Connect Co., Ltd. Product Lineup

The MIWA system is a compact and robust box-type PC ideal for applications in healthcare, edge AI, and factory automation. It supports a wide range of temperatures and offers abundant I/O options, making it the perfect solution for environments where reliability and performance are required.

It is an SBC equipped with an Amston Lake processor, while being a pure picoITX size.

The SGET (Standardization Group for Embedded Technologies), a standardization organization, established the OSM 1.0 standard in 2020. This standard is designed as a highly promising general-purpose standard for small, low-cost embedded computer modules across multiple processor architectures. This kit is provided as a carrier board for OSM-L evaluation/development, offering a wide range of interfaces from legacy to high-speed. Notably, it achieves high compatibility with various OSM modules. Additionally, an optional socket using Pogo pins is available, allowing for the implementation of OSM modules without soldering, making it easy to swap modules and enabling development across multiple architectures on a single board.

The MOSM-MR40E is equipped with the Renesas RZ/V2H processor, integrating a 4-core Cortex-A55 (1.8GHz), a 2-core Cortex-R8, and a 1-core Cortex-M33. Additionally, it achieves a maximum inference performance of 80 TOPS (Sparse) through the DRP-AI3 accelerator. This module features an LPDDR4X interface, two PCIe Gen3 x1 lanes, and four MIPI CSI-2 (4-lane) camera interfaces, providing abundant I/O access within a 662-pin OSM v1.2 Size-L footprint.

The MOSM-MR30E-M is equipped with the Renesas RZ/V2H processor, integrating a 4-core Cortex-A55 (1.8GHz) and Cortex-M33. Additionally, it achieves up to 15 TOPS (Sparse) inference performance with the DRP-AI3 accelerator. This module supports LPDDR4X memory interface and PCIe Gen3 x1, and complies with the OSM v1.2 Size-M (476-pin) standard.