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  2. Electronic Components and Semiconductors
  3. オルテコーポレーション 本社
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Electronic Components and Semiconductors
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オルテコーポレーション 本社

addressKyoto/Nakagyo-ku, Kyoto-shi/Stork Building, Sanjo Karasuma 510, 22 Kamizakamachi
phone075-746-6791
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last updated:Feb 10, 2020
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オルテコーポレーション List of Products and Services

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Super hard die collet Super hard die collet
Stamping tool (transfer pin) Stamping tool (transfer pin)
Spark electrode for wire bonders Spark electrode for wire bonders
Epoxy dispensing nozzle Epoxy dispensing nozzle
Vacuum wand suction cup Vacuum wand suction cup
IC chip tray IC chip tray
Resin collet Resin collet
Exchangeable rubber collet Exchangeable rubber collet
Colette's case of improvement Colette's case of improvement
Colette's

Colette's case of improvement

The pickup collet optimized for each semiconductor manufacturing device will contribute to your company's productivity improvement.

A must-see for those struggling with Colette! [User case studies available now]

Resolve dissatisfaction with Colette sizes! We also have a wide range of options available!

**Introducing User Feedback** This small component is not only crucial in directly influencing the quality and productivity of the products we manufacture, but it also has the potential to become a bottleneck in our customers' order capacity. We have been at the forefront of recognizing its importance in the industry. We are continuously studying to recommend the optimal collet for the increasingly diverse semiconductor chips and their production environments. Fortunately, we are now recognized as more than just a manufacturer and supplier; we have become acknowledged as specialists in the pickup process. Many semiconductor manufacturers and equipment manufacturers seek our advice during the startup of new product manufacturing lines and request solutions for various challenges that arise on-site. We are very grateful for this, as it is thanks to our customers, partners, employees, and their families. We aim to support the manufacturing sites from behind the scenes and want our customers to produce products that are competitive on a global scale. With this aspiration, we continue to pay attention to global trends and the latest products, making it our mission to deliver valuable items to our customers. *Please download the user feedback.*

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For those struggling with semiconductor chip carry-out defects: Improvement case study.

We will introduce a case study of improvements at a power semiconductor manufacturing company.

【Issue】 There have been frequent issues with the return of semiconductor chips in the diamond process, and we were looking for ways to reduce these return defects. 【Improvement Results】 We achieved a reduction in chip return defects, and specifically observed the following improvements: 1) Cost reduction due to the extended lifespan of the rubber nozzle 2) Unlike other companies' nozzles, we no longer needed to perform hardening before use 3) Reduction in hardening labor hours By discussing the product specifications with our customers and striving for prompt responses, we were able to demonstrate our technical capabilities regarding the surface condition of the rubber nozzle, which was also attractive. Customers appreciated that our products are competitively priced compared to others and have a longer lifespan. *For more details, please download the PDF or feel free to contact us.

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Proposal for custom size rubber collet.

Supports a minimum of 150μm on one side! We propose rubber collets in the desired size without the need to create new molds.

Orte Corporation offers productivity improvement proposals with pickup collets optimized for each semiconductor manufacturing device. 【No need for new mold production! Custom sizes starting from a minimum of 150μm on one side】 As industrial products become smaller, semiconductor chips are also increasingly required to be smaller. However, there have been instances of defects due to collet sizes not matching the chips. Traditionally, changing rubber collets required the production of new molds and associated costs. However, our unique technology allows us to produce rubber collets in the desired size at a low cost without the need for new mold production. *For more details, please download the PDF or feel free to contact us.

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[Case Study] How to reduce damage to pickups?

Improvement of damage defects such as microcracks! Leave it to us with our pickup tools.

We would like to introduce a case of defect improvement in the transfer process of sensor chips that we proposed. In the process of transferring indium phosphide and gallium arsenide sensor chips to the inspection stage, defects due to cracks and micro-cracks were occurring. Due to the fragility of the material, the challenge was to create a pickup collet that would minimize damage. When we replaced the conventional very hard carbide collet with a rubber collet, the occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. [Case Study] ■ Issues - Defects due to cracks and micro-cracks were occurring at a rate of 50%. - A damage-minimizing pickup collet was needed due to the fragility of the material. - The transport speed of the transfer device was set to the slowest speed, but no improvement was observed. ■ Proposal - Replaced the carbide collet with a rubber collet. - The occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. *For more details, please refer to the PDF document or feel free to contact us.

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Are you troubled by defects caused by cracks and microcracks?

[Case Study] We present a case where replacing traditional hard carbide collets with rubber collets resulted in zero occurrences of cracks and microcracks.

