エヌ.エフ.ティ List of Products and Services

We would like to introduce a case where our company solved the challenge of wanting to automate the molding process. For products that require a release agent, the existing equipment applied the release agent using a spray (manually), so it was only compatible with AcrossM (manual press). By equipping an automatic spraying mechanism, we made it possible to implement multi-press auto-molding, resulting in a total cycle time reduction of 45 seconds. 【Case Study】 ■ Challenge: For products that require a release agent, the existing equipment applied the release agent using a spray (manually). ■ Solution: By equipping an automatic spraying mechanism, we made it possible to implement multi-press auto-molding, resulting in a total cycle time reduction of 45 seconds. *For more details, please refer to the external link page or feel free to contact us.

• Painting Machine
• Other services

We would like to introduce a case where our company solved the challenge of wanting to automate manual molding and release agent spraying. Products in production must be sprayed with a release agent. Additionally, to prevent uneven spraying, it was necessary to spray by hand, requiring one person per press, which was inefficient and problematic. In response, our company developed a device equipped with an automatic release agent spraying mechanism. By incorporating a spraying nozzle, it became possible to apply the release agent during a series of molding cycles. The tip nozzle also adopted a design to prevent liquid dripping and clogging, significantly improving maintenance. 【Case Study】 ■ Challenges - Products in production must be sprayed with a release agent. - To prevent uneven spraying, it was necessary to spray by hand, requiring one person per press, which was inefficient. ■ Solution - Our company developed a device equipped with an automatic release agent spraying mechanism. - Productivity increased by 10% annually compared to existing manual presses. *For more details, please refer to the external link page or feel free to contact us.

• Other services

We would like to introduce a case where we solved the issue of needing frequent release recovery shots and poor productivity. They were struggling with the need to stop the machine every time and manually perform release recovery shots, wanting to improve production efficiency. Therefore, we implemented automatic release recovery shots at arbitrary frequencies during production. We successfully achieved a significant increase in productivity. 【Case Study】 ■ Issue: Frequent release recovery shots are needed, and productivity is poor. ■ Solution: Added automatic release recovery shot function to N.F.T manufactured automatic molding machine. *For more details, please refer to the external link page or feel free to contact us.

• Other services

We would like to introduce a case where our company resolved issues with aging existing equipment. We were facing difficulties in resolving equipment troubles due to reasons such as the original manufacturer being unable to respond or the manufacturer no longer existing. Therefore, since our company has a wealth of experience in manufacturing and repairing parts for equipment from other companies, we were able to assist in resolving the issues. When problems arise, we also conduct on-site equipment checks and meetings. 【Case Study】 ■ Issues - Troubles with aging existing equipment - The original manufacturer is unable to respond, or the manufacturer has gone out of business ■ Solutions - We have extensive experience in manufacturing and repairing parts for equipment from other companies, allowing us to assist in resolving issues - When problems occur, we conduct on-site equipment checks and meetings *For more details, please refer to the external link page or feel free to contact us.

