共立エレックス List of Products and Services

Product Lineup ■ Ceramic Substrates - Alumina Ceramic Substrates - Zirconia Ceramic Substrates ■ Printed Circuit Ceramic Substrates - Thick Film Printed Circuit Ceramic Substrates - Fine Printed Circuit Ceramic Substrates ■ Ceramic Substrate Application Products - Ceramic Materials for LED Packages - Ceramic Materials for All-Solid-State Batteries - Ceramic Materials for Ceramic Tile Crafts ■ Functional Ceramic Materials - High Reflective Ceramic Materials - Porous Alumina Ceramic Substrates (Setters) - Powder Forming Ceramics

We have released a video regarding the fire resistance testing of our "5V-A Non-Flammable Sheet." This product is a self-extinguishing non-flammable sheet that has passed the flame retardant grade 5V-A based on the UL94 standard. The content is easy to understand compared to products from other companies and initial development products, so please take a look. *For more details, please refer to the related links or feel free to contact us.

The "5V-A Non-combustible Sheet" is a self-extinguishing non-combustible sheet that has passed the flame retardancy test based on the UL94 standard, achieving the flame retardant grade 5V-A. Sheets can be created to meet specific requirements such as hardness, heat resistance, and strength. We can accommodate small-scale prototypes of about 200mm in width and approximately 10m in length. 【Examples of Use】 ◎ For circuit board design of high-power semiconductors ◎ To prevent ignition and flame spread in battery modules ◎ To prevent flame spread in high-voltage power supply cables *For more details, please contact us.

The newly developed product "High Flame Retardant and High Thermal Conductivity Resin Sheet" is a non-combustible sheet with high flame resistance rated "5VA" according to UL94 standards. It can also be used as a thermal conductive resin sheet with high thermal conductivity (4.5W/m·K) while maintaining insulation properties. 【Features】 - High flame resistance: UL94 standard "5VA grade" - High thermal conductivity: 4.5W/m·K - Contains no halogen-based flame retardants, thus "no generation of toxic chlorine gas during combustion" - Sample size provided: up to 190mm x 190mm (MAX) 【Applications】 - To prevent flame spread in high-voltage power supply cables - To suppress flame spread during thermal runaway in battery modules - To improve heat dissipation performance in power semiconductor modules *For more details, please contact us.

"Setter Ceramic Base Plate with Micro-Convex Shape Processing" We often hear requests regarding the production efficiency and manufacturing quality of ceramic base plates used for setters in the firing process. For example, requests include "I want to improve the debinding performance," "I want to suppress sticking against the shrinkage of the fired items (work)," and "The work sticks after firing!" among various others. By using this "Setter Ceramic Base Plate with Micro-Convex Shape Processing," we contribute to improving the production efficiency and manufacturing quality of the firing process. Additionally, we have received feedback from customers who previously used "filling powder" on the setter, stating not only improvements in "workability" but also that "the clogging in the vacuum furnace piping has improved." If you are a user facing such issues in the firing process, please feel free to reach out to us.

■Background We have developed a ceramic substrate optimized for "firing setters" by leveraging the characteristics of porous ceramics and utilizing our in-house integrated processes, such as printing on fired ceramic substrates, to meet the increasingly diverse needs of customers utilizing firing processes. Recommended for those who want to "fire more at once!" ■Usage Improving production efficiency in "batch vacuum furnaces" used in firing processes is a significant challenge. We often hear requests to "fit as many works as possible into a single firing process." By utilizing the "manufacturing technology for thin ceramic substrates" that we have cultivated, it is possible to increase the number of setter layers. This allows for an increase in the number of works that can be fired in a single process. In cases where there are space constraints in a firing furnace as illustrated, replacing conventional ceramic plates (7mm thick) with "our ceramic substrates for firing setters (1mm thick)" enables an increase in the number of shelf layers from 16 to 18, resulting in a 12% improvement in firing loading efficiency. Additionally, even with the same number of works, "thicker works" can be fired, allowing for a wider range of applications for the firing furnace.

Printing film materials ■ Silver ■ Silver-platinum ■ Silver-palladium ■ Platinum ■ Copper ■ Gold ■ Ruthenium ■ Glass (insulating) Plating surface treatment for printed circuit boards - Compatible with both electroplating and electroless plating Plating types ■ Nickel ■ Palladium ■ Gold ■ Silver ■ Copper ■ Others

Printing film materials ■Silver ■Silver-platinum ■Silver-palladium ■Platinum ■Copper ■Gold ■Ruthenium ■Glass (insulating)

Laminated processing allows for the thickening of ceramic substrates. The photo above shows a 2mm thick ceramic substrate created by stacking two 1mm thick green sheets that were formed and coated, followed by firing.

