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  3. フジミインコーポレーテッド
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Electronic Components and Semiconductors
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フジミインコーポレーテッド

EstablishmentMarch 20, 1953 (Showa 28)
capital475343Ten thousand
number of employees1110
addressGifu/Kakamigahara-shi/Techno Plaza 1-8
phone058-379-3210
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last updated:Jul 12, 2024
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フジミインコーポレーテッド Product Lineup

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Characteristic particles Characteristic particles
Cemented carbide powder for 3D printers Cemented carbide powder for 3D printers
Alumina particles Alumina particles
Silicon carbide, SiC particles Silicon carbide, SiC particles
Silica particles Silica particles
Thermal spray material Thermal spray material
Abrasive material Abrasive material
Automotive exterior polishing material Automotive exterior polishing material
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Alumina-based precision wrapping material "FO"

Exhibits excellent processing performance for optical materials such as semiconductor wafers and lenses! Precision lapping materials made from carefully selected materials.

"FO" is a precision lapping material based on alumina, featuring unique particle shape and hardness due to its carefully selected materials and proprietary manufacturing process. It is produced under strict crystal quality control, providing consistently stable polishing capabilities while also preventing the occurrence of scratches. In addition to semiconductor crystals, it demonstrates excellent processing performance for optical materials such as optical lenses, prisms, and glass, making it safe to use for high-value-added processed products. 【Features】 ■ Stable polishing capability ■ Prevents the occurrence of scratches ■ Excellent processing performance for optical materials ■ Strict crystal quality control ■ Uses carefully selected materials *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • Other abrasives

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High Purity Colloidal Silica Slurry Polishing Material 'COMPOL'

Achieve a damage-free polished surface with high efficiency! Mirror finishing is possible on various materials such as electronic material substrates like sapphire, metals, and ceramics.

"COMPOL" is a high-purity colloidal silica slurry developed specifically for polishing electronic material substrates such as sapphire, as well as metal materials and ceramics. It excels in particle uniformity and dispersion, achieving a high-efficiency, damage-free polished surface. [Contents] - Representative physical properties of COMPOL - SiO2 content - pH - Specific gravity - Average particle size - Standard quantity *For more details, please refer to the PDF document or feel free to contact us.

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Polishing material for semiconductor devices "PLANERLITE"

A polishing material suitable for those seeking "high purity, high processing efficiency, high dispersion, and scratch-free."

The "PLANERLITE" series is a polishing material used in CMP (Chemical Mechanical Planarization) technology incorporated into the planarization process of increasingly dense ULSI devices. It is developed with the basic concepts of high purity, high processing efficiency, high dispersion, and scratch-free performance. [Introduction to the PLANERLITE Series] ■ PLANERLITE-4000: Polishing material for SiO2 films (interlayer insulating films, STI) ■ PLANERLITE-6000: Polishing material for Poly-Si ■ PLANERLITE-7000: Polishing material for copper wiring used in damascene processes ■ PLANERLITE-8000: Polishing material for barrier metals used in copper wiring *For more details, please refer to the PDF document or feel free to contact us.

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Presentation of materials | For selecting "polishing products" for grinding!

A diverse lineup and high cost performance available in abundance! As selection materials for choosing polishing products suitable for processed items.

Fujimi offers a range of polishing products that are the crystallization of high-purity technology. We also have long-selling and best-selling products that continue to overwhelmingly dominate the market. This document can be used as a selection guide to choose polishing products suitable for your workpieces. If you have any questions such as "I don't know which polishing product is suitable for my product...", please feel free to contact us. 【Examples of target products】 ■ Semiconductors ■ Electronic materials ■ Metal materials ■ Ceramics ■ Plastics ■ Glass ■ Others *For more details, please refer to the PDF document or feel free to contact us.

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Presentation of materials | Are you choosing the right abrasive for the material being processed?

We offer materials for wire saws, including documents that help select abrasives and related products suitable for the "processing methods × workpieces" of fine ceramic materials!

The grinding method to be selected varies depending on the processing method and the workpiece. This document is intended to respond to diverse needs with an optimal selection of "what materials to grind and how to grind them." If you have any questions such as "I don't know which grinding method is best...", please feel free to contact us. 【Examples of processing methods】 ■ Materials for wire saws ■ Materials for precision lapping processing ■ For diamond bonded abrasive processing ■ Materials for precision plastic processing ■ Materials for ultra-fine grinding wheels ■ Materials for precision coating processing ■ Materials for heavy electrical components ■ Materials for fine ceramics *For more details, please refer to the PDF document or feel free to contact us.

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Polishing material for plastic lenses "POLIPLA"

A wide variety is available! You can achieve a high polishing rate and a good finish surface.

"POLIPLA" is a compound-type polishing material developed for plastic lenses. It is made from high-purity alumina that is uniformly dispersed and a special composition liquid with a pH value of approximately 3.0 to 4.0, allowing for a high polishing rate and a good finish. We offer a wide variety of types, so please choose a grade that suits your intended use. [Features] - Developed for plastic lenses - Compound-type polishing material - Achieves a high polishing rate and a good finish - A rich variety of types available - Grades can be selected according to the intended use *For more details, please refer to the PDF document or feel free to contact us.

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Colloidal silica polishing material for silicon wafers 'GLANZOX'

Meeting the demands for higher flatness, damage-free, and free from heavy metal contamination with a complete mirror finish!

"GLANZOX" has made it possible to achieve excellent polished surfaces by dispersing colloidal silica in a specially formulated liquid. In recent years, there have been strict reduction requirements for metallic impurities that affect device characteristics. In response, we have developed ultra-high purity colloidal silica. We offer dedicated polishing materials such as the "GLANZOX E Series" for finishing wafer edges to a mirror-like surface. 【Features】 ■ Disperses colloidal silica in a specially formulated liquid ■ Enables the realization of excellent polished surfaces ■ Developed ultra-high purity colloidal silica ■ Provides high-dimensional polishing materials *For more details, please refer to the PDF document or feel free to contact us.

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