• Calibration and repair

We would like to introduce a case where our company solved the issue of resin leakage in slit-type packages for a client. The resin leakage was affecting the substrate ball pad area, resulting in poor yield and causing difficulties. By utilizing NFT design and polishing technology, we successfully stopped the resin leakage by creating two fine grooves in an area of 0.5mm width. [Case Study] ■ Issue: Continuous resin leakage in slit-type packages ■ Solution: Carving multiple fine grooves horizontally on the package to stop the leakage *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We had a challenge with poor plating caused by resin bleeding into the lead section. Here, we would like to introduce a case where our company provided a solution. Although the frame was changed, there was no improvement, and we were struggling to find a solution through mold modifications. In this case, while the usual polishing direction of the parting surface is longitudinal, we changed the polishing direction of the parting surface to the transverse direction (perpendicular to the L/F rolling direction) as a countermeasure against base resin bleeding occurring in the L/F substrate rolling roll. As a result, we were able to successfully reduce the bleeding. [Case Study] ■ Issue: Poor plating due to resin bleeding into the lead section ■ Solution: Improvement through polishing of the parting surface *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the issue of productivity not improving due to the occurrence of upper and lower mold misalignment adjustment work with existing molds. The standards for upper and lower mold misalignment were strict, making fine adjustments difficult, and even after reassembling, the issue was not easily resolved. In response, we manufactured an eccentric set block that can be adjusted on the press. As a result, we were able to reuse major components, eliminate mold misalignment at a low cost, and significantly reduce adjustment time. 【Case Study】 ■ Issue: Occurrence of upper and lower mold misalignment adjustment work with existing molds, leading to no improvement in productivity ■ Solution: Significant reduction in adjustment time with an eccentric guide block *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the issue faced by a client regarding the rapid wear and short lifespan of the gate and runner sections of power-type mold dies. The encapsulation resin for power semiconductors contains a high amount of silica, and the surface treatment of standard mold dies (HCr) has a hardness of HV800 to 1000, which is soft and leads to rapid wear. Therefore, by changing the surface treatment of the gate and runner sections and increasing the hardness to more than twice (HV1800 to HV2000), we successfully extended the lifespan by three times. [Case Study] ■ Issue: Rapid wear and short lifespan of the gate and runner sections of power-type mold dies ■ Solution: Tripled lifespan through changes in mold surface treatment *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the issue faced by a client regarding the short lifespan of movable pins and sleeves in power-type packages. This resulted in opportunity losses and increased lifecycle costs. By utilizing our unique NFT technology to double the hardness of the movable pins, we successfully extended their lifespan by three times. [Case Study] ■ Issue: Short lifespan of movable pins + sleeves (2 months) ■ Solution: Increased hardness of movable pins, extending lifespan to three times (6 months) *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the challenge faced by a client who wanted to easily change the thickness of their products. Previously, changing the thickness of BGA products required replacing the entire cavity set. Therefore, we changed to a new design with an upper mold cavity insert method. Thanks to the discharge precision of the cavity surface and the polishing precision of the spacer thickness that NFT possesses, we were able to meet the strict product thickness requests from Company P. [Case Study] ■Challenge: Wanting to easily change product thickness ■Solution: Achieved thickness change through spacer replacement *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the challenge faced by a client who wanted to secure profits from discrete (general-purpose) products. In response to this challenge, we changed the mold design. As a result, the number of units produced significantly increased, achieving 7072 PKG/Shot. [Case Study] ■Challenge: Wanted to secure profits from discrete (general-purpose) products ■Solution: Increased production significantly by changing the mold design, achieving 7072 PKG/Shot *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the persistent issue of voids in lens package transparent resin, which could not be eliminated despite various changes in molding conditions. To address this challenge, we implemented the manual press AcrossM with a degassing unit. As a result, digital control of degassing, pressing, and transfer timing became easier, and the voids were eliminated. Furthermore, with NFT mold design that takes into account factors such as number of cavities, dummy cavities, corner radii, and draft angles, we have achieved improvements not only in voids but also in mold release. [Case Study] ■ Challenge: Voids persist ■ Solution: Eliminated with degassing unit *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where we solved the challenge faced by a company that needed to quickly obtain samples of reflector products. To secure orders from end users, it was necessary to create prototype molds as quickly as possible, submit samples, and ensure quality. In response, we conducted a design meeting on the same day we received the order, swiftly progressed through the design and manufacturing process, and delivered the prototype molds in time for the requested sample delivery date. After that, we achieved a uniform finish on the product surface with our unique finishing process, satisfying the quality requirements. [Case Study] ■ Challenge: Urgently needed samples of reflector products ■ Solution: Quick response to delivery deadlines and unique surface finishing *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

We would like to introduce a case where our company solved the challenge faced by a client who wanted to conduct trial runs domestically in Thailand without shipping molds overseas. There were no mold manufacturers in Thailand conducting trial runs for overhaul molds; all were sent to the manufacturing country, incurring time and costs. At our factory in Thailand (NI Thailand), we can perform trial pressure tests, allowing for local engineers to oversee the process within Thailand. This also contributes to the skill enhancement of the client's local representatives, and by not shipping molds overseas, we can reduce transportation costs and shorten construction periods. [Case Study] ■ Challenge: Wanting to conduct trial runs domestically in Thailand without shipping molds overseas ■ Solution: Introduced trial pressure presses at the NFT Thailand factory, enabling local support *For more details, please refer to the external link page or feel free to contact us.

