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Axuas Co., Ltd.

capital9000Ten thousand
number of employees80
addressAichi/Naka-ku, Nagoya-shi/1-25-35 Sakae
phone052-220-5571
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last updated:Dec 17, 2025
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Axuas Co., Ltd. List of Products and Services

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LED lighting LED lighting
Fivetech社製 キャプティブファスナー・脱落防止ネジ Fivetech社製 キャプティブファスナー・脱落防止ネジ
Meccal パワーエレクトロニクス向けヒートシンク Meccal パワーエレクトロニクス向けヒートシンク
電子機器用アルミケース 電子機器用アルミケース
Forced air cooling heat sink ALUTRONIC (Germany) Forced air cooling heat sink ALUTRONIC (Germany)
ALUTRONIC (Germany) standard aluminum heat sink ALUTRONIC (Germany) standard aluminum heat sink
ALUTRONIC (Germany) Pure Aluminum Pin Heat Sink ALUTRONIC (Germany) Pure Aluminum Pin Heat Sink
Fan-equipped heat sink ALUTRONIC (Germany) Fan-equipped heat sink ALUTRONIC (Germany)
ALUTRONIC (Germany) Heat sink for PCB mounting ALUTRONIC (Germany) Heat sink for PCB mounting
Pin header socket 1.27mm pitch Pin header socket 1.27mm pitch
Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA. Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.
UL180/182 Adjustable Monitor Arm Wall Mount UL180/182 Adjustable Monitor Arm Wall Mount
UL550 Series Horizontal Movable Monitor Arm UL550 Series Horizontal Movable Monitor Arm
Ceiling-mounted monitor arm Ceiling-mounted monitor arm
ICWUSA Long Monitor Arm ICWUSA Long Monitor Arm
Wall-mounted display arm Wall-mounted display arm
Wall-mounted workstation arm Wall-mounted workstation arm
Laptop arm Laptop arm
Slide-type wall track mount monitor arm Slide-type wall track mount monitor arm
EV65 Series Horizontal Adjustable Monitor Arm EV65 Series Horizontal Adjustable Monitor Arm
Support pillar installation workstation Support pillar installation workstation
Medical monitor arm Medical monitor arm
Medical cart and roll stand Medical cart and roll stand
Aceluxe Korean-made desk mount monitor arm Aceluxe Korean-made desk mount monitor arm
Heat sink for surface mount devices, made by Fischer in Germany. Heat sink for surface mount devices, made by Fischer in Germany.
Fischer Elektronik manufactured SMT heat sink Fischer Elektronik manufactured SMT heat sink
Axial fan-equipped heat sink Fischer Elektronik Axial fan-equipped heat sink Fischer Elektronik
High-performance heat sink for forced air cooling High-performance heat sink for forced air cooling
Extruded heat sink Fischer Elektronik Extruded heat sink Fischer Elektronik
Pin Fin Heat Sink Fischer Elektronik Pin Fin Heat Sink Fischer Elektronik
Extruded heat sink for clip mount Fischer Extruded heat sink for clip mount Fischer
Transistor fixing spring clip Transistor fixing spring clip
Fischer Elektronik Co. Electronic Components Fischer Elektronik Co. Electronic Components
Surface mount pin header/socket 2.54mm pitch Surface mount pin header/socket 2.54mm pitch
Surface mount pin header/socket 2mm pitch Surface mount pin header/socket 2mm pitch
Through-hole pin header and socket, 2.54mm pitch Through-hole pin header and socket, 2.54mm pitch
Fivetech Corporation's circuit board hardware Fivetech Corporation's circuit board hardware
Virus infection prevention products Virus infection prevention products
LED lighting construction achievements LED lighting construction achievements
Heat-insulating sheet / Glass coat Heat-insulating sheet / Glass coat
Monitor arm Monitor arm
Monitor arm (wall-mounted) Monitor arm (wall-mounted)
Monitor arm (pole mount) Monitor arm (pole mount)
Monitor arm (desk) Monitor arm (desk)
Bipolar transistor Bipolar transistor
Diode Diode
MOSFET MOSFET
Dual compound semiconductor Dual compound semiconductor
Cooling

Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.

Heat sink and fan from JRAO Thermal, USA.

BGA heat sink 17 x 17mm height 11.5mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 18 x 18mm height 10mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 20 x 20mm height 9mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks use aluminum to quickly dissipate heat from components. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heat sink 21 x 21mm height 8.9mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely used in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 23 x 23mm height 6mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely used in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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Heat sink for substrate mounting L50.8 W41.6 H25.0 mm

Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat-dissipating surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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Heat sink for substrate mounting L38.1 W41.6 H25.0 mm

Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.

JARO's fan heat sink, widely used in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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Heat sink for substrate mounting L25.4 W41.6 H25.0 mm

Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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Heat sink for substrate mounting L38.1 W34.9 H12.7 mm

Aluminum extruded heat sink with pins for fixing the substrate and nylon washers.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from highly thermally conductive metals, they efficiently transfer heat to the surface, improving overall heat dissipation. - The extruded heat sinks are made from lightweight metals, helping to reduce the overall weight of the device. - They feature a flat base that facilitates close contact with heat sources such as electronic components and other heat-dissipating surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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Heat sink for substrate mounting L25.4 W34.9 H12.7 mm

Aluminum extruded heat sink with substrate fixing pins and nylon washers.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from highly thermally conductive metals, they efficiently transfer heat to the surface, improving overall heat dissipation. - The extruded heat sinks are made from lightweight metals, helping to reduce the overall weight of the device. - They feature a flat base that facilitates close contact with heat sources such as electronic components and other heat-dissipating surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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Heat sink for substrate mounting L50.8 W34.9 H12.7 mm

Aluminum extruded heat sink with substrate fixing pins and nylon washers.

JARO's fan heat sinks are widely used in automobiles, medical devices, communication equipment, and more. - They are made of highly thermally conductive metal, efficiently transferring heat to the surface and improving overall heat dissipation. - The extruded heat sinks are made of lightweight metal, helping to reduce the overall weight of the device. - They feature a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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DC frameless fan, 36.9mm diameter, thickness 10mm

The frameless design allows for direct integration into heat sinks and housings, minimizing space usage.

JARO's axial flow fans are widely used in automobiles, medical devices, communication equipment, and more. Advantages of JARO's frameless fans: - Space-saving: The frameless design allows for direct integration into heat sinks and housings, minimizing space usage. - Quiet operation: Ideal for noise-sensitive environments such as audio equipment and medical devices. - Lightweight: Suitable for mobile devices and applications with strict weight limitations. - High design flexibility: Customizable to fit the product's form factor and aesthetic requirements.

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Heat sink for substrate mounting L50.8 W41.6 H25mm

Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

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BGA heatsink 23 x 23mm height 18mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 23 x 23mm height 25mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 27 x 27mm height 6mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sinks, widely used in automobiles, medical devices, and communication equipment Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 27 x 27mm height 18mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 35 x 35mm height 14mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 35 x 35mm height 18mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 40 x 40mm height 23mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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BGA heatsink 30.7 x 30.7mm height 14.1mm

BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

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