トーバン工業 Product Lineup

The "Baritak" series introduces the common features of all the deburring machines provided by Tōban Industries. Thanks to the oscillation mechanism, where the rotating grinding wheel moves back and forth, it enables uniform deburring without unevenness. This prevents specific areas of the wheel from wearing out and maximizes the effective use of the grinding cloth, contributing to reduced running costs. The housing is made of a high-rigidity aluminum frame, which is resistant to rust and maintains aesthetics and precision even in harsh factory environments. Depending on the processing content and installation environment, both dry and wet options are available, allowing you to choose the most suitable tool from approximately 130 types of grinding tools. 【Features】 ■ Enables uniform deburring without unevenness ■ Reduces running costs through the long lifespan of consumables ■ Adopts a high-rigidity aluminum frame housing ■ Allows selection between belt transport and roller transport ■ Easy replacement of grinding wheels with a single tool ■ A rich lineup of approximately 130 types of grinding tools *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment

The "Baritak III-CT model" is the machine that can most fully realize the potential of over 130 types of grinding wheels. It adopts a system where each axis is driven completely independently, allowing for individual settings of rotation direction according to the appearance of burrs, such as rotating the first axis forward and the second axis in reverse relative to the workpiece's direction of advancement. By adjusting the height of each grinding wheel, it is possible to set them to positions that match the height of each workpiece. Even when mixing wheels with different rates of wear, it is possible to maintain consistently uniform quality by correcting the height of each. 【Features】 ■ Continuous processing that removes large burrs with the first axis and handles return burrs and surface finishing with the second axis is completed with a single machine. ■ The number of axes can be increased to accommodate the complexity of processing. ■ Equipped with independent lifting and positioning mechanisms for each axis. ■ Compatible with both dry and wet machines. *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce our "Metal Plate Automatic Cleaning Machine." It can be added as an "add-on" to existing production lines, and its depth is kept to just 860mm, allowing for installation in limited spaces. By synchronizing with the conveyors at both ends, it achieves automatic cleaning in-line. High-density brushes arranged vertically grip the workpiece and clean both sides simultaneously. This physically separates sludge and contaminants, achieving a high level of cleanliness. 【Features】 ■ Drying is possible without heating, maintaining transport speed through high-pressure air knife drying. ■ Equipped with a high-performance filtration system that filters and recycles the cleaning solution. ■ Compatible with plate thicknesses of 0.5 to 3.2mm (standard) and plate widths of 300/600/900mm. ■ With the optional plate thickness adjustment mechanism, it can accommodate thick plates up to 50mm. *For more details, please download the PDF or feel free to contact us.

• Other cleaning machines

The "Baritak WF Type" is a simultaneous double-sided grinding machine that significantly reduces processing time by handling both the top and bottom surfaces at the same time. It enables "one-pass continuous processing," completely eliminating the hassle of flipping the workpiece and the adjustment time during reloading. By processing both sides under the same conditions at once, it minimizes quality variations and dramatically shortens the total lead time. We offer two types: the II-CT-WF type with roller conveyance and the III-CT-WF type with belt conveyance. 【Features】 <II-CT-WF Type (Roller Conveyance)> ■ Strong in processing thin plates and wide workpieces ■ Capable of handling large workpieces up to 900mm in width ■ The replacement of consumable "tension rubber rolls" is extremely simplified, allowing for quick maintenance management <III-CT-WF Type (Belt Conveyance)> ■ A model specialized for magnetic components ■ Standardly accommodates plate thicknesses up to 6.0mm *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment

The "Baritack III-R type" is a grinding machine that employs a wet process, allowing for machining while using water or grinding fluids. The first axis is equipped with a grinding wheel that rapidly rotates and oscillates 10mm left and right, efficiently removing stubborn burrs generated from laser cutting or pressing. It prevents warping and discoloration of the workpiece due to friction heat, maintaining precision even for thin sheets and precision parts. By collecting dust in the liquid, it prevents the risk of dust explosions and keeps the factory clean. 【Features】 ■ Equipped with a rotary 4-axis buff unit on the second axis ■ The four cup-shaped buffs within the unit rotate independently in both clockwise and counterclockwise directions ■ The entire unit holding the four rotating buffs performs a larger planetary motion ■ The brushes approach various edges of the workpiece from multiple angles *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment

The "Baritack II-CT model" adopts a roller conveyance system that does not stop the line, making it the ideal machine for polishing thin workpieces. With reliable feeding achieved by the upper and lower rubber rolls, stable processing without misalignment is realized for both thin and thick plates. Additionally, it supports "bottom polishing," which allows the polishing wheel to be placed on the underside, eliminating the need to flip the workpiece after pressing. This significantly accelerates inline integration, connecting directly to the automated line without stopping the process from the press to the next stage. Furthermore, the opposing tension rubber rolls have a structure that allows for easy attachment and detachment, helping to reduce running costs. 【Features】 ■ Supports bottom polishing that eliminates the flipping process and connects directly to automated lines ■ Advanced roller conveyance that feeds without misalignment from thin to thick plates ■ Easy replacement of tension rubber rolls minimizes maintenance effort ■ Lineup of dry (CT) and wet (CT-W) options available for selection based on application *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment

The "Baritack PB Type" is a polishing machine that uses a flexible paper brush as a grinding tool. The flexible brush makes contact in a way that wraps around the edges of the workpiece, allowing for efficient "R chamfering" that smooths and rounds the edges while removing burrs simultaneously. Since the paper brush makes contact with a "surface" rather than a "point," it delivers reliable power. Being brush-shaped, it can uniformly polish even workpieces with slight irregularities or fine burrs left after laser cutting, following the shape of the workpiece. 【Features】 ■ Ideal for edge rounding processing (R chamfering) ■ Conformity to 3D shapes ■ By adhering to a simple internal structure suitable for paper brushes, it achieves cost performance while maintaining professional-grade rigidity ■ Enables appropriate management of consumable costs *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment

The "Baritak VC-600 model" is a grinding machine that achieves professional-grade grinding precision at a low price through a one-axis concentrated grinding system. Its compact body (approximately 1 meter deep) reduces the "space cost" in factories. As it is a dry-type model, there is no need for extensive water supply and drainage installation, and it can operate with just a power source and a dust collector. By streamlining its functions, the operation panel is extremely simple. Since complex settings are unnecessary, even new operators can master it quickly with just a short lecture. 【Features】 ■ High reliability and low cost achieved through a one-axis concentrated mechanism ■ Fewer drive components and consumable parts, minimizing running costs and replacement expenses ■ Space-saving design makes it easy to integrate into existing lines ■ Simple operability that is easy to understand, even for first-time users *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment