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ベック

addressKanagawa/Chigasaki-shi/Hagizono 2291-4
phone0467-83-6993
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last updated:Nov 09, 2015
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[Information] FOUP Vacuum Gas Replacement System 'VGX-system'

We clearly present a variety of VGX operations and features!

This document is an introduction to the vacuum gas replacement system for FOUPs, 'VGX-system', handled by Beck Co., Ltd. It includes an overview of the current purging system, methods, issues, an overview of VGX, and numerous VGX operations. Please feel free to download and take a look. 【Contents】 ■ Current Purging System ■ Current Method (1) ■ Current Method (2) ■ Issues with the Current Purging System ■ Overview of VGX *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment

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Smooth Vent (Rough) Attachment 'SVA-25'

The operating pressure range is atmospheric pressure to 10 E-2 Pa! Simple structure and low cost.

We would like to introduce our product, the 'SVA-25'. The orifice smoothly changes from slow vent to vent according to the pressure (differential). The sealing part is dimensionally compatible with the NW25 centering, and it can be easily swapped with the centering. Additionally, its simple structure and lack of need for control make it low-cost. 【Features】 ■ Changes from slow vent to vent ■ Orifice changes smoothly ■ Sealing part is dimensionally compatible with NW25 centering ■ Simple structure ■ Low-cost due to no need for control *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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[Data] Vacuum EFEM

Oxygen-free, high-efficiency wafer process! It is explained clearly using diagrams.

This document is about the "Vacuum EFEM" handled by Beck Co., Ltd. It includes the configuration of the Vacuum Load Port VLP, the configuration of the Vacuum EFEM, and numerous operations of the Vacuum EFEM, as well as the interaction between the Vacuum EFEM and process equipment. Additionally, it provides clear explanations using diagrams in color. Please feel free to download and read it. [Contents] ■ Configuration of the Vacuum Load Port VLP ■ Configuration of the Vacuum EFEM ■ Operation of the Vacuum EFEM: Loading of FOUP ■ Operation of the Vacuum EFEM: Vacuum evacuation of the port chamber and FOUP ■ Operation of the Vacuum EFEM: Wafer transport (Load/Unload) *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment
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Vacuum Desiccator "FVD-BU"

Introducing a simple basic unit for 300mm wafer FOUP and FOSB!

The "FVD-BU" is a vacuum desiccator that can be used for various purposes such as vacuum storage, degassing, drying, and gas replacement while keeping wafers in FOUP/FOSB (with purge port). Wafers can be stored for long periods without being affected by the airtightness of the FOUP. The chamber is compactly sized to match the dimensions of the FOUP. Additionally, it features a damper hinge for smooth opening and closing, making it convenient for inserting and removing FOUPs and similar containers. We also offer an electric type called "FVD-DT." 【Features】 ■ For 300mm wafers in FOUP and FOSB ■ Versatile use for degassing, drying, gas replacement, etc. ■ Long-term storage capability ■ Compact chamber size ■ Top cover with opening and closing mechanism (with damper hinge) *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment

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[Information] Vacuum Concentrated Exhaust System 'VIE-system'

Vacuum exhaust energy-saving solutions! Application to vacuum facilities in semiconductor device factories.

This document is an introduction to the vacuum centralized exhaust system 'VIE-system' handled by Beck. It includes the current issues with exhaust systems, an introduction to the vacuum centralized exhaust system, and the effects of implementing the VIE-system. Please feel free to download and take a look. 【Contents】 ■ Current exhaust system for the load lock chamber ■ Current exhaust system for the load lock chamber (example) ■ Vacuum centralized exhaust system for the load lock chamber ■ Effects of implementing the VIE-system *For more details, please refer to the PDF document or feel free to contact us.

  • Ventilation and Exhaust
  • Vacuum Equipment
  • Vacuum pump

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Vacuum Pump Reservoir Ultra-High-Speed Exhaust System "Eco Back System"

The connection time is only 10 seconds! A system that exhausts the reservoir while idling.

The "Eco Bag System" is a super high-speed exhaust system that exhausts multiple reservoirs during the idling of a vacuum pump. It allows for effective use of electricity during the pump's idling. It can achieve atmospheric pressure to 1 kPa (7.6 Torr) in under 10 seconds, and can be added to the device without additional pumps or shared among multiple devices. Without needing to use a large-capacity vacuum pump, it can shorten rough pumping time or allow for a smaller pump with the same rough pumping time. 【Features】 - The pump does not exhaust from atmospheric pressure, reducing pump load. - Extends pump lifespan and maintenance intervals. - Capable of exhausting gases that contain water vapor. - In the case of rotary pumps, oil mist is significantly reduced. - Allows for sharing reservoirs among multiple devices. For more details, please contact us or download the catalog.

  • Vacuum Equipment

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  • 高品質×短納期 アキツなら金型費不要 0円 1個から対応可能 試作・小ロット 最短当日出荷 3Dデータ対応 ゴム切削加工はお任せください!
  • ”分離できるか?”ではなく”どう分離するか” 分離効率×ランニングコスト×安定稼働 業界・用途に応じた多様な技術と経験 実用レベルで選ばれる遠心分離機
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