Axuas Co., Ltd. Product Lineup

JARO's fan heat sinks, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks use aluminum to quickly dissipate heat from components. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely used in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely used in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat-dissipating surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's fan heat sink, widely used in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from highly thermally conductive metals, they efficiently transfer heat to the surface, improving overall heat dissipation. - The extruded heat sinks are made from lightweight metals, helping to reduce the overall weight of the device. - They feature a flat base that facilitates close contact with heat sources such as electronic components and other heat-dissipating surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from highly thermally conductive metals, they efficiently transfer heat to the surface, improving overall heat dissipation. - The extruded heat sinks are made from lightweight metals, helping to reduce the overall weight of the device. - They feature a flat base that facilitates close contact with heat sources such as electronic components and other heat-dissipating surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's fan heat sinks are widely used in automobiles, medical devices, communication equipment, and more. - They are made of highly thermally conductive metal, efficiently transferring heat to the surface and improving overall heat dissipation. - The extruded heat sinks are made of lightweight metal, helping to reduce the overall weight of the device. - They feature a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's axial flow fans are widely used in automobiles, medical devices, communication equipment, and more. Advantages of JARO's frameless fans: - Space-saving: The frameless design allows for direct integration into heat sinks and housings, minimizing space usage. - Quiet operation: Ideal for noise-sensitive environments such as audio equipment and medical devices. - Lightweight: Suitable for mobile devices and applications with strict weight limitations. - High design flexibility: Customizable to fit the product's form factor and aesthetic requirements.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. - Made from a highly thermally conductive metal, it efficiently transfers heat to the surface, improving overall heat dissipation. - The extruded heat sink is made from lightweight metal, helping to reduce the overall weight of the device. - It features a flat base that facilitates close contact with heat sources such as electronic components and other heat dissipation surfaces. - JARO Thermal's heat sinks are used in various industries, including electronics, automobiles, LED lighting, and solar converters.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sinks, widely used in automobiles, medical devices, and communication equipment Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sinks, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, communication equipment, and more. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often adhered to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

JARO's fan heat sink, widely adopted in automobiles, medical devices, and communication equipment. Efficient heat dissipation: BGA heat sinks quickly dissipate heat from components using aluminum. Compact design: BGA heat sinks are designed to match the size of ICs or components, allowing them to function efficiently even in limited spaces. Secure mounting: BGA heat sinks are often bonded to ICs or components using special adhesives for efficient heat transfer. Versatile: BGA heat sinks are used in a variety of devices, including computers, servers, game consoles, and industrial systems.

At AquaS Co., Ltd., we handle JARO Thermal heat sinks and DC fans, which are also adopted by global manufacturers. JARO Thermal is a thermal management product manufacturer established in 1976, offering a wide range of products for temperature rise countermeasures in electronic circuits (fans, blowers, heat sinks, liquid cooling plates, etc.). Their product design is characterized by a focus on extending the lifespan and improving the reliability of high-performance electronic devices. IGBT Heat Sink - Excellent thermal conductivity. - Achieves efficient heat dissipation through a specially designed heat sink structure. - Maintains stable operating temperatures even in environments where high thermal performance is required. Compact Design - The small and space-saving structure makes it easy to integrate into inverters and motor drive systems. - Suitable for applications with installation environment constraints. Customization Support - Flexible response to customer specifications regarding heat sink dimensions, mounting configurations, surface treatments, etc. - Provides consistent support from design evaluation and prototyping to mass production.

In the EV (electric vehicle) industry, improving battery performance and extending driving range are critical challenges. Therefore, there is a demand for higher efficiency of IGBT modules in inverter and motor drive systems. Suppressing the temperature rise of IGBT modules and maintaining stable operation are essential for enhancing system reliability and longevity. Our heat sinks for IGBT modules efficiently suppress the temperature rise of high-density IGBTs, contributing to the performance improvement of EV systems. 【Usage Scenarios】 - EV Inverters - Motor Drive Systems - Fast Chargers 【Benefits of Implementation】 - Suppression of IGBT module temperature rise - Improved system reliability - Increased longevity - Higher efficiency

In the industrial robot industry, there is a trend towards faster operation and higher output, which is increasing the load on IGBT modules. This, in turn, raises the risk of performance degradation and failure due to heat. Temperature management is a critical issue, especially for robots that operate at high frequencies or require precise control. Our heat sinks for IGBT modules efficiently suppress the temperature rise of high-density IGBTs, contributing to stable operation and longer lifespan of robots. 【Usage Scenarios】 - High-speed transport robots - Precision assembly robots - Welding robots - Painting robots 【Benefits of Implementation】 - Suppression of temperature rise in IGBT modules - Improved operational stability of robots - Enhanced system reliability - Reduced maintenance frequency

