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"Functional plating" refers to the process of applying plating (also known as electroplating) to various metal materials such as stainless steel, copper alloys, aluminum, and iron, in order to impart various properties, including electrical characteristics like conductivity and electromagnetic wave shielding, chemical characteristics such as corrosion resistance, and physical characteristics like reflectivity and hardness. At Highgent, we specialize in "continuous plating processing," which involves electrochemically depositing metal onto coil-shaped metal materials and pressed materials in a continuous process. Our processing line for continuous plating accommodates a variety of types, allowing us to respond quickly to customer requests and specifications. Additionally, by performing plating processing that attaches high-value metal materials like gold and silver to the surface of the base material, we can enhance value while reducing costs. For more details, please contact us or refer to our catalog.

In high-density mounting that responds to the miniaturization and high functionality of electronic components, measures to prevent the occurrence of whiskers (needle-like metal crystals) that cause circuit short circuits are a concern. Reflow tin plating can reduce the risks associated with whiskers. Specifications for materials that can be reflow tin plated are as follows: Material: Copper, copper alloys, SUS; full plating: thickness 0.8–1.2mm, width 10–300mm; partial plating: thickness 0.15–0.8mm, width 10–65mm; wire plating: size 0.35–1.2mm, round wire, square wire (flat square wire is also available); base materials: copper, nickel. For more details, please contact us or refer to the catalog.

Tin plating, which excels in conductivity, solderability, and corrosion resistance, is suitable for connector terminals that require reliable and stable performance. At Highgent, we produce plating for various applications, including automotive, control panels for industrial equipment, and connector parts for white goods. The specifications for materials that can be tin plated are as follows: Material: copper, copper alloys, SUS, 42 alloy, iron, aluminum; full plating: thickness 0.08 to 2.5mm, width 8 to 300mm; partial plating: thickness 0.1 to 2.5mm, width 10 to 100mm; substrate types: copper and nickel. For more details, please contact us or refer to our catalog.

Gold, known for its exceptional corrosion resistance and beautiful luster, is commonly used for decorative plating; however, at Highgent, we handle functional plating for connectors and other components. As the most stable metal, it contributes to core functions in safety devices such as automotive airbags, where reliable safety is essential, as well as in throttle control systems. Its advantages include low contact resistance and good bonding properties, while its disadvantages include high material costs (solution: partial plating). The specifications for materials that can be gold-plated are as follows: Material: copper, copper alloys, SUS, 42 alloy; Size: thickness 0.1 to 0.8 mm, width 10 to 60 mm; Base layer: copper, nickel; Composite plating: two-color plating with Sn and RSn. For more details, please contact us or refer to our catalog.

Nickel plating, along with copper plating, forms a significant part of scientific plating due to its excellent resistance to high temperatures and high voltages, making it ideal for aluminum wire bonding and applications such as the production of high-voltage inverters. Its shiny appearance and superior corrosion resistance also make it commonly used for metal plating in memory card covers and electromagnetic wave shielding. The advantages include excellent heat resistance, corrosion resistance, wear resistance, and color stability, while the disadvantages include the tendency for thick, shiny plating with high hardness to crack during bending (countermeasure: thin matte plating). The specifications for materials that can be nickel plated are as follows: Material: copper, copper alloys, SUS, 42 alloys, iron, aluminum; full plating: thickness 0.08 to 2.5 mm, width 10 to 300 mm; partial plating: thickness 0.08 to 2.5 mm, width 10 to 290 mm. For more details, please contact us or refer to the catalog.

Silver, with its high melting point, is suitable for parts around automotive engines that are exposed to high temperatures. Hard silver, which has increased hardness, is used in advanced applications in the electrical and electronic fields, including core components of high-tech products like hybrid engines. The specifications for materials that can be silver-plated are as follows: Material: Copper and copper alloys, Size: Thickness 0.1 to 1.5 mm, Width 10 to 150 mm, Center carrier type terminals can also be processed, Base: Copper and nickel, Multicolor plating: Sn plating and two-color plating. For more details, please contact us or refer to the catalog.

Silver, which has excellent electrical conductivity, is suitable not only for soldering in semiconductors but also for bonding gold wires. Among metal materials, it has an outstanding reflectivity and is widely used in high-brightness LED packages with reflector surfaces. 【Features】 ○ Excellent electrical conductivity ・Suitable for soldering as well as bonding gold wires ○ Outstanding reflectivity among metal materials ・Widely used in high-brightness LED packages with reflector surfaces ● Advantages ・Low contact resistance ・Good bonding properties ● Disadvantages ・Discoloration due to sulfur (Countermeasure: sulfur prevention treatment) *For more details, please contact us or download the PDF.

"PPAB" is an aluminum busbar with excellent characteristics manufactured by Nippon Light Metal Co., Ltd. It simultaneously achieves low cost and weight reduction while equipping the various functions required of a busbar. It contributes to improved energy efficiency through weight reduction and ensures a sustainable supply of inexpensive products using aluminum, which is abundant in resources. Additionally, by using recyclable materials, it can reduce waste emissions. 【Features】 ■ Aluminum is approximately 50% lighter than copper (based on conductivity) ■ Suppresses the increase in contact resistance due to aging ■ Low cost: Aluminum is stable and cheaper compared to copper ■ Flexible connectivity ■ Achieves low cost through a hoop-type continuous process from material to plating and pressing *For more details, please refer to the PDF document or feel free to contact us.