Orte Corporation is a company that handles consumable parts for semiconductor manufacturing equipment. We would like to introduce a case study on improving defects in the sensor chip transfer process that we proposed. ■Customer's Concerns - Defects due to cracks and micro-cracks are occurring at a rate of 50%. - Due to the fragility of the material, a pickup collet with minimal damage is needed. - The transfer device's transport speed was set to the slowest speed, but there was no improvement. ↓ ■Proposal "Replace the hard alloy collet with a rubber collet." As a result, the occurrence of cracks and micro-cracks was eliminated, and defects became "zero." *For more details, please refer to the PDF document or feel free to contact us.

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Proposal to achieve zero carry-out errors for chips.

Eliminate the carry-out of semiconductor chips and improve yield!

Orte Corporation offers productivity improvement proposals with pickup collets optimized for each semiconductor manufacturing equipment. 【Unique technology to achieve zero pickup errors】 Pickup errors are caused by the stickiness of rubber collets, leading some to seek alternatives using metal or resin (plastic) collets. However, using metal or resin collets can result in defects due to collet scratches, which may not yield the expected benefits. Therefore, our unique technology enables us to manufacture special rubber collets with low stickiness, effectively reducing pickup errors to nearly zero. *For more details, please download the PDF or feel free to contact us.

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Are you able to use "truly suitable parts" in semiconductor manufacturing equipment for the backend process?

Examples of solving issues in semiconductor manufacturing equipment, such as "chip scratches and cracks" and "chip carry-back problems during work," with "suitable parts" are presented.

This document is a collection of case studies addressing challenges in semiconductor manufacturing equipment proposed by Orte Corporation, Ltd. It introduces our specialty in consumable parts and presents numerous examples of issues frequently raised by users, such as chip damage, instability problems with dispensers and epoxy transfer, and cases related to torch electrodes for wire bonding. Our company offers a wide range of specifications with distinct features, even in cases where general-purpose parts recommended by equipment manufacturers may not suffice. ◆ We are currently offering a collection of case studies and a comprehensive catalog as a gift! You can view it via PDF download. 【Featured Cases (Excerpt)】 ■ Types of consumable parts ■ Causes and solutions for chip snagging scratches ■ Causes and solutions for cracking (microcracks) ■ Troubles and solutions due to dispenser clogging... ■ Causes and solutions for bonding errors (adhesion failures)... ■ Ultra-precise 3D printed model with a molding resolution of 2μm *For more details, please refer to the PDF document or feel free to contact us.

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Offering a variety of types of collets, guaranteed to excel in semiconductor manufacturing!

Our company offers collets that can accommodate various applications.

The following are our representative types of collets. Interchangeable Rubber Collets These are pickup tools that contribute to preventing scratches on devices and enhancing adhesion. We offer three types: NBR, FKM, and silicone rubber, each with different characteristics. Additionally, leveraging our design know-how, we can create custom designs tailored to your applications and objectives. Resin Collets These provide solutions for demands that cannot be met by metal or rubber collets. They allow for the machining of complex tip shapes and can accommodate devices with three-dimensional mounting. We also offer a service to reuse metal shanks and replace only the resin tip with a new one. Carbide/Metal Die Collets Carbide and other metal collets are used in scenarios that require strength, temperature resistance, and wear resistance. We can propose cost-cutting solutions from the design stage, such as combining a SUS body with a carbide tip. Collets Made from Other Materials In addition to rubber, resin, and metal, we can provide collets made from materials such as ceramics and porous materials. We also manufacture collets using cutting-edge processing methods and materials, such as 3D printed nozzles and next-generation resin materials.

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An innovative performance evaluation method to eliminate defects and damaged semiconductor chips.

Innovative semiconductor manufacturing technology that paves the way for the future! The ultimate performance evaluation methods and products that eliminate defects and flaws to zero.

Orte's collet helps improve chip defects. By selecting appropriate materials and designs based on chip quality, we achieve the complete elimination of carryover errors and scratches! Customizations and designs tailored to your manufacturing equipment are also available upon request.

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We design and produce a variety of colets from flat colets!

We will provide collets tailored to your manufacturing equipment by leveraging our design know-how in the semiconductor backend products of Orte.

Our company offers a wide range of collets, including flat collets, round-shaped collets, and collets with extremely pointed tips. The basic materials are as follows: - Carbide die collets - Resin collets - Rubber collets - Other collets

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Methods for optimizing semiconductor manufacturing processes using industrial equipment.

Increase the efficiency of semiconductor manufacturing by 60% compared to conventional methods! Optimize and extend the lifespan of consumable industrial equipment.

In the post-processing of semiconductor manufacturing, we provide optimal pickup tools and more based on years of design and improvement experience. A device just for you will be born.

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Highly visible semiconductor collet "White Electrostatic Discharge Prevention Rubber Collet"

A semiconductor collet with faster defect detection, higher visibility, and consideration for scratches on the chip.

Key Points for Improving Image Recognition Accuracy through Brightness Adjustment - White and gray tones can adapt to various environmental conditions - Improved accuracy of object detection and recognition in response to changes in environmental lighting conditions - Improved accuracy of object detection and recognition in response to changes in contrast - Overall improvement in image recognition accuracy is expected

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