上村工業 Product Lineup

The "Flow-through Plating System RP-2" is a fully automated plating device specifically designed for small items. A series of processes such as the first plating, rinsing, and second plating can be performed within a single module, and if the processing volume increases, additional modules can be added to accommodate it. Based on this product, we also offer the "RP-2FA," which has been developed to enhance productivity and achieve labor-saving and unmanned operations through full automation. 【Features】 ■ Capable of high current density (high-speed) plating ■ Plating of fine powders (10-50μm) is possible by changing the filter ■ The amount of liquid carried in/out and the generation of gas/mist are drastically reduced compared to conventional devices ■ A series of processes such as the first plating, rinsing, and second plating can be performed within a single module ■ If the processing volume increases, additional modules can be added to accommodate it *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

The "U-VCPS" is a fully automatic vertical transport continuous plating device without an upper and lower mechanism, designed for PKG/HDI substrates. It features a simple mechanism with only an upper clamp, capable of handling thin substrates of less than 50μm. The device has a sealed structure, is environmentally friendly, and its simple design makes maintenance easy. We also offer the "U-VCP," a vertical transport continuous electroplating device with a simple structure that minimizes the occurrence of failures. 【Features】 ■ Designed for PKG/HDI substrates ■ Simple mechanism with only an upper clamp ■ Capable of handling thin substrates of less than 50μm ■ Simple structure for easy maintenance ■ Efficient material transfer achieved through a unique circulation method *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

This product is a distribution-type electrolytic regeneration device that addresses previous issues such as space-saving and improved maintenance. By using a piping-shaped electrolytic regeneration unit, we have achieved space-saving without the need for an electrolytic regeneration tank. Continuous regeneration is possible through the use and cleaning of each unit, contributing to the reduction of processing chemicals. 【Features】 ■ Achieves space-saving without using an electrolytic regeneration tank ■ Continuous regeneration possible through the use and cleaning of each unit ■ Contributes to the reduction of processing chemicals ■ Sealed design provides a good working environment *For more details, please refer to the PDF materials or feel free to contact us.

• Other machine elements

The "UF Career" is a fully automatic programmable plating device that has received extremely high evaluations and achievements in terms of functionality and reliability since its release. It is a system that can handle everything from small items to large items, as well as a mixture of various processing items, and it automatically processes them through programming methods, such as rack processing, barrel processing, and basket processing. The stable functionality and the rich system that accommodates various specifications can be safely used in the precise manufacturing process of printed circuit boards. Additionally, we also offer a fully automatic plating device with a continuous transport system known as the "Elevator Type." 【Features】 ■ A system that mixes various processing items ■ Automatic processing through programming methods ■ A rich system that accommodates stable functionality and various specifications ■ Safe for use in the precise manufacturing process of printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

• Plating Equipment

The "Chemirobo Series" is a precious metal plating solution management device for UBM processes that does not require memorizing complex operations and can be easily operated. It includes the dedicated controller "Chemirobo 3 PDS" for managing the palladium concentration, B agent concentration, M agent concentration, and pH of the electroless palladium plating bath, as well as the dedicated controller "Chemirobo 3 TEPR" for managing the gold concentration, A agent concentration, M agent concentration, and pH of the electroless gold plating bath. Measurement results are displayed as graphs and numbers on a color touch panel, allowing for an immediate understanding of the plating solution management status. 【Features】 ■ Measurement results are displayed as graphs and numbers on a color touch panel ■ The plating solution management status can be easily understood at a glance ■ All device operations are performed via the touch panel ■ No need to memorize complex operations ■ Easy to operate *For more details, please refer to the PDF document or feel free to contact us.

• controller

This catalog is a comprehensive catalog featuring surface treatment-related equipment from Uemura Kogyo Co., Ltd., which manufactures and sells plating machines. It includes various products such as the dedicated plating device for PWBs, "Vertical Transport Continuous Plating Device U-VCP," as well as carrier types and elevator types. [Contents] ■ Vertical Transport Continuous Plating Device U-VCPS ■ Vertical Transport Continuous Electroplating Device U-VCP ■ UBM Plating Device SpeedPlater UBM ■ Carrier Type ■ Elevator Type ■ Dedicated Plating Device for Small Items, etc. *For more details, please download the PDF or feel free to contact us.

• Plating Equipment
• Other surface treatment equipment