三菱ガス化学株式会社　グリーン・エネルギー＆ケミカル事業部門 Product Lineup

"CYTESTER" is a thermosetting resin with a high glass transition temperature, low dielectric constant, and low dielectric loss tangent. In addition to being used alone, it can also be combined with various thermosetting resins such as epoxy resins. Its features can be utilized in applications such as printed circuit boards, semiconductor encapsulation materials, adhesives, and composite materials. We offer grades suitable for each application. 【Features】 Monomer Cured Product ◎ Low melting viscosity ◎ High heat resistance (Tg≈300℃) ◎ Excellent solvent solubility ◎ Low thermal expansion rate ◎ Low dielectric constant / low dielectric loss tangent ◎ Electrical insulation *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

【Features】 - It has good impregnation and moldability for carbon fibers, resulting in excellent mechanical properties. - Due to its high gas barrier properties, it is expected to reduce the amount of gas leaking from containers and allow for thinner barrier layers and linerless designs. - We have developed grades suitable for filament winding (FW) molding, RTM molding, and more. It can be provided as tow prepreg or resin. It can also be used for coating applications. - It is compatible with various gases, including oxygen, nitrogen, and argon, in addition to hydrogen. *The resin composition can be adjusted according to molding conditions. Please consult us first.

"ENDUREDGE" is a thermosetting prepreg that reduces void formation and achieves a good appearance. The design of the prepreg, which allows for easy gas permeability, reduces the occurrence of surface pinholes and internal voids, resulting in an excellent appearance even in out-of-autoclave molding. Since it can be stored at room temperature, it solves issues that have been challenges for thermosetting prepregs, such as low-temperature transportation, freezing storage, and property degradation due to thawing and refreezing. 【Features】 - A unique design with excellent gas permeability in the thickness direction reduces the occurrence of surface pinholes and internal voids. - Room temperature storage is possible due to a unique resin formulation technology. - It is a high-heat-resistant modified epoxy grade. These features enable a reduction in labor and costs throughout the entire process of transportation, storage, curing, and painting. *For more details, please refer to the PDF document or feel free to contact us.