オルテコーポレーション Product Lineup

Orte Corporation offers pickup collets optimized for each semiconductor manufacturing equipment, contributing to your company's productivity improvement. In the "Comprehensive Product Catalog," we introduce the products handled by Orte Corporation. [Contents] Various tools for semiconductor manufacturing equipment Spare parts for chip component mounting machines Spare parts for SMT surface mount machines IC chip trays Products from Pico Parts (Israel) Examples of manufacturing carbide machine parts Winding nozzles *For details, please check the PDF download. If you are unsure about how to choose a collet, looking for a custom collet, or do not understand the cause of carry-back errors, please feel free to consult with us.

It is recommended when using metal or resin pickup nozzles, as there is a risk of scratching the chip surface during die attachment. There is a wide variety of ultra-small sizes that are compatible with shrinking collets. They can be easily replaced on-site when used with the corresponding holder, and they are economical due to their low price. In recent years, there has been a shift from other materials. 【Features】 ■ Tip shapes: Three types - round, rectangular, square ■ Minimum sizes: Round OD=0.21mm ID=0.076mm Square L=0.152 W=0.152 ID=0.076 Rectangular L=0.15 W=0.38 ID=0.25 (Minimum hole diameter possible is 0.076mm) We also process holders for rubber tip attachments. *For more details, please refer to the PDF document or feel free to contact us.

Our company offers "rubber collets" that are less likely to cause semiconductor chip carry-out errors due to their low adhesion and are easy to replace. We have a wide range of standard sizes available and can also accommodate customizations according to your needs. Additionally, we strive for reasonable pricing. Currently, we are giving away product samples to 10 people through a lottery. If you are interested, please feel free to apply via the [Contact Form]. [Features] ■ Available in round, square, and rectangular tip shapes ■ We generally cover the mold costs for custom tip sizes ■ Made of rubber to avoid scratches on chip surfaces ■ Compliant with RoHS directives <Please consider adopting ORUTE as your partner!> (1) We have unique products with excellent functionality and extensive experience and track record. (2) We provide products that can address and solve your company's challenges. (3) We comply with regulations on chemical substances contained in products, such as RoHS. *For more details, please refer to the comprehensive catalog of our products available for download. *Our company will be exhibiting at the "1st Semiconductor Industry Exhibition" held at Marine Messe Fukuoka B Hall on September 25 (Wednesday) to 26 (Thursday).

We would like to introduce a case of defect improvement in the transfer process of sensor chips that we proposed. In the process of transferring indium phosphide and gallium arsenide sensor chips to the inspection stage, defects due to cracks and micro-cracks were occurring. Due to the fragility of the material, the challenge was to create a pickup collet that would minimize damage. When we replaced the conventional very hard carbide collet with a rubber collet, the occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. [Case Study] ■ Issues - Defects due to cracks and micro-cracks were occurring at a rate of 50%. - A damage-minimizing pickup collet was needed due to the fragility of the material. - The transport speed of the transfer device was set to the slowest speed, but no improvement was observed. ■ Proposal - Replaced the carbide collet with a rubber collet. - The occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. *For more details, please refer to the PDF document or feel free to contact us.

Orte Corporation is a company that handles consumable parts for semiconductor manufacturing equipment. We would like to introduce a case study on improving defects in the sensor chip transfer process that we proposed. ■Customer's Concerns - Defects due to cracks and micro-cracks are occurring at a rate of 50%. - Due to the fragility of the material, a pickup collet with minimal damage is needed. - The transfer device's transport speed was set to the slowest speed, but there was no improvement. ↓ ■Proposal "Replace the hard alloy collet with a rubber collet." As a result, the occurrence of cracks and micro-cracks was eliminated, and defects became "zero." *For more details, please refer to the PDF document or feel free to contact us.

"There are frequent errors with chip retrieval, but the cause is unknown." "I want to know how to increase the operating speed of the device and improve production efficiency." Is your company also struggling with such issues? The "rubber collet" handled by Orte Corporation will solve your problems. Please feel free to consult us. 【We can solve the following issues】 ■ I have an idea for a collet, but there are no manufacturers to produce it. ■ Is there a collet for MEMS? ■ I am looking for a collet with suction holes smaller than 0.1 millimeters. ■ There are many defects due to device damage, resulting in poor yield. ■ I am struggling with the pickup of solder balls and bump chips. ■ I cannot find a place that can make collets with special shapes. *For more details, please refer to the PDF document or feel free to contact us.