In the medical device industry, miniaturization of electronic components and efficient thermal management are essential to maintain high performance within limited space. In particular, IGBT modules generate significant heat due to their high output, making proper heat dissipation design critical for the reliability and lifespan of the equipment. Our heat sinks for IGBT modules effectively suppress the temperature rise of high thermal density IGBTs, contributing to the miniaturization and high performance of medical devices. 【Application Scenarios】 - Portable medical devices - Imaging diagnostic equipment - Surgical robots 【Benefits of Implementation】 - Miniaturization and lightweight design of equipment - Assurance of high reliability - Extension of product lifespan

In data centers, efficiently managing the heat generated by electronic devices such as servers and storage is essential for stable operation and longevity of the systems. In particular, IGBT modules have a high thermal density, requiring appropriate cooling measures. Poor cooling performance can lead to equipment failure or performance degradation, potentially increasing operational costs. Our heat sinks for IGBT modules effectively suppress the temperature rise of high thermal density IGBTs, contributing to the stable operation of data centers. 【Usage Scenarios】 - Server racks - Power units - UPS systems 【Benefits of Implementation】 - Improved equipment reliability - Reduced risk of system downtime - Decreased operational costs due to energy savings

In the UPS industry, proper temperature management of IGBT modules is essential to ensure system reliability. To maintain a stable power supply as a backup during power outages, it is necessary to prevent performance degradation and failure due to overheating of the IGBT modules. Our heat sinks for IGBT modules efficiently suppress the temperature rise of high thermal density IGBTs, contributing to the stable operation of UPS systems. 【Application Scenarios】 - Data centers - Server rooms - Medical equipment - Emergency power supplies 【Benefits of Implementation】 - Extended lifespan of IGBT modules - Improved system reliability - Continued stable power supply - Reduced maintenance costs

In the machine tool industry, precision control is a crucial factor that influences the quality and performance of products. To achieve high-precision operation, temperature management of the IGBT modules that make up inverter and motor drive systems is essential. Temperature rise can shorten the lifespan of these electronic components and lead to malfunctions. Our heat sinks for IGBT modules efficiently suppress the temperature rise of high-density IGBTs and provide a stable operating environment, contributing to the reliability of machine tools. 【Application Scenarios】 - Precision machining machines - Robot arms - NC machine tools 【Benefits of Implementation】 - Extended lifespan of IGBT modules - Stable operation of machines - Improved product quality

In the high-power welding machine industry, the reliability and longevity of IGBT modules are crucial. With the increase in power output, the rise in temperature of IGBTs can lead to performance degradation and failures. Efficient heat dissipation measures are essential to maintain stable welding quality and minimize downtime. Our heat sinks for IGBT modules effectively suppress the temperature rise of high thermal density IGBTs, maximizing the performance of high-power welding machines. 【Application Scenarios】 - High-power welding machines - Inverter welding machines - Plasma welding machines 【Benefits of Implementation】 - Suppression of IGBT temperature rise, achieving stable operation - Improvement in welding quality - Extension of product lifespan - Reduction in maintenance costs

At AquaS Co., Ltd., we handle JARO Thermal heat sinks and DC fans, which are also adopted by global manufacturers. JARO Thermal is a manufacturer that offers a wide range of high-performance heat sinks for LED lighting applications. They provide aluminum heat sinks designed to efficiently dissipate heat generated by LEDs, including cold-forged pin fins, slot fins, and star shapes, making them suitable for cooling LED modules and COB (Chip-On-Board) LEDs. "JtraLED-130 Series Star Heat Sink (130mm diameter)" Dimensions: 130mm diameter, height: 20mm, 50mm, 80mm JtraLED-13020 (H = 20mm) JtraLED-13050 (H = 50mm) JtraLED-13080 (H = 80mm)

This is an ultra-thin IC cooler (fan-equipped heat sink) designed to address heat dissipation measures in high-density implementation environments. It combines high heat dissipation performance through a cold-forged pin fin structure with space-saving design due to its integrated fan, achieving efficient cooling even in limited enclosure spaces. The JCC series uses aluminum and copper materials, featuring a low-profile design with dimensions of 51mm to 70mm square and a height of 13mm, making it suitable for cooling 1U servers, communication equipment, CPUs, FPGAs, and chipsets. The JSC series responds to further space-saving and safety needs with its ultra-thin structure of 10.7mm in height and models with fan guards. It allows for optimal model selection based on application, heat generation, and installation space, contributing to thermal management across a wide range of fields, including industrial PCs and embedded devices.

