ケイ・オール Product Lineup

● In an Era of Difficulty in Procuring Semiconductor Devices In recent years, it has become widely known that components, particularly semiconductor devices and connectors, are difficult to procure due to issues such as material shortages. There have been reports indicating that procurement can take several years, and we have heard the lamentations from our customers. At K-All, we safely remove hard-to-obtain electronic components from existing circuit boards using advanced rework technology, enabling their reuse. From trial runs of a single unit to mass production of up to 100,000 units, we promptly resolve issues related to circuit board modifications and component procurement with our skilled techniques and state-of-the-art equipment. *For more details, please contact us or download our catalog!*

"BGA rework" refers to the process of partially heating BGA devices on completed circuit boards using specialized rework machines, tailored to specific needs. At K-All, we can handle both eutectic and lead-free soldering, and we have received positive feedback from many customers. We can perform work tailored to customer requests and the condition and symptoms of the circuit board. 【Features】 ■ Stable cleaning operations for circuit boards and removed devices ■ Cream solder supply (printing and coating) technology ■ Support for 0402 chips and micro-sized packages ■ Compatibility with large and multilayer circuit boards ■ Ability to accommodate a wide range of pitches, including special pitches *For more details, please refer to the PDF materials or feel free to contact us.

BGA is mounted on the printed circuit board by solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints in response to external stresses such as impact or bending. To address such issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. 【Features】 ■ Uses a one-component heat-curing epoxy resin ■ Can reduce external stresses ■ Prevents concentration of stress at the connection surfaces of the solder balls ■ Widely used in mobile devices such as mobile phones and music players *For more details, please refer to the PDF document or feel free to contact us.

Kei-Oll has numerous achievements in reballing and reworking with high-difficulty "BGA with underfill." Additionally, we can handle a wide range of micro sizes below 5×5mm and ball pitches from 1.27mm to 0.25mm, and we are capable of reballing for irregular and special pitch arrangements. We can assist in removing and reballing devices that are hard to obtain from other boards for implementation, especially when strict deadlines need to be met. 【Features】 ■ Two types of reballing technology (Capable of ball mounting using cream solder printing methods and dedicated flux application methods) ■ Supports micro-sized packages down to 5×5mm ■ Can accommodate changes in solder conditions (Composition changes from lead-free solder to eutectic solder are also possible) ■ Supports a wide range of pitches, including special pitches (Capable of handling ball pitches from 1.27mm to 0.25mm) *For details, please download the PDF or contact us.

At K-All, we have accumulated various work methods and technical research, enabling rework operations even on devices coated with various underfill materials! Using techniques such as replacement, re-implementation, re-balling, re-heating, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, etc., we solve various issues related to circuit boards and devices. In this document, we present technical materials regarding BGA rework technology. Hardened underfill materials seal the BGA, significantly improving strength and effectiveness; however, rework tasks such as removal and component replacement become more challenging than standard rework processes. Our company has been working diligently to ensure that rework operations can be performed even on devices coated with various underfill materials. [Features of Underfill] - Uses a one-component heat-curing epoxy resin - Can reduce external stress - Prevents stress concentration on the connection surface of solder balls - Widely used in mobile devices, including mobile phones *For more details, please contact us or download the catalog!

When we talk about "high-difficulty BGA rework," what kind of content do you imagine? Underfill, high-layer-count PCBs, jumpers from all BGA pins, and so on—these are things that are visually recognizable as "difficult." However, there are also aspects that are not easily understood just by appearance. One of these is "BGA rework on PCBs that are prone to warping (distortion)." Our company employs various methods to suppress warping, but there are some PCBs that are not easily managed, leading to ongoing struggles. This time, we have recreated the condition of a BGA when warping occurs. You can view the detailed content through the related links, so please take a look. *For more details, please refer to the PDF materials or feel free to contact us.

At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.

We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.

In the composition change of K-All's solder, we will switch from lead-free balls to eutectic balls. If the solder specifications of the substrate and the solder balls of the BGA differ, unexpected troubles may arise. K-All also conducts work to prevent implementation troubles by removing solder with different specifications and then attaching solder balls that match the specifications. We propose a reliable method while making use of your existing BGA. 【Features】 ○ Specification change from lead-free balls to eutectic balls ○ Preventing implementation troubles in advance through composition changes ○ Proposing a highly reliable method For more details, please contact us or download the catalog.

