ムラタ List of Products and Services

RCS-23 is a surfactant for immersion and cathodic electro-degreasing in reel-to-reel plating with a short processing time. RCS-23 is liquid, has a high cloud point, and is compatible with high-concentration builder baths. Typically, caustic soda alone is sufficient as a builder, making it a degreasing bath that allows for low-cost wastewater treatment. It is an environmentally friendly eco-product composed of highly safe ingredients. Due to its neutrality, it enables the formulation of degreasing solutions across a wide range from alkaline to neutral, depending on the presence or absence of builders. 【Features】 ○ Surfactant for immersion and cathodic electro-degreasing ○ Supports high-speed degreasing processing ○ Low foaming ○ Good wastewater treatment ○ Compatible with high-concentration builder baths For more details, please contact us or download the catalog.

"MEOX" is an inorganic complex salt that uses potassium monopersulfate as an oxidizing agent. It was devised to achieve a high-quality surface condition without smut formation on copper and copper alloy materials. It is a powder of acidic peroxides, and by adding sulfuric acid or phosphoric acid to this aqueous solution, a micro-etching solution is created. [Features] ■ Etching speed can be easily set and managed according to purpose ■ Desired surface condition can be obtained by the added acid ■ By replenishment, a stable etching speed can be maintained for a long time ■ Decomposition due to standing is minimal even if copper dissolves in the solution ■ Good washability makes it unlikely for rust to occur after etching ■ Very safe and stable product *For more details, please download the PDF or feel free to contact us.

We would like to introduce the nickel plating-related products we handle. Our lineup includes the plating process "KASUMI," which achieves a satin-like appearance, the nickel plating solution "RFN-200," which allows for a large surface area coating through electroplating, and the rough nickel plating agent "RFN-500," which also provides a large surface area coating. Please feel free to consult us about your specific needs based on your applications. 【Partial Lineup】 ■ Satin-like plating process "KASUMI" ■ Rough nickel plating agent "RFN-200" ■ Rough nickel plating agent "RFN-500" ■ One-component glossy sulfonic acid nickel plating additive "SN-500" ■ Various plating solution pit prevention agent "NP-A" *For more details, please download the PDF or feel free to contact us.

The gloss nickel plating additive Nickel Ace 'NA-100-J/NA-2 (×2)' is a gloss nickel process that is insensitive to organic contamination with a wide management range. It allows for beautiful gloss nickel plating with the same operations as before and with a smaller amount of additive. You can easily transition from the current nickel plating bath, so please feel free to consult us. 【Features】 ■ Excellent in gloss generation ■ Stable good gloss appearance over a wide range of current density and temperature ■ The deposited material has excellent ductility ■ Good adherence ■ Low internal stress, and compressive stress does not increase beyond a certain value *For more details, please download the PDF or feel free to contact us.

The "RCS-25" is a surfactant suitable for immersion and cathodic electro-degreasing in reel-to-reel plating with short processing times. It is a liquid type with high degreasing power even at low temperatures, produces little foam, and has good foam drainage. Additionally, it is sufficiently effective with only caustic soda as a standard builder, making it easy to work with and a low-cost degreasing bath that facilitates wastewater treatment. 【Features】 ■ An eco-friendly product composed of highly safe ingredients ■ Excellent degreasing power even at low temperatures ■ Neutral pH allows for a wide range of degreasing solutions from alkaline to neutral, depending on the presence of builders ■ Environmentally friendly product: energy-saving, sludge reduction, easy wastewater treatment, contains only trace amounts of P and N, improves working environment, long lifespan *For more details, please download the PDF or feel free to contact us.

The "MGC-25" is a surfactant for immersion and electrolytic degreasing. It can perform neutral immersion degreasing on its own, and when combined with various builders, it can also be used for acidic to alkaline immersion degreasing or alkaline electrolytic degreasing. In liquid form, it has high degreasing power even at low temperatures, produces minimal foam, and has good foam breakage. 【Features】 ■ An eco-friendly product composed of highly safe ingredients ■ Excellent degreasing power even at low temperatures ■ Neutral, allowing for a wide range of degreasing solutions from acidic to alkaline depending on the presence of builders ■ Being a liquid degreaser, it is easy to handle without dust issues and can be used up completely, leading to improved working conditions and cost-effectiveness *For more details, please download the PDF or feel free to contact us.

The glossy nickel plating additive Nickel Ace 'NA-1000/2000' is a glossy nickel process that is insensitive to organic contamination and has a wide control range. The natural electrode potential of the deposit becomes sufficiently negative, making it suitable for the double nickel plating method as glossy nickel. Additionally, it can be easily converted from the current nickel plating bath, so please feel free to consult us. 【Features】 ■ A good glossy appearance can be consistently obtained over a wide range of additives. ■ The lifespan of the additive is long, making it economical. ■ There are almost no adverse effects of the additive in low current density areas. ■ It can be used even at high current densities, increasing productivity. ■ Excellent adhesion for chrome plating. *For more details, please download the PDF or feel free to contact us.

