太洋テクノレックス List of Products and Services

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area through high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We also have live demonstrations of 'FA Automation' and 'Latest Appearance Inspection Systems using AI Technology'! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate calibration burdens and realize high-precision, high-speed operation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, AI system 'TY-VISION XAIS,' has entered Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect by inspection devices, even though they can be identified visually.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

◆FPC (Flexible Printed Circuit Board)◆ 　　　~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ 　　　　　FPC manufacturing requires multiple critical processing steps. 　　　　　Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. 　　　　　This time, we will introduce the "strengths" we have cultivated over many years in each process! 　　　　　<Design> Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Treatment> High precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High precision outline processing ±50μm, diverse tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ 　　　Proposals for utilizing FA and collaborative robots

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

1) Test System Business - Development/Manufacturing of Electrical Inspection Systems - Development/Manufacturing of Final Appearance Inspection Systems - Manufacturing of Visual Inspection Devices and Image Processing Devices 2) Industrial Machinery System (Trading Company) Business - Robot FA Systems - Design/Manufacturing of Automation Systems - Sales of high-end products from selected manufacturers - "World's first" needle-free ionizer static electricity removal device Ion Blade F3 3) Electronic Circuit Board Business - Design/Manufacturing of Flexible Printed Circuit Boards - Assembly of Printed Circuit Board Mounting - Electronic Circuit CAD Design - Production of Metal Masks (Electroforming Method) - Design/Manufacturing of Various Contact Probes - High-Precision Lead Frame Prototyping 4) Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of Mirror Polishing Machines/Grinders - Maintenance and Retrofit of Equipment - Sale of Abrasive Stones

Taiyo Industrial Co., Ltd. (Established December 1960) Taiyo Technolex Co., Ltd. (Name changed December 2023) [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly not only to conventional technologies but also to new technologies and areas such as technology trading. We are evolving beyond the confines of "industry" and looking towards a transition to a more global market.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

Full support from FPC design, prototyping, and mass production to board electrical testing, appearance inspection systems, and FA automation! TAIYO FPC SOLUTIONS! 【Exhibition Contents】 〇 Appearance Inspection System 〇 Flexible Printed Circuit Boards 〇 Robot/FA Systems_Automation Systems 〇 Lead Frame Prototyping 〇 Ionizer 【Business Activities】 ■ Test System Business ・Development and manufacturing of electrical inspection systems ・Development and manufacturing of final appearance inspection systems ・Manufacturing of visual inspection devices and image processing devices ■ Industrial Machinery System (Trading Company) Business ・Design and manufacturing of robot FA systems and automation systems ・Sales of high-end products from carefully selected manufacturers ・"Needle-less Ionizer" Static Electricity Removal Device Ion Blade F3 ■ Electronic Circuit Board Business ・Design and production of flexible printed circuit boards ・Assembly of printed circuit boards ・Electronic circuit CAD design ・Manufacturing of metal masks (electroforming method) ・Design and production of various contact probes ・High-precision lead frame prototyping ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) ・Manufacturing of mirror polishing machines and grinding machines ・Maintenance and retrofitting of equipment ・Sales of grinding wheels

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ 　☆ ～ ☆ ～ Do you have any of the following concerns? ～☆ ～ ☆ 　　• Looking for a reliable manufacturing partner for new product development 　　• Considering outsourcing as you do not have a manufacturing line 　　• Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

【Dates】November 5 (Wed) - 7 (Fri), 2025, 10:00 AM - 5:00 PM 【Venue】Port Messe Nagoya, Hall 1 (Nagoya Port, Kinjo Pier) Special Exhibition: Space Approach EXPO We will be exhibiting at the Wakayama Prefecture booth, No. 40. With our long-standing experience, we strongly support the space industry modules with our FPC small-lot production technology.