This is a high-performance heat sink that adopts a cold-forged pin fin structure. The densely arranged pin fin structure maximizes the heat dissipation area, achieving high cooling performance even in limited spaces. It is suitable for high-heat-generating devices such as 1U servers, communication equipment, industrial PCs (IPC), FPGAs, CPUs, and SoCs, contributing to solving thermal design challenges in high-density mounting environments. - High heat dissipation performance due to cold-forged pin fin structure - High heat exchange efficiency achieved even in a compact design - Compatible with 1U and high-density mounting environments - Suitable for a wide range of applications including CPUs, FPGAs, SoCs, and communication ICs - Custom design available (size, material, shape) The integrated pin fin structure formed by cold forging achieves higher fin density and uniform heat dissipation performance compared to conventional extruded heat sinks. It efficiently disperses airflow even within limited enclosure space, balancing reduced thermal resistance with stable thermal diffusion performance.

At EV charging stations, stable operation in outdoor installations and high humidity environments is required. Temperature management of charging equipment is essential for maintaining performance and extending lifespan, and particularly during the summer's high temperatures and rainy weather, humidity increases the risk of equipment failure. Our IP68 waterproof DC fan addresses these challenges and provides stable cooling performance even in harsh outdoor environments. 【Usage Scenarios】 - Cooling of EV chargers - Temperature management of peripheral equipment at charging stations - Improving the reliability of outdoor installed equipment 【Benefits of Implementation】 - Prevention of overheating and stable operation of charging equipment - Extension of equipment lifespan - Reduction of maintenance costs

In outdoor communication base stations, temperature management and protection from external environments are crucial for the stable operation of equipment. Particularly in environments with rain, dust, and high humidity, the risk of cooling fan failure increases, which can lead to communication disruptions. Our IP68 waterproof DC fans demonstrate stable cooling performance even in these harsh conditions, contributing to the reliability of communication equipment. 【Usage Scenarios】 - Communication base station equipment installed outdoors - Equipment cooling in high humidity environments - Use in locations exposed to rain, wind, and dust 【Benefits of Implementation】 - Reduced risk of communication disruptions due to stable equipment operation - Decreased maintenance frequency - Assurance of long-term reliability

In industrial automation equipment, durability that can withstand stable operation and long-term use is required. In particular, use in harsh environments such as dust, water droplets, and high humidity increases the risk of equipment failure, which can lead to production line stoppages. Therefore, cooling fans that can reliably demonstrate cooling performance even in these environments and maintain the reliability of the equipment are essential. Our IP68 waterproof DC fan achieves stable cooling even in such harsh conditions due to its high dustproof and waterproof performance, contributing to the improvement of reliability in industrial automation equipment. 【Usage Scenarios】 - Outdoor-installed automation equipment - Manufacturing lines in high humidity environments - Factory equipment with a lot of dust - Outdoor control panels - Outdoor-installed robots 【Benefits of Implementation】 - Stable operation of equipment in harsh environments - Reduced risk of failure and maintenance costs - Minimization of production line downtime - Extended lifespan of equipment

The ultra-thin DC blower is a compact cooling fan with a horizontal exhaust type, suitable for cooling thin housings and high-density mounted equipment. It achieves efficient heat dissipation even in limited spaces where installation of conventional axial fans is difficult, thanks to its blower structure. It is suitable for thermal management in devices that require miniaturization and slim design, such as medical equipment, industrial electronic devices, embedded devices, and communication equipment. JARO Thermal products support the selection of cooling components, sample evaluation, and quotations according to application and installation conditions. *We also welcome inquiries regarding custom products.

In the thin notebook PC industry, there is a demand for both high performance and a reduction in the thickness of the device. However, as the device becomes thinner, the internal space is limited, making effective heat dissipation a challenge. Insufficient cooling can lead to decreased performance and may affect the lifespan of components. Our ultra-thin DC blower achieves efficient heat dissipation through its blower structure, enabling thermal management even in limited spaces. 【Usage Scenarios】 - Thin notebook PC bodies - Compact devices with excellent portability - High-density mounted electronic devices 【Benefits of Implementation】 - Supports thin design of the device - Efficient cooling in limited spaces - Supports stable operation of equipment