Flexible Ceramic Substrates Utilizing Toughness" Flexible Zirconia Ultra-thin Zirconia Ceramic Substrates Zirconia possesses strong toughness. By combining this with our thin ceramic substrate manufacturing technology, we have realized "flexible ceramic substrates." The ultra-thin ceramic substrate (thickness: 50μm) is also transparent and has the potential to achieve substrate thinning, positioning it as a "next-generation ceramic substrate.

Ceramic materials for all-solid-state batteries expected as next-generation energy storage devices All-solid-state batteries are anticipated to be applied in a wide range of fields, from mobile devices to electric vehicles, as next-generation energy storage devices. Our company has commercialized ceramic materials for all-solid-state batteries through joint research with AIST*. *National Institute of Advanced Industrial Science and Technology (Licensed under Patent No. 5907571 and Patent No. 6326699) It is an electrolyte substrate primarily composed of "LATP (Li1.3Al0.3Ti1.7(PO4)3)" with a NASICON-type crystal structure, and the ionic conductivity is approximately 7×10^-4 S/cm.

Porous ceramics are ceramics that have countless pores (porosity) inside. The presence of porosity reduces thermal conductivity and makes the material lightweight. Due to their extremely high permeability, they are used as setters in the firing process, resulting in excellent firing quality. Our porous ceramic substrates have a proven track record in processes such as "binder removal promotion" and "improvement of firing efficiency through multi-layer stacking" in the firing of ceramic products like ferrite substrates and metal injection molding (MIM) products.

Ceramic packaging technology that responds to advances in LED technology LEDs, as light-emitting devices, are increasingly being adopted not only for lighting applications but also in a wide range of fields such as home appliances, information devices, and medical equipment, with rapid advancements in high brightness and short wavelength. Consequently, various demands are being placed on LED package materials. Our company is advancing development to meet the "diverse customer needs for various LED packages" by leveraging our integrated manufacturing process from ceramic substrate production to printed circuit formation. We are preparing a "diverse lineup" for various applications of LED devices and "heat dissipation measures" aimed at the rapidly advancing high-power LEDs. We are progressing with technology development that can respond to various application possibilities, and we look forward to your inquiries.

Our company utilizes over 50 years of experience in manufacturing ceramic products to produce and sell ceramic plaques and monuments used as art crafts. We burn images and illustrations onto ceramic plaques using a special method. Since there is no concern about fading, we create art crafts made from ceramic materials that are suitable for outdoor installation. Ceramic photo plaques (various commemorative photos, pet photos), commemorative ceramic plaques, ceramic guide signs, and ceramic tiles are also ideal for gifts and souvenirs. Please feel free to consult with us.

Ceramic substrate with high reflectivity characteristics We can provide high reflectivity ceramic substrates made from alumina ceramics as the base material. Since no special additives or coatings are used in the manufacturing process, there is no concern about contamination in subsequent processes. It is possible to accommodate mass production equivalent to existing products, as equipment for conventional alumina substrates can be shared. Additionally, because it is composed of existing raw material groups, it does not contain any substances regulated by environmental regulations.

In particular, with high-brightness LEDs, it has become difficult to implement heat resistance measures with resin package specifications, making alumina ceramics materials indispensable for heat dissipation and heat resistance. Additionally, due to the recent increase in demand for ultraviolet LEDs, interest in ceramic packages has been rising. Our company offers ceramic package substrates with excellent heat resistance characteristics based on our unique technology. Our unique technology for "improving heat dissipation performance" has become increasingly important alongside the high brightness (high output) of LED elements, leading to a significant rise in the demand for heat resistance in packaging materials and heat dissipation characteristics. We have received many inquiries regarding "improving heat dissipation using a general-purpose alumina ceramics substrate compared to a heat-dissipating aluminum nitride substrate." By applying our unique printed circuit technology, we process through-holes in the alumina ceramics substrate and fill the through-hole sections with "special silver-based materials," achieving a higher heat dissipation effect than typical alumina ceramics substrates.

In recent years, as the miniaturization, lightweight design, and high performance of electronic devices have progressed, the demands for high implementation and high density in circuit board packages have been increasing year by year. To meet these demands, our company is leveraging its thick film printed circuit board (through-hole) technology to develop even more delicate pattern printing techniques.