The semi-gloss nickel plating additive Mark 80 'M-801/802' does not produce harmful decomposition products, so there is no need for activated carbon treatment to remove decomposition products. It provides good leveling, low hardness, and low stress, resulting in a flexible deposit, making it suitable as the bottom layer of semi-gloss plating in multi-layer nickel plating. It can be used in a wide range of applications, including high-speed plating with high-temperature, high-concentration baths, and energy-saving baths with low-temperature, low-concentration baths. 【Features】 ■ The deposit does not contain sulfur (S) ■ Better corrosion resistance compared to conventional bright nickel plating ■ Good leveling, low hardness, low stress, and a flexible semi-gloss plating is obtained *For more details, please download the PDF or feel free to contact us.

"CAT" is a copper discoloration inhibitor devised to form a highly corrosion-resistant thin film on the copper surface of printed circuit boards. Since the treatment solution is acidic, it can remove the surface oxide film simply by immersing it in the solution in the case of a thin oxide film. This reduces the cumbersome tasks such as applying rust prevention treatment after activation treatment. Please use it in the rinsing process after electroless copper plating and acidic copper plating. 【Features】 ■ The copper surface after CAT treatment has good adhesion with dry films and other photoresists. ■ The copper surface after CAT treatment does not adversely affect the subsequent flux treatment and soldering process. ■ Because the treatment solution is acidic, the occurrence of floating particles and bacteria due to the introduction of copper is minimized, resulting in almost no contamination of the substrate by deposits. *For more details, please download the PDF or feel free to contact us.

"Ever Shine Cu" is a neutral liquid copper discoloration preventive agent. It is suitable for short-term discoloration prevention applications for copper and copper alloys. By simply immersing in a diluted solution, an oxidation prevention film can be formed. Additionally, the oxidation prevention film formed on copper and copper alloys can be easily removed by acid immersion. Therefore, it is suitable for oxidation prevention during temporary storage or inter-process movement for re-plating after copper and copper alloy plating. 【Features】 ■ An oxidation prevention film is formed just by immersion ■ Lower electrical resistance compared to other discoloration prevention methods ■ Does not cause any issues with soldering *For more details, please download the PDF or feel free to contact us.

"SAS" is a transparent and safe liquid acid that replaces the hazardous acids traditionally used. It can be used not only for the activation of metal surfaces, scale removal, and removal of oxide films in pre-treatments such as plating and chemical processing, but also for the stripping of chrome plating. It does not contain chelating agents and has an extremely low COD, making wastewater treatment easy. It can be used on all metals, resulting in clean metal surfaces without smut. 【Features】 ■ Easy to store and handle as it is not a toxic substance ■ Does not fume like hydrochloric acid traditionally used ■ Automation of bathing and replenishment is possible due to its liquid form ■ Easy wastewater treatment due to the absence of chelating agents and extremely low COD ■ Can be used on all metals, resulting in clean metal surfaces without smut *For more details, please download the PDF or feel free to contact us.

The black nickel plating "BKN method" can create a uniform jet black glossy finish over regular glossy plating. It can be used in any bath for rack, barrel, or basket plating. BKN concentrate is a double-concentration liquid that contains all the components necessary for black film formation, and it can be adjusted simply by diluting it with water. Since the cathodic current density is very low, at 1/10 to 1/20 compared to regular glossy plating, please prepare a low-capacity power supply. 【Features】 ■ Can create a uniform jet black glossy finish over regular glossy plating ■ Usable in any bath for rack, barrel, or basket plating *For more details, please download the PDF or feel free to contact us.

The "CMN process" performs blackening treatment in two stages: CMN-N (electroless nickel) and CMN-B (blackening). In the first stage, electroless nickel plating is carried out using the CMN-N bath, which is suitable for blackening treatment. In the second stage, the electroless nickel plated item is immersed in the CMN-B bath to blacken the plating film. Since the blackening treatment is performed after electroless nickel plating, it can be applied to various materials. Additionally, a black appearance can be achieved simply by immersion, making it convenient. 【Features】 ■ Uniform deep black color is obtained regardless of shape ■ The minimum required film thickness for electroless Ni (CMN-N) is about 2μm, which is very thin and has little impact on dimensional accuracy ■ The black film remains stable for a long time due to heat treatment ■ CMN-N can be used for up to 5 turns ■ Complies with RoHS directive (does not use lead compounds) *For more details, please download the PDF or feel free to contact us.

The "PAC-200" is an acidic cleaner designed for printed circuit boards, used for cleaning the copper surface before various plating processes, such as pattern copper plating and after circuit formation in the printed wiring board manufacturing process. It is effective in removing contaminants such as oils, fingerprints, and oxides that adhere to the copper surface, and when combined with the subsequent soft etching process, it facilitates the removal of photoresist residues. Please feel free to contact us if you would like to place an order. 【Features】 ■ Excellent degreasing effect for fingerprints and similar contaminants ■ Very low surface tension with minimal foaming and easy disappearance ■ Good foam drainage and excellent rinseability ■ Minimal impact on the soft etching solution when mixed *For more details, please download the PDF or feel free to contact us.