In the network equipment industry, as miniaturization and high-density mounting progress, thermal management within devices has become an important issue. Particularly in high-density devices where many electronic components are mounted in limited space, efficient heat dissipation is essential for stable operation and longevity of the equipment. Inadequate cooling can lead to performance degradation and failures. Our ultra-thin DC blower addresses these challenges through efficient heat dissipation enabled by its blower structure and thin design. 【Usage Scenarios】 - High-density mounted network equipment - Thin-profile servers, routers, and switches - Communication devices with limited installation space 【Benefits of Implementation】 - Suppresses internal temperature rise and supports stable operation - Achieves efficient cooling even in thin-profile enclosures - Contributes to improved reliability and longevity of the equipment

In vehicle infotainment systems, high-density implementation is progressing in limited spaces, requiring high reliability. Effective thermal management is essential to maintain the stable operation of electronic components, especially in the car's interior environment, which experiences long hours of operation and significant temperature changes. Insufficient cooling can lead to system malfunctions and reduced lifespan. Our ultra-thin DC blower addresses these challenges through efficient heat dissipation from its blower structure and its slim design. 【Usage Scenarios】 - Slim enclosures for vehicle infotainment systems - High-density mounted automotive electronic devices - Cooling in limited installation spaces 【Benefits of Implementation】 - Improved stable operation and reliability of equipment - Extended product lifespan - Contribution to miniaturization and slimness

In the field of medical devices, precise temperature management is required to ensure patient safety and stable operation of the equipment. Particularly in devices that are becoming smaller and thinner, efficient heat dissipation in limited spaces poses a challenge. Insufficient cooling can lead to malfunctions and performance degradation of the equipment, potentially affecting reliability in medical settings. Our ultra-thin DC blower addresses these challenges with efficient heat dissipation through its blower structure. 【Usage Scenarios】 - Small and thin medical devices - High-density mounted electronic equipment - Devices requiring hygiene management 【Benefits of Implementation】 - Contributes to stable operation of equipment - Supports miniaturization and thinning - Enhances reliability

In the field of industrial controllers, stable operation in environments with a lot of dust and debris is required. These fine particles can invade the interior of the equipment, potentially leading to decreased cooling performance and component failures. Particularly in controllers that are becoming smaller and thinner, effective thermal management in limited spaces is crucial. Our ultra-thin DC blower addresses these challenges through efficient heat dissipation due to its blower structure and compact design, contributing to the maintenance of equipment reliability. 【Usage Scenarios】 - Control panels in manufacturing environments with high dust levels - Outdoor-installed controllers - Industrial PCs with high-density mounting 【Benefits of Implementation】 - Suppresses dust intrusion into the equipment, maintaining cooling performance - Achieves effective thermal management even in thin enclosures - Contributes to the longevity and stable operation of the equipment

JARO Thermal's EC fans are industrial cooling fans that utilize high-efficiency EC motors. They feature excellent energy-saving performance and controllability, making them suitable for cooling equipment that operates for long periods, such as control panels, communication cabinets, power supplies, and industrial machinery. They address thermal management for electronic devices that require high reliability, supporting efficient cooling and stable operation of the equipment.

In data centers, efficient thermal management in limited space is required due to the high density of servers and network equipment. The JARO Thermal "JSC00120" is a slim IC cooler with fans and heat sinks arranged in a parallel configuration. With a low-profile design of L90.0 × W45.0 × H11.6mm, it is suitable for equipment with height constraints on cooling components. 【Features】 - Slim design with a height of 11.6mm - Parallel arrangement of fans and heat sinks - Cooling structure that directs airflow horizontally - Low power consumption and low thermal resistance - RoHS compliant It can be used for IC cooling in servers, network equipment, graphics cards, GPUs, FPGAs, and more. For detailed information on the structure and fluid analysis results of the JSC00120, click here.

In industrial PCs, it is important to efficiently cool ICs that generate heat within limited chassis space. The JARO Thermal "JSC00120" is a slim IC cooler with a fan and heat sink arranged in parallel horizontally. With a low-profile design of 11.6mm in height, it is suitable for devices with height constraints on cooling components. 【Usage Scenarios】 - Industrial PCs and network devices - Network cards - Graphics cards and video cards - FPGAs, GPUs, processors, controllers - IC cooling for slim and space-saving devices 【Features】 - Slim design with a height of 11.6mm - Parallel arrangement of fan and heat sink - Cooling structure that directs airflow horizontally - Low power consumption and low thermal resistance - RoHS compliant For detailed explanations of the structure, airflow, and fluid analysis results of the JSC00120, please refer to the detailed description.