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  2. Electronic Components and Semiconductors
  3. オルテコーポレーション 本社
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Electronic Components and Semiconductors
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オルテコーポレーション 本社

addressKyoto/Nakagyo-ku, Kyoto-shi/Stork Building, Sanjo Karasuma 510, 22 Kamizakamachi
phone075-746-6791
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last updated:Feb 10, 2020
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オルテコーポレーション Product Lineup

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Super hard die collet Super hard die collet
Stamping tool (transfer pin) Stamping tool (transfer pin)
Spark electrode for wire bonders Spark electrode for wire bonders
Epoxy dispensing nozzle Epoxy dispensing nozzle
Vacuum wand suction cup Vacuum wand suction cup
IC chip tray IC chip tray
Resin collet Resin collet
Exchangeable rubber collet Exchangeable rubber collet
Colette's case of improvement Colette's case of improvement
Stamping

Stamping tool (transfer pin)

Introducing the stamping tool (transfer pin).

Comprehensive Product Catalog of Consumable Parts for Semiconductor Manufacturing Equipment

As a supplier of consumable parts for semiconductor manufacturing equipment, we mainly handle various parts used in the later stages of the process.

Orte Corporation offers pickup collets optimized for each semiconductor manufacturing equipment, contributing to your company's productivity improvement. In the "Comprehensive Product Catalog," we introduce the products handled by Orte Corporation. [Contents] Various tools for semiconductor manufacturing equipment Spare parts for chip component mounting machines Spare parts for SMT surface mount machines IC chip trays Products from Pico Parts (Israel) Examples of manufacturing carbide machine parts Winding nozzles *For details, please check the PDF download. If you are unsure about how to choose a collet, looking for a custom collet, or do not understand the cause of carry-back errors, please feel free to consult with us.

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Stamping tool (transfer pin)

Compatible with a wide range of sizes! Orte Corporation's stamping tools.

The "Stamping Tool (Transfer Pin)" is a product of Ortec Corporation, which develops and manufactures consumable parts for semiconductor manufacturing equipment and pickup tools. The material used is SUS303, and the Pin Type is available in a die size range from 0.2mm to 1mm, while the Star Type ranges from 0.75mm to 5mm. 【Features】 ■ Material: SUS303 ■ Pin Type: Die size from 0.2mm to 1mm ■ Bar Type: Die size from 0.2mm to 1mm ■ Star Type: Die size from 0.75mm to 5mm ■ Grid Type: Die size from 1.5mm and above *For more details, please refer to the PDF document or feel free to contact us.

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We handle stamping tools (transfer pins). We also accommodate special shapes.

We can provide transfer pins for semiconductor manufacturing in various materials. We offer three standard shapes. We also accommodate special-shaped pins that are not standard.

In addition to standard patterns such as pin type, star type, and grid type, we can also manufacture in special shapes. We will provide advice on the optimal shape based on our extensive design experience for the applicable die size.

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Methods for optimizing semiconductor manufacturing processes using industrial equipment.

Increase the efficiency of semiconductor manufacturing by 60% compared to conventional methods! Optimize and extend the lifespan of consumable industrial equipment.

In the post-processing of semiconductor manufacturing, we provide optimal pickup tools and more based on years of design and improvement experience. A device just for you will be born.

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