共立エレックス List of Products and Services

1. Molding Technology for Ultra-Thin Ceramic Sheets Our company employs a doctor blade method for the coating process of green sheets. We mix carefully selected ceramic raw materials and resin materials, and by molding sheets using the doctor blade method, we produce green sheets with stable thickness and strength. With high-precision gap management of the blade, we are able to achieve green sheets as thin as 20 micrometers. (We are also developing coating technology for layers as thin as 5 micrometers.)

Improving production efficiency in the "batch-type vacuum sintering furnace" used in the sintering process is a significant challenge. One proposal is to enhance production efficiency through "multi-layer stacking." By replacing the conventional ceramic support plate (7mm thick) with "our ceramic substrate for sintering setters (1mm thick)," it becomes possible to increase the number of shelf layers from 16 to 18, resulting in a 12% improvement in sintering loading efficiency. Additionally, it allows for "thicker workpieces" to be sintered with the same number of workpieces, enabling broader utilization of the sintering furnace. The second proposal is "micro-convex porous ceramic processing." Among the process conditions that affect sintering quality, "debinding performance and characteristics" are crucial, and various porous ceramic materials are being utilized creatively. In addition to these porous ceramic substrate technologies, using ceramic support plates for setters that have undergone "micro-convex porous ceramic processing" allows for space to be secured at the bottom of the sintering workpieces, thereby improving debinding efficiency and performance.

Technology for Forming Printed Circuits on Ceramic Substrates Our company utilizes technology for forming printed circuits for electronic component applications on ceramic substrates manufactured in-house, all handled through an integrated in-house process. By using screen printing methods, we can offer custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they provide stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.

Notice from Kyoritsu Elex - - - - - - - - - - - - - - - - - - - - - - - - - JPCA Show 2025 (Printed Circuit Board Technology Exhibition) Location: (Tokyo Big Sight) June 4 (Wednesday) to June 6 (Friday), 2025, for 3 days - - - - - - - - - - - - - - - - - - - - - - - - - We look forward to seeing you. Our company offers circuit formation for electronic component applications using the technology of printed circuit formation on ceramics substrates manufactured in-house, all through a consistent in-house process. By utilizing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they achieve stable performance and high reliability. The printed materials are not limited to wiring materials (metal paste) but also include insulating glass materials and ceramics, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, so we look forward to your inquiries.

We have released a video regarding the fire resistance testing of our "5V-A Non-Flammable Sheet." This product is a self-extinguishing non-flammable sheet that has passed the flame retardant grade 5V-A based on the UL94 standard. The content is easy to understand compared to products from other companies and initial development products, so please take a look. *For more details, please refer to the related links or feel free to contact us.

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

Product Lineup ■ Ceramic Substrates - Alumina Ceramic Substrates - Zirconia Ceramic Substrates ■ Printed Circuit Ceramic Substrates - Thick Film Printed Circuit Ceramic Substrates - Fine Printed Circuit Ceramic Substrates ■ Ceramic Substrate Application Products - Ceramic Materials for LED Packages - Ceramic Materials for All-Solid-State Batteries - Ceramic Materials for Ceramic Tile Crafts ■ Functional Ceramic Materials - High Reflective Ceramic Materials - Porous Alumina Ceramic Substrates (Setters) - Powder Forming Ceramics

Utilizing the toughness of "bendable ceramic substrates," we offer them as "next-generation ceramic substrates," enhancing their value as components. Bendable zirconia Ultra-thin zirconia ceramic substrate Zirconia possesses strong toughness (characteristics). By combining it with the manufacturing technology of ultra-thin ceramic substrates from a specialized high-performance ceramic substrate manufacturer, we can achieve bendability while maintaining its ceramic nature. The ultra-thin ceramic substrate (thickness: 50μm) also has transparency, offering possibilities such as achieving thinner substrate layers.

"Providing split slits for individualization through mold forming" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individualization)" makes individualization easy.

Printing film materials ■ Silver ■ Silver-platinum ■ Silver-palladium ■ Platinum ■ Copper ■ Gold ■ Ruthenium ■ Glass (insulating) Plating surface treatment for printed circuit boards - Compatible with both electroplating and electroless plating Plating types ■ Nickel ■ Palladium ■ Gold ■ Silver ■ Copper ■ Others

Printing film materials ■Silver ■Silver-platinum ■Silver-palladium ■Platinum ■Copper ■Gold ■Ruthenium ■Glass (insulating)

Laminated processing allows for the thickening of ceramic substrates. The photo above shows a 2mm thick ceramic substrate created by stacking two 1mm thick green sheets that were formed and coated, followed by firing.

Mold Press Processing of Green Sheets Our ceramic substrate manufacturing involves firing green sheets made from blended raw materials that have been coated onto sheets. These green sheets are soft and in sheet form before sintering, making processes such as slitting and mold processing relatively easy. By applying press processing using high-precision molds for these sheet processes, we can accommodate processing specifications such as "non-standard shapes," "through holes," and "split slits" for the ceramic substrates after sintering.

With the increase in brightness (high output) of LED elements, the importance of heat resistance in packaging materials has grown significantly, along with the demand for heat dissipation characteristics. We have received many inquiries regarding heat dissipation measures, particularly about "improving heat dissipation using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which have excellent heat dissipation properties." Our company applies unique printed circuit technology to process through-holes in alumina ceramic substrates and fills the through-hole sections with "special silver-based materials," achieving higher heat dissipation effects than typical alumina ceramic substrates.

Our company has a consistent in-house manufacturing process that includes the formulation of ceramic raw materials, green sheet coating, high-temperature sintering, and the subsequent circuit formation, all managed under our own quality and delivery standards. We have a wealth of experience in providing various ceramic components, primarily for electronic device applications such as LED packages, and we are advancing new technology development to meet the diverse needs of our customers. Here are some of our "strength points" from a technical perspective: 1. Forming technology for ultra-thin ceramic sheets 2. Mold pressing technology with high dimensional accuracy 3. High-temperature stable sintering technology with precise temperature control 4. Fine circuit printing technology and uniform film formation technology within through-holes 5. Leveraging our extensive accumulated technology to meet customer requirements.

Mold Press Processing for Green Sheets Our ceramic substrate manufacturing involves firing green sheets, which are coated sheets made from blended raw materials. These green sheets are soft and in sheet form before sintering, making processes like slitting and mold processing relatively easy. By applying press processing using high-precision molds for these sheet processes, we can accommodate processing specifications such as "irregular shapes," "through holes," and "split slits" on the ceramic substrates after sintering.

Technology for Forming Printed Circuits on Ceramic Substrates Our company offers a comprehensive in-house process for forming circuits aimed at electronic component applications on ceramic substrates manufactured internally, utilizing advanced printed circuit formation technology. By employing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, the printed materials undergo high-temperature baking (850°C), ensuring stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also the creation of "through vias" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.