富士化学産業 List of Products and Services

Solve the problem of component drop due to chip component miniaturization! We achieve fine coating that overturns conventional wisdom. With 'Seal-glo Chip Adhesive', fine coatings such as 1005CR, which are difficult for other companies, can be applied smoothly without clogging the dispenser or mask openings! We have received numerous inquiries due to the trend of component size reduction. 【Benefits】 - No issues with 1005CR bond application (dispenser/printing) - Proven application for 0603CR bond (dispenser) - Confirmed discharge capability with a nozzle inner diameter of Φ0.075mm - Achieved low-temperature curing at 90℃ for 90 seconds - Stable and moderate height coating shape due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible Compared to other chip adhesives currently in use, 'Seal-glo Chip Adhesive' offers many cost advantages, and there are many cases where it results in VA/VE. We encourage you to consider Fuji Chemical Industry's 'Seal-glo Chip Adhesive' at this opportunity. *For details, please contact us or download the catalog.

The Seal-glo NE series adhesive for temporarily fixing chip components can cure in a short time of 90 seconds at 90°C, minimizing the burden on the components. We offer various grades that excel in high-speed dispensing and fine printing to meet your needs. ■ Features - No issues with applying 1005CR bond (dispensing/printing) - Proven application of 0603CR bond (dispensing) - Confirmed ability to dispense with a nozzle inner diameter of Φ0.075mm - Achieves low-temperature curing at 90°C/90 seconds - Stable application shape with moderate peak height due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible ■ Curing Conditions ○ Recommended curing conditions vary by series. Since curing temperatures differ depending on dispensing or printing, please contact us for details. ○ Depending on the size and arrangement of the components mounted on the substrate, the actual temperature applied to the adhesive may vary, so please seek the optimal curing conditions. For more details, please download the PDF or contact us.