the filling of blind vias through plating on 4-layer flexible substrates. 【Specifications】 〈Ultra-small diameter through hole〉 ■ Base polyimide: 50μm ■ Conductor thickness: 12μm ■ Hole diameter (entry side): φ20μm ■ Hole diameter (exit side): φ15μm ■ Land diameter: 95μm *For more details, please refer to the PDF document or feel free to contact us.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

The "Normal Type" is a flexible flat cable that replaces FFC with excellent bending and bending resistance. It can be made to your specified length, number of cores, and pitch. It complies with UL certification specifications, and standard products do not require initial costs. 【Features】 ■ Can be made to your specified length, number of cores, and pitch ■ Can comply with UL certification specifications ■ Standard products do not require initial costs *For more details, please refer to the PDF document or feel free to contact us.

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

The "High Heat Resistant Radiation Flexible Printed Circuit Board (FPC)" is an FPC that uses Okitsumo's heat-resistant solder resist "TAINEX." TAINEX is suitable for high-temperature environments up to 150°C and suppresses discoloration during heating. It also achieves radiation heat dissipation, and in our heat dissipation experiments, when combined with a thermal conduction layer, it has been shown to maintain temperatures more than 30 degrees lower compared to typical resist specifications for FPCs. *This result is based on tests conducted on double-sided boards. 【Features】 ■ FPC using Okitsumo's heat-resistant solder resist "TAINEX" ■ Thermal measures: Achieves a radiation rate of over 90% *For more details, please refer to the PDF document or feel free to contact us.

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

The "multi-layer coil flexible substrate" has a conductor thickness of 75μm to 90μm, making it suitable for high current applications compared to standard flexible substrates. It allows for increased winding numbers in a compact space, making it promising for use in motors, power supply coils, and sensor applications. Additionally, it can be bent and integrated into narrow spaces, achieving a flat, thin, and lightweight design. 【Features】 ■ Possible to increase winding numbers in a compact space ■ Achieves a flat, thin, and lightweight design ■ Can be bent and integrated into narrow spaces ■ Expected to be used in motors, power supply coils, and sensor applications *For more details, please refer to the PDF document or feel free to contact us.

"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.

The "slit flexible substrate" is a flexible substrate with excellent bendability that has been processed with slits, allowing for "twisting" and "torquing." It is widely used as an alternative to fine coaxial cables, wire harnesses, and cables for medical devices, and since the spacing and width of the slits can be specified, it offers greater freedom for customers. 【Features】 ■ A bendable cable flexible substrate with 0mm slits processed between patterns ■ Can be used with "twisting" and "torquing" compared to conventional products ■ The spacing and width of the slits can be specified *For more details, please refer to the PDF materials or feel free to contact us.

"Long-Length Flexible Circuit Boards" are ultra-thin and meter-class FPCs. They enable long-distance wiring with ultra-thin cables measuring less than 1mm. While primarily intended for use in medical devices, the width and length of the FPC can be freely determined by the customer, allowing for various applications across different fields depending on ideas. [Features] ■ Capable of long-distance wiring in meter-class ■ Can create ultra-thin cables measuring less than 1mm *For more details, please refer to the PDF document or feel free to contact us.

"ACF connection" allows for the simultaneous connection of multiple electrodes on a substrate through heating and pressurization. It enables reliable connection at fine pitch with low cost. Additionally, compared to connection methods such as soldering or connectors, it offers lightweight, thin design, and low-temperature mounting around 180°C. 【Features】 ■ Simultaneous connection of multiple electrodes on a substrate through heating and pressurization ■ Reliable connection at fine pitch achieved at low cost ■ Lightweight, thin design, and low-temperature mounting around 180°C *For more details, please refer to the PDF document or feel free to contact us.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