• Other contract services
• Other molds

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a delivery record in 11 countries, primarily in Japan and Southeast/East Asia, and we provide a wide range of services with advanced technology based on our achievements in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units EDM machines - 26 units Wire EDM machines - 8 units Small hole EDM machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *Additionally, we are equipped with various measuring instruments, inspection equipment, pressure testing presses, and jigs. Please feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a track record of deliveries in 11 countries, primarily in Japan and Southeast/East Asia, and we respond broadly with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units EDM machines - 26 units Wire EDM machines - 8 units Small hole EDM machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *We also have various measuring instruments, inspection equipment, pressure testing presses, and jigs available. Please feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a delivery record in 11 countries, primarily in Japan and Southeast/East Asia, and we offer a wide range of services with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units Electrical discharge machines - 26 units Wire electrical discharge machines - 8 units Small hole electrical discharge machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *We also have various measuring instruments, inspection equipment, pressure testing presses, and jigs available. Please feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, specializing in the design and manufacturing of semiconductor encapsulation molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a delivery record in 11 countries, primarily in Japan and Southeast/East Asia, and we offer a wide range of services with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units Electrical discharge machines - 26 units Wire electrical discharge machines - 8 units Small hole electrical discharge machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *We also have a variety of measuring instruments, inspection equipment, pressure testing presses, jigs, etc. Please feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a track record of deliveries in 11 countries, primarily in Japan and Southeast/East Asia, and we provide a wide range of services with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units Electrical discharge machines - 26 units Wire electrical discharge machines - 8 units Small hole electrical discharge machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *Additionally, we have various measuring instruments, inspection equipment, pressure testing presses, and jigs available. Please feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor encapsulation molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a delivery record in 11 countries, primarily in Japan and Southeast/East Asia, and we provide a wide range of services with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units Electrical discharge machines - 26 units Wire electrical discharge machines - 8 units Small hole electrical discharge machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *Additionally, we are equipped with various measuring instruments, inspection equipment, pressure testing presses, jigs, etc. Please feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, specializing in the design and manufacturing of semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. With a proven track record in 11 countries, primarily in Japan and Southeast/East Asia, we are trusted for our advanced technology and wide-ranging capabilities. We mainly focus on semiconductor manufacturing equipment and precision molds, and we also offer customization and development based on your concerns and requests. Please feel free to consult with us. 【Business Activities】 ■ Design and manufacturing of semiconductor packaging molds and components ■ Design and manufacturing of semiconductor manufacturing equipment, related parts, and peripheral units *For more details, please refer to the PDF materials or feel free to contact us.

• Mold Design
• Other semiconductor manufacturing equipment

We would like to introduce a case where our company provided technical guidance to companies that had identified the improvement of their in-house assembly engineers' skills as a challenge. Companies S and R were concerned about their in-house engineers' skills in disassembling and assembling molds, which led to frequent part breakages. Our company invited key engineers from each company to N.F.T, where they received one-on-one instruction on assembly techniques and maintenance from N.F.T mold assembly engineers. Subsequently, the key engineers were able to provide similar guidance to other engineers, resulting in an overall improvement in technical skills, a reduction in part breakages, and a decrease in costs. [Case Study] ■ Challenge: Urgent need to improve engineers' skills ■ Solution: Guidance from N.F.T assembly engineers *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services
• Technical Seminar

We would like to introduce a case where we assisted a company that was unable to produce prototype samples due to a malfunction in their in-house prototype press and the use of other equipment for mass production, by utilizing our "N.F.T Prototype Press." 【Case Study】 ■ Issue: Unable to take samples due to prototype machine malfunction ■ Solution: Addressed with the N.F.T Prototype Press Our company possesses various pressure testing die sets (bases), allowing us to take samples with molds from any manufacturer. We provide services from sample creation to sample measurement, tailored to the molding conditions used in prototypes. *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services
• Contract manufacturing
• Prototype Services

By adopting linear motors for the first time in the world, we have realized a module 5 press machine with no idling time. This improves throughput by approximately 35% compared to conventional equipment (4 press machines). Additionally, we have introduced the latest equipment to many drive axes, diversifying from traditional air cylinders to motors. This has enabled numerical control via a touch panel, moving away from analog adjustments based on air flow. At the same time, we have minimized maintenance costs associated with parts replacement due to aging. Furthermore, the design is simple and offers many options and customization capabilities. - Addition of a release agent spraying mechanism during automatic operation / Heat sink transport using 3 carriers / Automatic release shot added to the cycle / 4-piece molding (4byX)

• Molding Equipment

N.F.T. Corporation specializes in the design and manufacturing of semiconductor encapsulation molds and components, as well as the design and manufacturing of semiconductor equipment, industrial automation devices, and semiconductor manufacturing-related equipment and machinery. Our experienced technical team works diligently to provide products that satisfy our customers, so please feel free to consult with us. [Example of Our Products] ■ Automatic Molding Device "Across 2by X" - Supports up to 5 presses - 60/100/120 ton presses - Patent pending (Japan) ■ Automatic Molding Device "Across R2" - 60/100/140 ton presses - Dual press operation - Patent No. 3926379 (Japan), Patent No. I331080 (Taiwan), Patent No. ZL 2007 1 0112507.6 (China) For more details, please contact us or download the catalog.

• Mold Design
• Other semiconductor manufacturing equipment

The servo manual press "Across M" is a manual molding device with a smart design and easy operation. It accommodates lead frames measuring 80mm in width and 280mm in length, suitable for various molded products, and allows for the setting of 5-step injection conditions. It is equipped with a data storage function compatible with memory cards (CF64M). 【Features】 ○ Compatible with molds from other manufacturers ○ Slim design and easy-to-use operation panel → TFT 8” display → Soft touch operation → Open on both sides of the press For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across M" is a Manual Molding system. Great Support for Package. Developments & Mold Cleaning. <Features> ○Applicable to Various Molds →Applicable lead frame: 80mm(W)×280mm(L) →Convertible to various molded items →“5-step” transfer condition setting ○Slim Design & User-Friendly panel →TFT8" display →Soft-touching operation →Data-saving function, memory card applicable (CF64M) →Openable side covers For more details, please contact us or download the catalog. *This catalog is in English.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across R2-60" is an all-view and easy-access auto molding device. It accommodates lead frames measuring 80mm in width and 280mm in length, suitable for various molded products, with a conversion time of 30 minutes per person. It features a large cover, simple structure, and easy maintenance. 【Features】 ○ Servo clamp: 60 tons ○ Compatibility with different package types (conversion) ○ Innovative design and rotary table structure → Pre-heater and lower gate break plate are placed on the table ○ Patent No. 3926379 For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across R2-60" is a single press auto-molding system. <Features> ○Servo-clamp pressure: 60 tons ○Conversion to LSI, discrete, power IC, BGA →Applicable lead frame: 80mm(W) x 280mm(L) →Convertible to various molded items →Time required for conversion: 30 min./person ○Innovative Design & Rotating Table Structure →Pre-heater & lower gate breaker above the table →Large cover, simple structure & easy maintenance ○Patent No. 3926379 For more details, please contact us or download the catalog. *This catalog is in English.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across R2-100" is an all-view and easy-access automolding device. It accommodates lead frames measuring 80mm in width and 280mm in length, suitable for various molded products, with a conversion time of 30 minutes per person. It features a large cover, simple structure, and easy maintenance. 【Features】 ○ Servo clamp: 100 tons ○ Compatibility with different types of packages (conversion) ○ Innovative design and rotary table structure → Preheater and lower gate break plate are placed on the table ○ Patent No. 3926379 For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across R2-100" is a single press auto-molding system. <Features> ○Servo-clamp pressure: 100 tons ○Conversion to LSI, discrete, power IC, & memory →Applicable lead frame: 80mm(W) x 280mm(L) →Convertible to various molded items →Time required for conversion: 30min./person ○Innovative Design & Rotating Table Structure →Pre-heater & lower gate breaker above the table →Large cover, simple structure & easy maintenance ○Patent No. 3926379 For more details, please contact us or download the catalog. *This catalog is in English.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across R2-140" is an all-view and easy-access automatic molding device. It accommodates lead frames measuring 80mm in width and 280mm in length, suitable for various molded products, with a conversion time of 30 minutes per person. It features a large cover, simple structure, and easy maintenance. 【Features】 ○ Servo clamp: 140 tons ○ Compatibility with different types of packages (conversion) ○ Innovative design and rotary table structure → Preheater and lower gate break plate are placed on the table ○ Patent No. 3926379 For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment
• Molding Equipment

"Across R2-140" is a single press auto-molding system. <Features> ○Servo-clamp pressure: 140 tons ○Conversion to LSI, discrete, power IC, & memory →Applicable lead frame: 80mm(W) x 280mm(L) →Convertible to various molded items →Time required for conversion: 30min./person ○Innovative Design & Rotating Table Structure →Pre-heater & lower gate breaker above the table →Large cover, simple structure & easy maintenance ○Patent No. 3926379 For more details, please contact us or download the catalog. *This catalog is in English.

• Other semiconductor manufacturing equipment
• Molding Equipment