At Kei All, we can utilize our achievements and experience with LGA just like we do with BGA, allowing us to perform removal, installation, replacement, and modification. However, BGA and LGA are similar yet distinct, and it is precisely because we understand the characteristics of LGA that we can carry out rework tasks. If you are experiencing issues such as "frequent shorts in LGA assembly" or "wanting to reball LGA to convert it to BGA," please feel free to consult with us. If you have any problems with LGA, we will resolve them using our past achievements and know-how. 【Features】 ■ Addressing various issues with reliable technology ■ Rework capability allows for recovery in case of emergencies ■ Comprehensive inspection, starting with the first board, followed by the assembly and rework of the remaining boards *For more details, please refer to the PDF document or feel free to contact us.

POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.

At K-All, we can handle POP implementation and rework. The PoP technology, which stands for "Package on Package," is a technique that allows for the stacking of ICs and components on top of an IC package. With the technology of POP implementation, BGA implementation with an interposer board is also possible. Compared to jumper wiring, QCD (Quality, Cost, Delivery) is improved. It enables low-cost evaluation and signal conversion for BGA. Through discussions between our customers and K-All's design team, we promise reliable QCD. 【Features】 ○ Capable of POP implementation and rework ○ If there are many correction points, we can propose POP implementation using an interposer board ○ We can consider and propose the merits and demerits of both jumper and interposer board options For more details, please contact us or download the catalog.

"BGA jumper wires" refer to modification work that is carried out to correct or repair wiring when there has been a mistake in the pattern at the BGA location mounted on the circuit board, or for purposes such as circuit changes. Kei-All is actively engaged in many high-difficulty tasks, including investigating and analyzing individual terminals of BGA and CSP, and assisting in correcting patterns by connecting wiring between terminals and from terminals to other components. [Features] ■ BGA jumper capable up to 0.4mm pitch ■ Wiring possible from underneath the BGA, allowing for pattern swapping and signal verification ■ Can be mounted on the circuit board even with wiring from the BGA *For more details, please refer to the PDF document or feel free to contact us.

At Kei All, we have been primarily engaged in the prototyping, repair, and modification of circuit boards since our founding. We can handle essential tasks such as pattern cutting and jumpers for circuit modifications, as well as the installation and replacement of components that are thought to be impossible with a soldering iron. We can also repair circuit board foot patterns, allowing even boards that were thought to be beyond repair to be revived. We have received a great deal of trust and achievements from many customers. Before giving up on a circuit board, please consult with us first. 【Features】 ■ Short delivery times available ■ Problem-solving with extensive experience and reliable technical skills ■ Rich track record in both eutectic and lead-free soldering ■ Collaboration with the design group for the production of conversion boards and more ■ Please consult us about projects that other companies have declined as "impossible" *For more details, please refer to the PDF materials or feel free to contact us.

To maintain the quality of products that cannot be visually inspected after reflow, we conduct checks using 'X-ray inspection.' In pursuit of high quality, we set detailed inspection standards. This is a critical factor that determines the quality of the products. We perform inspections on all non-visible components such as BGA, QFN, SON, DFN, LGA, and connectors. 【Features】 ■ Achieves high resolution and high density analysis capabilities with the X-ray TV inspection device (Softex WORK-LEADER 90). ■ Sets detailed inspection standards in pursuit of high quality. ■ A critical factor that determines the quality of the products. *For more details, please refer to the PDF document or feel free to contact us.

This time, we will introduce examples of defects found in X-ray inspections. For each defect, we will also explain the condition before implementation and provide photos taken with a microscope. Our company also offers "inspection only" services using X-ray and microscopes. We can inspect not only BGA but also QFN, CSP, LGA, etc., and we can accommodate even a single piece, so please feel free to consult with us. You can view detailed information through the related links, so please take a look. 【Examples of defects found in X-ray inspections】 ■ Solder shorts ■ Ball missing ■ Ball defects ■ Solder flow (shorts) *For more details, please refer to the PDF document or feel free to contact us.