We would like to introduce flexible circuit boards suitable for medical device applications among the products we handle. 【Long-Length Flexible Circuit Boards】 By using crank shapes and spiral shapes, we can accommodate lengths in the meter range. ◎Features◎ ■ Capable of manufacturing with a board outline width of less than 1mm ■ Compatible with the mounting of 0402 size components 【Slit Flexible Circuit Boards】 By applying slitting processing, we can achieve a wide range of flexibility, including horizontal and twisting directions. ◎Features◎ ■ Improved bendability and weight reduction ■ Flexible support for the number of slits and slit widths 【Ultra-Fine Circuit Flexible Circuit Boards】 Using the Semi-Adhesive Process (SAP), we can process fine circuits with a minimum L/S of 20/20μm. ◎Features◎ ■ Contributes to miniaturization and weight reduction of products through high density ■ Capable of supporting high-speed communication applications due to the use of LCP as the core material *For more details, please refer to the PDF materials or feel free to contact us.

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.

This product is a high-performance resist ink based on silicone, featuring excellent heat resistance and UV resistance, as well as advanced measures against low molecular siloxanes. It shows minimal discoloration and cracking even under heating and UV environments, making it ideal for coating applications in electronic and electrical components that require high reliability. Particularly, after heat treatment at 320°C for 2 minutes, there is very little change in reflectivity, and no discoloration or cracking is observed (refer to graphs and images). Additionally, even after 2,000 hours of exposure to UV-C (265nm), it maintains a high reflectivity, demonstrating stable performance in deep UV environments. Furthermore, it suppresses the generation of low molecular siloxanes (cyclic siloxanes (D4 to D10)), which can cause contact failures. It can be safely used in clean environments and in situations where the reliability of electronic device contacts is required.

Yamashita Material offers a comprehensive service from FPC manufacturing to component mounting, inspection, and final packaging. We perform fine mounting in-house from 0402 chips to 0603 chips, and we also accommodate high-density mounting such as BGA and wire bonding. We provide flexible support from prototyping to mass production, achieving high-quality and efficient manufacturing with a rapid response time of as short as one day.

In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed

In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality

In the automotive industry, the miniaturization and high performance of electronic devices are advancing, while high reliability is also required. Electronic components must operate stably even in harsh environments such as engine rooms and vehicle interiors, where temperature changes, vibrations, and oil exposure occur. Conventional flexible printed circuits have faced challenges regarding heat resistance and chemical resistance. Our all-LCP flexible printed circuits address these issues and contribute to improving the reliability of automotive electronic devices. 【Application Scenarios】 - Engine control units - In-vehicle displays - Various sensors - ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Stable operation in high-temperature environments - High durability against vibrations and shocks - Suppression of degradation from oil and chemicals - Assurance of long-term product lifespan

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. At the same time, high safety and reliability are required, making electronic components that can perform stably even in harsh environments crucial. Our high heat-resistant, low-loss flexible circuit boards are lightweight yet equipped with high heat resistance, low loss characteristics, and chemical resistance, meeting the stringent demands of aerospace applications. 【Application Scenarios】 * Aircraft * Space probes * Satellites * Electronic devices requiring weight reduction 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Stable operation in harsh environments * High reliability * Increased design flexibility

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments

In the defense sector, the reliability of equipment and long-term operation are required. Particularly for electronic devices used in harsh environments such as temperature changes, vibrations, and shocks, the durability of the substrate is crucial. Conventional substrates may experience performance degradation in high-temperature environments and damage to joints due to vibrations. Our high-heat-resistant, low-loss all-LCP flexible substrates offer high heat resistance, low moisture absorption, and chemical resistance, providing stable performance even in harsh conditions. 【Application Scenarios】 - Military communication equipment - Aerospace equipment - Missile systems - Radar systems 【Benefits of Implementation】 - High reliability in harsh environments - Long product lifespan - Reduction in maintenance costs

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

In the home appliance industry, there is a simultaneous demand for thinner and higher-performance products. To maintain high performance within limited space, it is important to miniaturize the circuit board and reduce the loss of high-frequency signals. Our high heat-resistant, low-loss flexible circuit boards contribute to the improvement of home appliance performance by achieving thinness while providing high heat resistance and low loss characteristics. 【Application Scenarios】 - Thin televisions - Smartphones - Wearable devices 【Benefits of Implementation】 - Miniaturization of products - Reduction of high-frequency signal loss - Improvement of product reliability

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield