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In the semiconductor industry, the detection of fine defects on wafer surfaces is a crucial factor that influences product reliability. Nano-level irregularities and scratches, which are often overlooked in visual or microscopic inspections, can lead to reduced yield and product defects. This unit captures these fine defects over a wide area using off-axis optical systems and edge reflection light detection, contributing to the efficiency of the inspection process and improving the accuracy of quality control. 【Usage Scenarios】 - Quality inspection of wafer surfaces - Early detection of abnormalities in the manufacturing process - Inspection tasks in quality control departments 【Benefits of Implementation】 - Reduction in inspection time - Decrease in defective products - Reduction in quality control costs
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Smix Corporation is a specialized manufacturer of "macro optical inspection" that brings innovation to the inspection processes in the semiconductor industry. We break the industry's common belief that "increasing resolution narrows the field of view and requires longer inspection times" with our unique optical systems and in-house developed line sensor cameras. We have achieved ultra-fast inspection, capturing 12-inch wafers in just 7 seconds, which is four times faster than the industry standard. 【Provided Solutions】 ■ "Dark field optical system" that captures 0.1μm foreign particles on wafers ■ "Off-axis optical system" that visualizes nano-level surface distortions ■ "Measurement correlation technology" that quantifies changes in film thickness and pattern size We offer these advanced optical technologies as "inspection modules" to contribute to the competitiveness of semiconductor and equipment manufacturers. *For more details, please refer to our catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual equipment. The first sample evaluation will be provided free of charge.
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This is an optical system for quantitatively visualizing and managing the non-uniformity of film thickness (film unevenness) in the resist coating process. By using a unique "OAS filter" for thin film enhancement processing, it clearly reveals fine unevenness that is difficult to assess with conventional visual inspection. 【Usage Scenarios】 ■ Daily management and condition setting for resist coaters ■ Quantitative observation of unevenness caused by differences in axle rotation speed or time ■ Quality checks during resist lot changes Since even slight differences in conditions during resist dispensing can be captured in macro images, it supports faster process development and stable operation. *For more details, please refer to the catalog or feel free to contact us. *We are currently accepting requests for evaluations on actual machines. The first sample evaluation will be provided free of charge.
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This is a non-destructive, ultra-fast inspection module that monitors the variation in pattern dimensions on wafers. It visualizes the fluctuations in pattern size, which were traditionally measured over time using a scanning electron microscope (SEM), as brightness information in macro images. It allows real-time monitoring of "device-specific variations" and "temporal changes" during the exposure and etching processes. This significantly contributes to improving the yield of next-generation devices as miniaturization progresses. 【Technical Features】 - Confirmed a very high correlation (R²=0.964) with length measurement SEM data. - Provides a comprehensive understanding of the distribution across the entire wafer, not just specific areas within the chip. - High-precision observation using an optical system optimized for telecentricity. *For more details, please refer to the catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual device. The first sample evaluation will be provided free of charge.
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This is a unit that visualizes fine irregularities, scratches, and distortions on the wafer surfaces of materials like Si, SiC, and GaN, which are difficult to detect with the naked eye or under a microscope. It employs Sumix's unique "off-axis optical system" to sensitively detect changes in light reflection (edge reflected light) due to the angle of the surface. 【Defects that can be visualized】 ■ Nano-level surface irregularities and crystal defects ■ Slurry residues and fine scratches ■ Chipping and cracking after dicing It allows for a quick grasp of wide-area "inconsistencies" that are often overlooked in sampling inspections with a microscope, presented as macro images. This helps to eliminate bottlenecks in the inspection process and dramatically improves the accuracy of quality control. *For more details, please refer to the catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual device. The first sample evaluation will be provided free of charge.
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This is a macro inspection module specialized for detecting microscopic foreign substances on semiconductor wafers. It dramatically speeds up inspections that typically take a long time due to the narrow field of view of high-resolution cameras, using Sumix's unique "foreign substance inspection dedicated dark field optical system." 【Main Features】 ■ Reliable visualization of microscopic foreign substances (PSL) at the 0.1μm level ■ Identification of foreign substances without relying on resolution through the detection of Mie scattered light ■ Overwhelming tact time, scanning 12-inch wafers in as little as 7 seconds ■ Achievement of high S/N ratio with ultra-low noise line sensor cameras In conventional inspection equipment, it was common knowledge that "increasing sensitivity takes more time," but this module achieves both "high sensitivity and ultra-fast speed." It boasts inspection speeds approximately four times faster than industry-standard machines. *For more details, please refer to the catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual machine. The first sample evaluation will be provided free of charge.
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The "ARCscan Type RE & ME compatible" is a device that enables the analysis and evaluation of pattern shape uniformity over a wide area, which is difficult to observe at the microscopic level. It achieves optimal optical conditions for the observation target, making high-sensitivity, high-speed, and large-area inspections possible, which were previously challenging. It features a dual specification with "Type: RE," which allows macro observation under optimal conditions for patterns, and "Type: ME," which enables nano evaluation using a macro optical system. 【Features】 ■ Achieves optimal optical conditions for the observation target ■ Enables high-sensitivity, high-speed, and large-area inspections that were previously difficult *For more details, please refer to the catalog or feel free to contact us.
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Sumix Corporation is a company primarily engaged in the development, manufacturing, and sales of optical inspection equipment. We aim to propose the usefulness and potential of macro optical inspection to the semiconductor, liquid crystal, NIL, and other inspection markets, contributing to society through the efficiency and high sensitivity of inspection processes. Our core technology (OAS Technology) employs a unique optical system specialized for macro inspection using scattered light, enabling macro inspections with a high correlation to CD. 【Business Activities】 ■ Development, manufacturing, sales, and customization of optical inspection modules ■ Technical consulting for the development of optical inspection equipment *For more details, please refer to our catalog or feel free to contact us.
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