昭和電気研究所 Product Lineup

The "SEL-V170BT" is a terminal-to-terminal foreign object inspection device that enables advanced inspection by employing a suitable optical system and our proprietary lighting to capture images of potential foreign objects between terminals. By establishing an inspection frame between the IN/OUT of the IC, it can detect potential foreign objects, and it progressively distinguishes foreign object candidates based on size, brightness/hue/saturation histograms, comparisons of area differences and area ratios between foreign objects and bubbles, and average brightness of foreign objects. 【Features】 ■ Inspects foreign objects between terminals using a suitable optical system ■ Inspection is possible not only between terminals but also elsewhere ■ Detailed settings allow for the differentiation between foreign object candidates and bubbles ■ Can be linked with "SEL-V170AL" ■ Single sheet transport only *For more details, please refer to the PDF document or feel free to contact us.

• Defect Inspection Equipment
• Other inspection equipment and devices

The "SEL-V170AL" is an ACF bonding inspection device that enables high-precision inspection by adopting suitable optical systems and lighting according to the inspection images, allowing for the measurement of bonding misalignment and the counting of indentation numbers at the bonding site. By conducting misalignment inspection and indentation counting on independent stages, it aims to accelerate inspection cycles and ensure productivity on the manufacturing line. Based on production management information, it visualizes quality trends, making it easier to manage the manufacturing line. Additionally, we also offer the "V170Ax3," which can transport two pieces. 【Features】 ■ Inspects bonding misalignment/indentation count/foreign objects using suitable optical systems ■ Performs high-speed inspections that ensure line productivity ■ Supports the visualization of quality ■ Only supports single-piece transport *For more details, please refer to the PDF document or feel free to contact us.

• Defect Inspection Equipment
• Other inspection equipment and devices

The "Wafer Crack and Edge Inspection Device" is an inspection device capable of detecting multiple types of defects with a single unit. It can quickly capture and detect wafer cracks that are difficult to find through visual inspection, as well as edge defects on the wafer's outer circumference. We offer this device at a low price, so please feel free to contact us. 【Features】 ■ Low price ■ High speed and high detection capability ■ Capable of detecting multiple types of defects with one unit *For more details, please refer to the catalog or feel free to contact us.

• Other inspection equipment and devices