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Event Date: June 10 (Wednesday) to June 12 (Friday), 2026, 10:00 AM to 5:00 PM (Pre-registration required, free admission) Simultaneous Event: SEMISOL2026 Semiconductor Back-End Technology & Solutions Exhibition Venue: Tokyo Big Sight, West Hall 3 Booth Number: A-07, Next-Generation Smart Textile Product Consortium ■ Exhibits Under "Copper Plated Conductive Fiber," we will showcase: - Copper and nickel plated non-woven fabric with a thickness of 8µm or more, high heat resistance, and adaptability to uneven surfaces - Copper plated conductive thread with low resistance that can be soldered Additionally, we plan to exhibit the "Fabric Speaker" developed by AIST, along with jointly produced products and technologies from our company and other consortium exhibiting companies, including the 【Radio Reception and Audio System using E-textiles】.