In semiconductor manufacturing lines, collets are used. It is recommended to replace the collet with a metal or resin pickup nozzle if there is a risk of scratching the chip surface during die attachment. We offer a wide variety of ultra-small sizes that accommodate shrinking collets. They can be used in conjunction with compatible holders, allowing for easy on-site replacement at a low cost, making them economical. In semiconductor manufacturing lines, it is said that the failure rate of chip movement with standard collets is about 60%. Our products focus on reducing the generation of static electricity when in contact with semiconductors and on the hardness of the materials. Customers who have adopted our products have significantly reduced their failure rate to 1.7%. As a result, we have received many requests for replacements from other materials in recent years. *For more details, please refer to the PDF document or feel free to contact us.*

The following are our representative types of collets. Interchangeable Rubber Collets These are pickup tools that contribute to preventing scratches on devices and enhancing adhesion. We offer three types: NBR, FKM, and silicone rubber, each with different characteristics. Additionally, leveraging our design know-how, we can create custom designs tailored to your applications and objectives. Resin Collets These provide solutions for demands that cannot be met by metal or rubber collets. They allow for the machining of complex tip shapes and can accommodate devices with three-dimensional mounting. We also offer a service to reuse metal shanks and replace only the resin tip with a new one. Carbide/Metal Die Collets Carbide and other metal collets are used in scenarios that require strength, temperature resistance, and wear resistance. We can propose cost-cutting solutions from the design stage, such as combining a SUS body with a carbide tip. Collets Made from Other Materials In addition to rubber, resin, and metal, we can provide collets made from materials such as ceramics and porous materials. We also manufacture collets using cutting-edge processing methods and materials, such as 3D printed nozzles and next-generation resin materials.

Orte's collet helps improve chip defects. By selecting appropriate materials and designs based on chip quality, we achieve the complete elimination of carryover errors and scratches! Customizations and designs tailored to your manufacturing equipment are also available upon request.

Our company offers a wide range of collets, including flat collets, round-shaped collets, and collets with extremely pointed tips. The basic materials are as follows: - Carbide die collets - Resin collets - Rubber collets - Other collets

In the post-processing of semiconductor manufacturing, we provide optimal pickup tools and more based on years of design and improvement experience. A device just for you will be born.

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The "Rubber Collet" is effective in preventing chip damage (ESD) caused by static electricity. It also supports stable production during chip transport in high-temperature environments without concerns about thermal degradation or adhesion. Its unique "low-adhesion treatment" suppresses adhesion to the chips, contributing to a reduction in chip carryover errors and improved production takt time. Additionally, we offer the "Magnetic Collet," which resolves void troubles and air leaks, and the "Zaguri Collet," which contributes to improving the quality and efficiency of production lines. 【Features】 ■ Static electricity prevention ■ Heat resistance ■ Low viscosity *For more details, please download the PDF or feel free to contact us.

Orte Corporation Co., Ltd. will be exhibiting at the Kyoto Business Exchange Fair held from February 18 (Wednesday) to 19 (Thursday), 2026. We invite you to have direct discussions with our experts regarding improvement measures in the semiconductor backend process, and take this opportunity to obtain the latest information on collets and tools related to the backend process. If you are interested in the latest industry trends and innovative solutions, please stop by our booth. We sincerely look forward to your visit. [Exhibition Contents] - Pickup collets (rubber/resin/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays) *Please refer to our related catalog for the products we handle.

In the semiconductor manufacturing industry, precise holding of wafers and chips is required. Chip damage due to static electricity, deterioration in high-temperature environments, and errors caused by adhesion are significant factors that reduce yield. In response to these challenges, "rubber collets" are effective as a countermeasure against electrostatic discharge (ESD). Chip transport in high-temperature areas also supports stable production without concerns about thermal degradation or adhesion. Our unique "low-adhesion treatment" suppresses adhesion to the chips, contributing to a reduction in chip carry-off errors and an improvement in production takt time. 【Usage Scenarios】 * Chip transport * Wafer pickup * Holding in high-temperature environments 【Effects of Implementation】 * Prevention of ESD issues * Increased productivity * Improvement in yield