The "PAC-310X" is a neutral cleaner for printed circuit boards that does not contain chelating agents. As it is a neutral cleaner, the impact of mixed metals is significantly reduced. Additionally, it excels in removing dirt such as grease and fingerprints compared to acidic degreasers. Furthermore, it has minimal impact when introduced to soft etching solutions, making it effective in facilitating the removal of photoresist residues when combined with soft etching. 【Features】 ■ Minimal impact from metal contamination mixed into the processing solution ■ No etching of copper as the pH is near neutral ■ Very low surface tension with minimal foaming and easy disappearance ■ Good foam break and excellent rinsability ■ Almost no impact from contamination in soft etching solutions *For more details, please download the PDF or feel free to contact us.

"RCS-21/21G" is a surfactant for immersion and cathodic electro-degreasing. In cathodic electro-degreasing for reel-to-reel plating with short processing times, there is no concern about alkali burning, so builders can use only NaOH. This makes it an environmentally friendly product that results in a low-cost degreasing bath with easy wastewater treatment. Furthermore, it produces less foam and has good foam breakage, which improves workability. 【Features】 - Environmentally friendly product: energy-saving, sludge reduction, easy wastewater treatment, low P and N content, improved working environment, long lifespan - Excellent degreasing power - Low foaming, good foam breakage - Wide range of use (up to alkaline and neutral regions) *For more details, please download the PDF or feel free to contact us.

This document provides an explanation of the boric acid alternative process in nickel sulfamate baths. It offers detailed information on bath composition, working conditions, bath preparation methods, and management of the plating bath. Additionally, it visually presents the effects of SN-1000 on the halser with the addition of SN-CSB. This is a useful reference, so please download it and take a look. 【Contents】 ■ Introduction ■ Plating Bath ■ Effects on Physical Properties ■ Analytical Methods ■ Cautions *For more details, please download the PDF or feel free to contact us.

The "PAC-150" is an acidic cleaner designed for cleaning copper surfaces in the printed circuit board manufacturing process. It minimizes foaming and has excellent defoaming properties, making it particularly effective in situations where foaming occurs, such as in shower cleaning. It is effective in removing dirt such as fingerprints and oxides adhered to the copper surface, and when combined with the subsequent soft etching process, it facilitates the removal of photoresist residues. 【Features】 ■ Minimizes foaming and has excellent defoaming properties, while also being easy to rinse with water ■ Capable of simultaneously cleaning and activating the copper surface ■ Does not contain substances subject to the RoHS directive *For more details, please download the PDF or feel free to contact us.

"MGC-18" is a surfactant for immersion and electrolytic degreasing. It can be used alone for neutral immersion degreasing, and when combined with various builders, it can also be used for acid to alkaline immersion degreasing or alkaline electrolytic degreasing. As a liquid-type degreaser, it is easy to handle without the influence of dust, allowing for complete usage and contributing to improved working conditions and cost-effectiveness. Additionally, it can be used as a surfactant to assist in degreasing. 【Features】 ■ Strong degreasing power with excellent stamina against oil ■ Can be used as a degreaser for cathodic/anodic/PR electrolytic processes when combined with alkaline builders ■ By adding it as a supplementary additive to general degreasers, it can enhance degreasing power, improve wettability, and extend lifespan *For more details, please download the PDF or feel free to contact us.

"Best Strip NF/B" is a high-performance non-cyanide nickel plating stripper that quickly dissolves the plating film by immersing steel materials coated with electro-nickel plating in the Best Strip solution. It can be applied to high-quality items with minimal roughness on the steel substrate. It can also efficiently strip electroless Ni-P plating. Please feel free to contact us if you have any inquiries. 【Features】 - Fast stripping speed and operable at low temperatures - Can strip both electro Ni and electroless Ni in one tank - Stripping speed recovery is possible through component replenishment - Low frequency of renewal reduces waste liquid costs - Applicable to high-quality items with minimal roughness on the steel substrate - Does not contain cyanides *For more details, please download the PDF or feel free to contact us.

"CP-25" is an additive for copper pyrophosphate plating that has a dense crystalline structure and excellent corrosion resistance. The pyridine method is recommended for purposes such as providing a glossy and leveling undercoating for zinc die casting, electroforming, preventing carburizing and nitriding of iron and steel, through-hole plating for printed circuit boards, plating of steel wires, and plating on plastics. By simply adding this product, a glossy and leveling plating can be obtained, and adding the additive "CP-3" can further enhance the effect. 【Features】 - Provides a uniform glossy plating with good leveling and flexibility. - The crystalline structure of the film is dense, offering excellent corrosion resistance. - Contains no cyanides, considering environmental impact and costs (waste treatment expenses). - Smooth plating that does not cause roughness even with thick layers. - 100% current efficiency with no pinholes. *For more details, please download the PDF or feel free to contact us.

When referring to non-magnetic plating, it generally means high-phosphorus electroless nickel plating, but there is a characteristic where the non-magnetic coating can become magnetic due to heating. The GN-310 features a special nickel coating that maintains its non-magnetic properties even in heated environments. Magnetic flux density is measured using a VSM (vibrating sample magnetometer). For more details, please download the materials and check. Additionally, non-magnetic strike nickel plating is also under development for difficult materials.