日化精工 Product Lineup

We handle grinding and polishing fluids such as "N.E. Coolant" and "Nano Blocker." "N.E. Coolant" is a water-soluble grinding fluid that allows for stable machining during the grinding of materials like magnets, ceramics, and glass, without dissolving wax, enabling consistent outer and inner edge cutting. "Nano Blocker" is an additive that, when used in small amounts in dicing cutting water, improves yield and throughput. There are two types available: circulating and disposable. 【Product Lineup】 ■ N.E. Coolant ■ Nano Blocker *For more details, please download the PDF or feel free to contact us.

• Cutting Oil
• Other consumables

Our company handles a two-component epoxy adhesive developed for slicing single crystal and polycrystalline silicon, as well as compound and oxide ingots. It has strong adhesion that cures at room temperature and can be released with warm water or a dedicated release agent. Please feel free to contact us if you have any inquiries. 【Features of "W, Q, U, B Bond"】 ■ Two-component epoxy adhesive developed for slicing semiconductor and solar cell ingots ■ Can be released with warm water ■ Mixing ratios of 1:1 and 2:1 for easy mixing, with a lineup that meets various needs including fast-curing and high-strength types *For more details, please download the PDF or feel free to contact us.

• glue

We offer a wide variety of coating agents for various purposes. We have coatings for waxless polishing of Si wafers, coatings for backlapping, coatings for etching various wafers, surface protection during cutting, and more, all available in a rich selection. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ Coating Agents: BRT Series, MA Series, NAR Series, CN Series, JK Series, SDE Series ■ Protective Liquid: N Series ■ Nano Shelter: LS Series *For more details, please download the PDF or feel free to contact us.

• Coating Agent

Our company offers acrylic adhesives that have strong bonding power and can be removed with warm water or heating, curing at room temperature in a short time. As a main product, we provide the primer-curing acrylic adhesive "Skylock," developed for slicing semiconductor ingots. This anaerobic curing type does not require the essential weighing and mixing that epoxy does, which eliminates waste from adhesive overflow. The bonding strength is comparable to that of epoxy, and the quick curing and ease of removal with warm water improve workability. 【"Skylock" Product Lineup】 ■ RD Series ■ UV Series ■ Instant Adhesives *For more details, please download the PDF or feel free to contact us.

• glue

"Solid wax" is an adhesive primarily used for temporary bonding during the cutting and polishing of electronic component materials. It meets a variety of cleaning needs, including solvent, alkaline cleaning, and warm water. We offer a wide range of products, so please choose according to your application. [Features] ■ For precision processing ■ Hot melt type temporary adhesive ■ Responds to diverse needs *For more details, please refer to the catalog or feel free to contact us.

• glue
• Other abrasives