OKIサーキットテクノロジー List of Products and Services

We would like to introduce our "100-layer Ultra High Multi-layer Printed Circuit Board Manufacturing Technology." Through high-precision lamination technology using ultra-thin materials, we have achieved high multi-layer printed circuit boards with over 100 layers, utilizing core materials of 30μm and prepreg of 20μm, resulting in a board thickness of 7.6mm for a 110-layer board. Additionally, our high-precision lamination technology allows us to accommodate narrow pitch specifications with a 0.5mm pitch. Please feel free to contact us if you have any inquiries. 【Features】 ■ Achieved a 110-layer board with a thickness of 7.6mm by using core materials of 30μm and prepreg of 20μm ■ Inner layer copper foil thickness can be 1/2oz (18μm) and in some cases, 1oz (35μm) can be used ■ Capable of accommodating narrow pitch specifications with a 0.5mm pitch due to high-precision lamination technology *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our "φ520mm - Large Printed Circuit Board Manufacturing Technology." We have achieved high multilayer printed circuit boards exceeding the 500mm size. Our high-precision lamination technology allows for narrow pitch specifications with a 0.5mm pitch. Main applications include semiconductor tester boards, load boards, probe cards, etc. Please feel free to contact us if you have any inquiries. 【Features】 ■ Maximum product size: 558×643mm ■ Maximum board thickness: 7.6mm (up to 96 layers with sequential structure possible) ■ High-precision lamination technology enables narrow pitch specifications with a 0.5mm pitch *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our "Multilayer Printed Circuit Board." It is possible to increase the number of layers according to the pin count of the mounted components (up to a maximum of 46 layers). The freedom of characteristic impedance wiring width has improved (interlayer thickness of 0.1mm or more is acceptable). We can propose specifications tailored to your applications, so please feel free to contact us with your requests. 【Features】 ■ It is possible to increase the number of layers according to the pin count of the mounted components (up to a maximum of 46 layers). ■ The freedom of characteristic impedance wiring width has improved (interlayer thickness of 0.1mm or more is acceptable). ■ The thickness of the inner layer copper foil can be increased for heat dissipation purposes. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our support for high-density build-up structures. High-density wiring has become possible, enhancing design flexibility. With LVH connections, high-speed wiring without via stubs is achievable. We support specifications such as narrow pitch compatibility and high-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching, and improved characteristics for high-frequency applications). 【Supported Specifications】 ■ Narrow pitch compatibility ■ High-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching & improved characteristics) ■ Thick copper foil specifications ■ Mixed IVH & LVH *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our "Inner Layer Resistance Printed Circuit Board." The copper foil with resistance has the function of resistance by exposing and forming a resistance film in part of the inner layer circuit. The base resistance film can be 25Ω, 50Ω, or 100Ω, and the set resistance value is determined by the conductor width and length formed from the required area (which can be calculated using a formula). 【Compatible Copper-Clad Laminates (Panasonic)】 ■R5775(R): Megtron6 R5775(K) + TCR foil ■R5775(S): Megtron6N R5775(N) + TCR foil ■R5785(R): Megtron7N R5785(N) + TCR foil *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our "Custom and Special Purpose Printed Circuit Boards." Based on high-speed, high-multilayer board manufacturing technology, we can meet various demands for rigid boards. We possess high-precision simulation technology, plating technology, lamination and drilling technology, and patterning technology. 【Features】 ■ High Speed ■ High Multilayer ■ High Density *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Our company solves issues related to high current, high voltage, and heat dissipation through a special structure. We are capable of conducting high current (up to 400A) tests and manufacturing metal (with AL2.5mm) products. Additionally, we propose multi-layer structures with conductor thicknesses of up to 500μm and suitable heat dissipation designs. We address concerns such as the labor-intensive assembly of busbars and issues caused by warping of printed circuit boards due to heat. [For such concerns] ■ I want to carry high current ■ The assembly of busbars is labor-intensive ■ Issues caused by warping of printed circuit boards due to heat ■ High heat density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We support the development of high-frequency substrates from materials, processes, and design. High-precision transmission line modeling correlated with in-house manufactured substrates. We can provide materials, treatments, and processes tailored to your applications. We offer printed circuit boards that balance performance and cost in a one-stop solution, so please feel free to contact us with your requests. 