フジミインコーポレーテッド Product Lineup

"COMPOL" is a high-purity colloidal silica slurry developed specifically for polishing electronic material substrates such as sapphire, as well as metal materials and ceramics. It excels in particle uniformity and dispersion, achieving a high-efficiency, damage-free polished surface. [Contents] - Representative physical properties of COMPOL - SiO2 content - pH - Specific gravity - Average particle size - Standard quantity *For more details, please refer to the PDF document or feel free to contact us.

• others

The "PLANERLITE" series is a polishing material used in CMP (Chemical Mechanical Planarization) technology incorporated into the planarization process of increasingly dense ULSI devices. It is developed with the basic concepts of high purity, high processing efficiency, high dispersion, and scratch-free performance. [Introduction to the PLANERLITE Series] ■ PLANERLITE-4000: Polishing material for SiO2 films (interlayer insulating films, STI) ■ PLANERLITE-6000: Polishing material for Poly-Si ■ PLANERLITE-7000: Polishing material for copper wiring used in damascene processes ■ PLANERLITE-8000: Polishing material for barrier metals used in copper wiring *For more details, please refer to the PDF document or feel free to contact us.

• others

Fujimi offers a range of polishing products that are the crystallization of high-purity technology. We also have long-selling and best-selling products that continue to overwhelmingly dominate the market. This document can be used as a selection guide to choose polishing products suitable for your workpieces. If you have any questions such as "I don't know which polishing product is suitable for my product...", please feel free to contact us. 【Examples of target products】 ■ Semiconductors ■ Electronic materials ■ Metal materials ■ Ceramics ■ Plastics ■ Glass ■ Others *For more details, please refer to the PDF document or feel free to contact us.

• others

The grinding method to be selected varies depending on the processing method and the workpiece. This document is intended to respond to diverse needs with an optimal selection of "what materials to grind and how to grind them." If you have any questions such as "I don't know which grinding method is best...", please feel free to contact us. 【Examples of processing methods】 ■ Materials for wire saws ■ Materials for precision lapping processing ■ For diamond bonded abrasive processing ■ Materials for precision plastic processing ■ Materials for ultra-fine grinding wheels ■ Materials for precision coating processing ■ Materials for heavy electrical components ■ Materials for fine ceramics *For more details, please refer to the PDF document or feel free to contact us.

• others

"POLIPLA" is a compound-type polishing material developed for plastic lenses. It is made from high-purity alumina that is uniformly dispersed and a special composition liquid with a pH value of approximately 3.0 to 4.0, allowing for a high polishing rate and a good finish. We offer a wide variety of types, so please choose a grade that suits your intended use. [Features] - Developed for plastic lenses - Compound-type polishing material - Achieves a high polishing rate and a good finish - A rich variety of types available - Grades can be selected according to the intended use *For more details, please refer to the PDF document or feel free to contact us.

• others

"GLANZOX" has made it possible to achieve excellent polished surfaces by dispersing colloidal silica in a specially formulated liquid. In recent years, there have been strict reduction requirements for metallic impurities that affect device characteristics. In response, we have developed ultra-high purity colloidal silica. We offer dedicated polishing materials such as the "GLANZOX E Series" for finishing wafer edges to a mirror-like surface. 【Features】 ■ Disperses colloidal silica in a specially formulated liquid ■ Enables the realization of excellent polished surfaces ■ Developed ultra-high purity colloidal silica ■ Provides high-dimensional polishing materials *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• others