【Features】 ■ Manufacturing process compatible with high frequency - We propose suitable materials from the perspective of performance and cost - Improvement of characteristics through high-precision back drilling - 20% reduction in loss at 14GHz with changes to solder resist only ■ Support for chemically bonded surface treatments *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We support the resolution of various issues related to printed circuit boards. We provide one-stop solutions for printed circuit boards that balance performance and cost. Additionally, if you provide us with your required specifications, we can propose suitable board specifications and designs. We offer characteristic improvements utilizing our extensive background data and manufacturing technology unique to PCB manufacturers. 【For concerns like these】 ■ Waveforms that do not operate, distortion, non-compliance with standards ■ Not functioning under high load ■ Time-consuming cause investigation and countermeasures ■ Failing to meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce our "High Board Thickness and Narrow Pitch Printed Circuit Board Manufacturing Technology." Based on the FiTT method, we promote high-precision technology to achieve narrow pitch printed circuit boards in the realm of high multilayer and high board thickness. Main applications include semiconductor tester boards, load boards, socket boards, and probe cards. 【Features】 ■ High-precision FiTT method enables narrow pitch BGA compatible boards in high multilayer and high board thickness areas. ■ Supports 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing. ■ Supports 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our simulation case studies. In the case study titled "Provision of PCBs with Stable Operation for Various High-Speed Transmissions," we provide designs that operate from the perspective of design and manufacturing. This includes optimization of transmission line characteristics and verification of margins against standards. In the case study titled "Proposals for Countermeasures from Troubleshooting," we reproduced actual device malfunctions and clarified the mechanisms, demonstrating that DDR4 did not operate at the expected data rate through simulations that considered actual power and ground. [Case Overview: Provision of PCBs with Stable Operation for Various High-Speed Transmissions] ■ We provide designs that operate from the perspective of design and manufacturing. ■ Implementation details: - Optimization of transmission line characteristics: Impedance matching including vias and pads. - Verification of margins against standards: Selection and proposal of substrate and via structures. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

This document introduces the certification specifications for Annexes A, B, D, E, F, G, and H of the Japan Aerospace Exploration Agency (JAXA). It includes glass cloth substrate wiring boards, fine-pitch wiring boards, and flexible wiring boards. We provide detailed information on maximum layer counts, board thickness, conductor pressure, minimum drill diameters, and more, so please take a moment to read through it. 【Contents (partial)】 ■ Annex A: Glass cloth substrate wiring boards ■ Annex B: Fine-pitch wiring boards ■ Annex D: Flexible wiring boards ■ Annex E: Flex-rigid wiring boards ■ Annex F: Low thermal expansion wiring boards with CIC *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our support for high-speed and large-capacity transmission. We have developed products that are compatible with advanced high-speed transmission technologies for 5G/6G. We provide support for solving challenges related to the development of advanced high-frequency application substrates. Additionally, our "high-frequency printed circuit boards" can be tailored to meet your needs through the adoption of new high-frequency materials, joint evaluations, and the use of LP foils and low-dielectric glass materials. 【Features of High-Frequency Printed Circuit Boards】 ■ Proposals tailored to your needs ■ Surface treatment transmission LOSS evaluation ■ Analysis, evaluation, and deployment of finished products *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our support for flex-rigid structures. We can accommodate orders starting from just one piece, with a minimum turnaround time of 5 days from data receipt to shipment. This also helps reduce mold costs through router processing. Our connector-less design allows for compact and high-density solutions, making it ideal for reducing cable connection errors and wiring labor. 【Features】 ■ Miniaturization ■ High density ■ High reliability ■ Possible multilayer structure for flexible layers ■ Use of liquid crystal polymer materials for flexible layers *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board